Patent Application
20060048968
1. Field of the Invention
The present invention is related to a construction for DC to AC power inverter, which can increase current passing through the circuit board largely, lower fabrication cost and promote circuit efficiency.
2. Brief Description of Related Art
Due to technology progressing rapidly, various home electric appliances are brought forth the new through the old and the functions thereof are enhanced greatly. It is an important step that a circuit board is used to operate and control the home electric appliances respectively. Referring to
Accordingly, an object of the present invention is to provide a construction for DC to AC power inverter, which is capable of increasing the current passing through the circuit board largely.
Another object of the present invention is to provide a construction for DC to AC power inverter, which can lower cost and promote utilization efficiency largely.
A further object of the present invention is to provide a construction for DC to AC power inverter, which has a simple structure for being fabricated easily.
To reach the preceding object, the construction for DC to AC power inverter according to the present invention includes a circuit board and a conductive member. The conductive member provides a contour can be changed in accordance with the shape of the circuit board and the periphery thereof is joined with several inserting pins and the inserting pins are integrally made as a single piece. The circuit board where larger amount of current passes through is provided with holes corresponding to the inserting pins so that the conductive member can be adhesively attached to the soldered surface of the circuit board tightly via the holes by way of operation of tin soldering with the tin furnace. Hence, the conductive member can facially contact with the circuit board to enhance capability of the copper foil on the circuit board enduring the current from tens times to hundreds times and lower fabricating cost and promote utilization efficiency. Besides, obstruction of other electronic parts can be avoided so as to facilitate fabrication process and strengthen market competitive power.
The detail structure, the applied principle, the function and the effectiveness of the present invention can be more fully understood with reference to the following description and accompanying drawings, in which:
Referring to FIGS. 3 to 5, an inverter circuit board for DC to AC power according to the present invention basically includes at least a conductive member 2 and a circuit board 3. In order to match the circuit boards 3 in different shapes, the contour of the conductive member 2 can be suitably arranged for different situations. The conductive member 2 has several inserting pins 21 surrounding the periphery thereof and each of the inserting pins 21 extends outward an engaging end 211. The conductive member 2 and the inserting pins 21 are integrally made of copper. The circuit board 3 provides fitting holes 31 at areas being passed through with larger current and the holes correspond to the inserting pins 21 so that the inserting pins 21 can engage with the circuit board 3 by way of the engaging ends 211 passing through the fitting holes 31 and reaching the soldered surface 32. In the meantime, the inserting pins 21 of the conductive member 2 can expose at surfaces of electronic parts 33 to be fixedly attached to the soldered surface 32 by way of soldering treatment 34 with the tin furnace. In this way, the conductive member 2 can facially contact with the circuit board 3 and the copper foil on the circuit board 3 can endure much more current passing through the circuit board 3, the fabrication cost of the entire circuit board can be lowered largely and the utilization efficiency of circuit board can be enhanced greatly. In addition, obstruction of other electronic parts 35 can be avoided so as to facilitate the fabrication process and to increase market competitive power and practicality.
It is appreciated that the construction for DC to AC power inverter according to the present invention has the following advantages:
The conductive member is inserted to the soldered surface and is adhesively attached to the circuit board by way of tin soldering so that it can enhance circuit efficiency, reduce heat loss and lower skin-effect loss resulting from high frequency.
While the invention has been described with referencing to the preferred embodiments thereof, it is to be understood that modifications or variations may be easily made without departing from the spirit of this invention, which is defined by the appended claims.
