Using
As shown in
In an underside of the press member 10, a pusher (not shown) is formed to push the IC package 80. The press member 10 has preferably a heatsink 11 to dissipate heat, as shown in
The socket body 20 is formed of an electrically insulating synthetic resin, e.g. liquid-crystal polymer, or polyether sulphone, nearly in a rectangular form as viewed from above as shown in
An IC-package mounting recess 22, which includes a bottom surface 22a generally in a square form as viewed from above, is formed nearly centrally in the upper surface 21 of the socket body 20. In this embodiment, the IC-package mounting recess 22 has four side surfaces orthogonal to the upper surface 21 of the socket body 20 and the bottom surface 22a parallel with the upper surface 21 of the socket body 20. The bottom surface 22a configures a mounting surface of an IC package 80. At four corners of the socket body 20, attaching holes 38 are formed in a manner penetrating through the socket body 20, to pass the fixing means 90 when fixing the socket body 20, for example, onto the printed-wiring board 60.
In the bottom surface 22a of the IC-package mounting recess 22, contact-receiving chambers 25 are arranged in a matrix form to receive therein a plurality of contacts 40 correspondingly to the external contacts of the IC package 80. The contact-receiving chambers 25 are formed through the socket body 20, from the bottom surface 22a serving as an IC-package mounting surface to the bottom surface 23 of the socket body 20. The contact-receiving chambers 25 are preferably formed such that a sectional line III-III, i.e. a longitudinal axial line thereof, inclines nearly 45 degrees relative to the side surfaces of the IC-package mounting recess 22, as shown in
Using
In a lengthwise end of the contact-receiving chamber 25 (right end in
In the right side surface of the contact-receiving chamber 25 (on the side that the pair of fitting grooves 26, 26 are provided), an engagement groove 31 is formed along the line III-III. In the engagement groove 31, loosely fit is an engagement claw 42 of the contact 40, referred later (see
As shown in
The contact-receiving chambers 25, adjacent to each other in the direction of the axial line III-III, are communicated with each other through a communication groove 32 opening downward at below of the engagement groove 31. The communication groove 32 is not necessarily required.
The contact 40 is blanked as a plate member in a predetermined form, out of a conductive metallic thin plate, such as of beryllium copper (BeCu). By bending the plate member, it is formed in such a form as having two, upper and lower objects-to-contact as shown in
Referring to
The contact 40 has a first spring portion 43 and a first curvature 44 as a first contact point. The first spring portion 43 extends upper frontward from the upper end 41b of the support member 41, thus inclining relative to the support member 41 (extending obliquely upper forwardly relative to the support member 41). The first curvature 44 as the first contact point is formed convex upward at the tip of the first spring portion 43. The first spring portion 43 and the first contact point 44 have a width smaller than the width of the support member 41. The contact 40 has further a second spring portion 45 and a second curvature 46 as a first touch portion. The second spring portion 45 is bent lower rearward and extending from the first contact point 44 (extending obliquely lower rearwardly relative to the first contact point 44). The second curvature 46 as the first touch portion is formed convex downward at the tip of the second spring portion 45. The second spring portion 45 has a width nearly equal to that of the first spring portion 43 and bent nearly in a V-form relative to the first spring portion 43 with the first contact point 44 provided as an apex. Meanwhile, the first touch portion 46 is formed somewhat broader in width than the second spring portion 45.
The contact 40 also has a third spring portion 47 and a third curvature 48 as a second contact point. The third spring portion 47 extends lower frontward from the lower end 41a of the support member 41, thus inclining relative to the support member 41 (extending obliquely lower forwardly relative to the support member 41). The third curvature 48 as the second contact point is formed convex downward at the tip of the third spring portion 47. The third spring portion 47, including the second contact point 48, extends in contrast with the first spring portion 43 including the first contact point 44 with respect to the support member 41. Accordingly, the third spring portion 47 has a width equal to that of the first spring portion 43 and smaller than the width of the support member 41. The contact 40 has a fourth spring portion 49 and a flat portion 51 as a second touch portion. The fourth spring portion 49 is bent back upper rearwardly and extending from the first contact point 48 (extending obliquely upper rearwardly relative to the second contact point 48). The flat portion 51 as the second touch portion is formed flatly (horizontal in the embodiment) at the tip of the fourth spring portion 49. The fourth spring portion 49 also extends from the second contact point 48 in contract with the second spring portion 45 with respect to the support member 41, similarly to the third spring portion 47. Meanwhile, the fourth spring portion 49 is bent generally in a V-form relative to the third spring portion 47 with the second contact point 48 provided as a summit. Furthermore, the second touch portion 51 is formed in a width somewhat greater than the fourth spring portion 49 but equal to the first touch portion 46.
In this embodiment, the first touch portion 46 is formed convex downward while the second touch portion 51 is formed flat. Conversely, the first touch portion 46 may be formed flat while the second touch portion 51 is convex upward. In brief, the first and second contact portions 46, 51 are preferably structured not to prevent the second and forth spring portions 45, 49 from elastically deform. Meanwhile, as shown in
The both sides of the broad-width support member 41 of the contact 40 (portions projecting widthwise from the first and third spring portions 43, 47 formed in the upper and lower of the support member 41) is received in the pair of fitting grooves 26 of the socket body 20, thus being held nearly vertical relative to the socket body 20. When receiving the support member 41 in the fitting grooves 26, the engagement claw 42 is fit simultaneously in the engagement groove 31. In this manner, the contact 40 is held to be able to move vertically within the socket body 20 in the state as shown in
The contact 40 has a distance H2 between the first and second contact points 44, 48 (a height of the contact 40), that is greater than the height H1 of the contact-receiving chamber 25. Accordingly, when the contact 40 is received in the contact-receiving chamber 25 of the socket body 20, the first contact point 44 of the contact 40 projects above the mounting surface 22a of the socket body 20 while the second contact point 48 projects below the bottom surface 23 of the socket body 20, as clearly shown in
By providing the mounted IC package 80 with external terminals 81 at a smaller pitch, the contact-receiving chamber 25 is made long vertically, i.e. comparatively increased in height H1 relative to the depth S1 of the contact-receiving chamber 25 (see
The contact 40′ of this embodiment is generally identical in structure as compared to the contact 40 of the
The second spring portion, in this embodiment, includes a portion 45′a bent and extending lower rearwardly from a first contact point 44′ (extending obliquely lower downwardly relative to the first contact point 44′) and a portion 45′b bent and extending obliquely lower forwardly from the portion 45′a. Accordingly, the second spring portion of the contact 40′ is formed in a V-form directed horizontally, as shown in
By thus forming the contact 40′, the second and fourth spring portions are prevented from becoming less elastically deformable with a result that the contact can maintain high springiness.
Referring to
In this embodiment, in case the IC socket 1 is attached on the printed-wiring board 60, the third spring portion 47 of the contact 40 elastically deforms clockwise about a lower end 41a of the support member 41, as shown in
In this state, the IC package 80 is guided onto the mounting surface 22a of the socket body 20 so that the external contacts 81 of the IC package 80 are placed in contact with the first contact portions 44 of the corresponding contacts 40. Then, the IC package 80 is pushed down onto the mounting surface 22a through the press member 10. Due to this, the first spring portions 43 of the contacts 40 are first elastically deformed counterclockwise in
Then, the IC package 80 is pushed down into a state being abutted against the mounting surface 22a, as shown in
In this manner, when the IC package 80 is mounted perfectly on the mounting surface 22a of the socket body 20, the contact 40 exhibits well springiness through the elastic deformation of all the first to fourth spring portions 43, 45, 47, 49. Due to this, desired contact pressure is to be obtained in the electrical connections between the first contact point 44 of the contact 40 and the external contact 81 of the IC package 80 and between the second contact point 48 and the external contact of the printed-wiring board 60. On the other hand, because of forming a short signal line by a contact between the first touch portion 46 and the second touch portion 51 of the contact 40, the contact 40 of the invention is compatible with exchanging high-frequency signals.
A contact 140 in the embodiment is basically not different from the contact 40 of the first embodiment. Namely, the contact 140 in the embodiment is structurally different in respect of the following three points from the contact 40 of the first embodiment but generally the same in the other structural points.
(1) Upwardly convex ridge portions 144a, 151a are formed respectively as a first contact point and a second touch portion in a first curvature 144 and a flat portion 151 extending at the tip of a fourth spring portion 149.
(2) The first touch portion 146 is not formed curved, i.e. the first touch portion 146 is a tip of the second spring portion 145 extending obliquely lower rearwardly from the first curvature 144.
(3) The support 141 has an engagement claw 142 rising obliquely lower rearwardly.
By providing the above three different points in the contact 140 of this embodiment, the contact-receiving chamber 125 formed in the socket body 120 is different only in that it is formed nearly vertically inverted, thus being substantially the same in structure. Hence, the receiving chamber 125 of the socket body 120 and the contact 140 are omitted to explain. Incidentally, in the present embodiment, its constituent elements are denoted with those added 100 to the numbers used in the first embodiment.
The present embodiment, structured as above, has the following advantages over the first embodiment.
(i) By providing the above differences (1), (2) in this embodiment, contacting is electrically provided nearly as point contact at between the IC package mounted on the IC socket and the first contact point 144a and between the first touch portion 146 and the second touch portion 151a. By virtue of such point contact, electrically stably contacting is obtained without the intervention of an insulator, such as dust.
(ii) Meanwhile, by the above difference (3) and the socket-receiving chamber 125 structurally formed vertically inverted, the contact 140 can be inserted from below into the socket-receiving chamber 125 and assembled into an IC socket 120. This makes it easy to receive a multiplicity of contacts in the contact-receiving chamber of the IC socket.
In the present embodiment, the first contact point 144a and the second touch portion 151a were each formed as a ridge portion convexed upwardly in order to obtain point contact. However, this is not limitative. For example, a first touch portion 146′ continuing from the second spring portion 145 may be formed convexed downwardly as shown in
Meanwhile, as shown in
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
Number | Date | Country | Kind |
---|---|---|---|
2006-162427 | Jun 2006 | JP | national |
2007-138168 | May 2007 | JP | national |