Contact and method for making same

Information

  • Patent Grant
  • 7621756
  • Patent Number
    7,621,756
  • Date Filed
    Monday, October 29, 2007
    17 years ago
  • Date Issued
    Tuesday, November 24, 2009
    15 years ago
Abstract
A method for making a contact begins by providing a sheet of material. A portion of the sheet is deep drawn to form a cavity having at least one side wall, the cavity extending away from a rim formed by a non-drawn portion of the sheet. At least one spring member is defined from the at least one side wall and is bent such that at least a portion of the at least one spring member extends beyond the rim.
Description
CROSS REFERENCE TO RELATED APPLICATION(S)

This application claims the benefit of U.S. patent application Ser. No. 10/892,687, filed on Jul. 16, 2004, entitled “Contact and Method for Making Same”, which claims priority to U.S. Provisional Application No. 60/554,818, filed on Mar. 19, 2004, which are incorporated by reference as if fully set forth herein.


FIELD OF INVENTION

The present invention is related to electrical contacts. More particularly, the present invention is directed to an eyelet contact which is suitable for use with an interposer, a printed circuit board (PCB), or the like. The present invention also includes a method for making an eyelet contact.


BACKGROUND

There are currently many different types of connector technologies which produce a vast array of connectors for all different types of connector applications. However, current connector technologies are deficient in that they are made on a “macro-scale”, in which individual pieces of the connector are formed separately and are then integrated together in a final assembled contact. However, such schemes are cumbersome at best, and can result in a defective contact when the integration does not proceed as planned. Further, such schemes do not scale; as the pitch of contacts becomes smaller, the problems associated with current technologies greatly increase. Accordingly, a new technology which avoids the disadvantages with current technologies is desired.





BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1 is a plan view of a sheet of material for making a contact in accordance with the present invention.



FIG. 2 is a perspective view of the sheet of FIG. 1 which has been deep drawn to form contact having a lip and a body.



FIG. 3 is a perspective view of the contact of FIG. 2 with the bottom removed.



FIG. 4 is a perspective view of the contact and definition of the spring member.



FIG. 5 is a perspective view of the contact showing the spring member being bent above the rim of the body.



FIG. 6 is a perspective view of the contact showing the forming of the distal end of the spring member.



FIG. 7 is a perspective view of an array of contacts made in accordance with the teachings of the present invention.



FIG. 8 is a perspective view of an alternative embodiment of the present invention including a plurality of spring members.



FIG. 9 is a perspective view of an alternative embodiment of the present invention including additional openings.



FIG. 10 is a flow diagram of a method of forming a contact in accordance with the present invention.





DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention will be described with reference to the drawing figures wherein like numerals represent like elements throughout. The terms “down”, “up”, “bottom”, “side”, or “top” as used hereinafter are used only for convenience to differentiate certain aspects of the contact in the orientation shown in the figures. It should be understood that these terms are not meant to limit the functional aspects of the elements to which the terms apply.


The present invention provides an eyelet contact and a method for making the same. The present invention may be utilized with an interposer, on a printed circuit board (PCB), as part of another type of contact, incorporated directly into an electronic device, or may be utilized in a variety of other applications.


Referring to FIG. 1, a sheet 10 of material is shown, which is used to form a contact 8. Preferably, the sheet 10 is formed from a conductive and resilient material such as copper (Cu) or beryllium copper (BeCu), brass, phosphorus bronze, stainless steel, or other types of laminated or non-laminated material. Although the sheet 10 is shown as being configured in a generally circular shape having a certain thickness, those of skill in the art should realize that this is for convenience of explanation and the shape and/or thickness of the sheet 10 will vary depending upon the particular application and the desired physical characteristics of the contact. Such physical characteristics, for example, may include the impedance of the contact, the desired normal force to be applied by the contact, and the working range of the contact. Other characteristics may be related to a variety of plating schemes, or contact schemes such as multiple contact members for higher power application, contact geometry to cradle solder ball technology, or variable heights between contacts in the array for “make first-break last” applications.


Referring to FIG. 2, the sheet 10 has been deep drawn to form the contact 8 having a cavity, using a deep drawing process, leaving a lip 12 at the top of a deep drawn body 14. Deep drawing is a well-known process to those of skill in the metallurgical arts and, therefore, a detailed description of the process will not be set forth in detail hereinafter. Generally, however, deep drawing selectively stretches a sheet of material to form a desired three-dimensional shape. The cylindrical shape as shown in FIG. 2 and the subsequent figures is for example only and the shape may be any shape desired for the particular application. For example, the body 14 may be substantially rectilinear in shape, or may be drawn deeper or more shallow than shown.


The body 14 generally comprises one or more walls 16 and a bottom 18. Although the body 14 shown in the figures is substantially cylindrical and comprises a single continuous wall 16, if the body 14 is a cubic or other three-dimensional shape, there may be a plurality of side walls 16. Likewise, although a bottom 18 is shown, a deep drawing process may be used such that there is no bottom 18 to the body 14.


If the body 14 includes a bottom 18, the bottom 18 may optionally be removed as shown in FIG. 3. This step is preferably used when it is desired to have a contact 8 with an extended operating range. As such, removing the bottom 18 from the body 14 would have certain operational advantages, although this step is optional and is not required for the contact 8 to operate properly.


Referring to FIG. 4, two cuts are made in the wall 16 to form a spring member 20 and an opening 22. The spring member 20 is bent away from the wall 16 and then back upon itself and in a generally vertical position extending toward and/or through the top of the body 14 and above the lip 12 as shown in FIG. 5. Although the spring member 20 is shown as extending above the lip 12, this is not required. Accordingly, the spring member 20 may also extend upward toward the opening defined by the lip 12, but still be located below the lip 12.


Referring to FIG. 6, the distal end of the spring member 20 is then bent or otherwise formed in a desired configuration. The desired configuration shown in FIG. 6 is an arch. The distal end of the spring member 20 configured in an arch forms a compliant contact area 24 for mating with a corresponding contact of an electronic device or other device. The corresponding contact may be a generally flat land (such as found on a land grid array (LGA)), a pin, a solder ball (such as found on a ball grid array (BGA)), or any other type of contact system. Although the spring member 20 is shown as bending away from the middle of the contact 8, the spring member 20 may bend toward the center of the contact 8. Additionally, both the entire spring member 20 or the distal end of the spring member 20 may be formed as desired to achieve certain a configuration or specific physical characteristics.


For example, it is possible to form compound springs by having one spring member, when displaced some distance, hit a lower spring member and take advantage of the compound force that results when a first spring member contacts a second spring member, which results in different spring rates.


As a further example, an angular spring member configuration typically urges the point of contact more forcefully into a corresponding flat land, whereas a rounded arch will glide more easily over a land. These configurations each provide distinct wiping performances.


Due to its configuration, the contact 8 shown in FIG. 6 is able to accommodate a wide range of pin connector lengths since the bottom 18 has been removed. A long mating contact, such as a pin, may be inserted into the contact 8 without bottoming out. This provides the ability to mate with different configurations of contacts.


It should be noted that although FIGS. 1-6 were described with reference to forming a single contact, it is envisioned that an array of contacts will be simultaneously formed as shown in FIG. 7. The individual contacts may thereafter be singulated using either mechanical or other known techniques, such as photolithographic mask and etch technology.


Referring to FIG. 8, a contact 28 having two spring members 20a, 20b is shown. Although there is only one spring member 20 shown in FIG. 6 and two spring members 20a, 20b shown in FIG. 8, there may be more spring members as required by the particular application. The spring members 20a, 20b as configured in FIG. 8 include a large gap therebetween, although this is not required. The spring members 20a, 20b are configured with at least one contact area 24a, 24b respectively, as desired in order to properly mate with a corresponding contact.


Although the two spring members 20a, 20b are shown as being substantially similar in length, this is not required. As aforementioned, the particular length and shape of the spring members 20a, 20b may change depending upon the application. In addition, it is possible to have compound spring performance characteristics by having one spring member, for example 20a, with a higher profile and a second spring member 20b with a lower profile. Alternatively, it is possible to provide the contact areas 24a and 24b extending in the same direction, for example, with the first contact area 24a of the first spring member 20a extending over and spaced apart from the second contact area 24b of the second spring member 20b so that the first spring member 20a, when displaced a predetermined distance, hits the second spring member 20b and therefore provides a compound force that results when one spring member contacts another spring member. This provides a different spring rate.


Although not shown, further forming operations may split the spring members 20 into two or more contact areas 24. This would be particularly advantageous in an application where the multiple contact areas 24 can be specifically tailored to the configuration of the corresponding contact. For example, for a solder ball in a BGA, the distal ends may be configured to “cradle” the solder ball.


In an alternate embodiment as shown in FIG. 9, in addition to the opening 22 which is formed as part of making the spring members 20a, 20b, a contact 38 made in accordance with this embodiment of the invention includes additional openings 23 to give the body 14 greater pliancy. This is particularly beneficial in an application in which the contact 38 is inserted into a via (or through hole) in a PCB or other device. The extra pliancy provided by the additional openings 23 may permit the contact 38 to be friction-fitted to a PCB or device without requiring an additional bonding material.


Referring to FIG. 10, a method 200 for forming a contact in accordance with the present invention is shown. The method 200 begins with deep drawing a conductive material (step 202). The bottom of the body is then removed (step 204), although this step is optional. At least a portion of a side wall of the body is slit to form at least one spring member (step 206). The spring member is then bent backward upon itself such that the spring member extends toward, or over, the rim of the contact (step 208). The distal end of the spring member is then shaped as desired (step 210).


Although the present invention has been described in detail, it is to be understood that the invention is not limited thereto, and that various changes can be made therein without departing form the scope of the invention, which is defined by the attached claims.

Claims
  • 1. A method for making an electrical contact, comprising the steps of: providing a sheet of material;deep drawing a portion of the sheet of material to form a hollow tubular body having a first end, a second end and at least one linear side wall;forming a rim by a non-drawn portion of the sheet of material on either the first end or the second end, the rim extends perpendicularly from the at least one linear side wall, having a thickness which is less than the length of the hollow tubular body;defining at least one spring member from the at least one linear side wall; andbending the at least one spring member such that at least a portion of the at least one spring member extends beyond the end on which the rim is provided.
  • 2. The method of claim 1, further comprising shaping the portion of the at least one spring member to form a contact surface.
  • 3. The method of claim 1, further comprising shaping the portion of the at least one spring member to form an arched contact surface.
  • 4. The method of claim 1, further comprising shaping the portion of the at least one spring member to form an angular contact surface.
  • 5. The method of claim 1, further comprising the hollow tubular body having a bottom and removing at least a portion of the bottom of the hollow tubular body.
  • 6. A method for making an electrical contact, comprising the steps of: providing a sheet of material;deep drawing a portion of the sheet of material to form a hollow cylindrical body having a first end, a second end and at least one linear side wall;forming a rim by a non-drawn portion of the sheet of material on either the first end or the second end, the rim extends perpendicularly from the at least one linear side wall, having a thickness which is less than the length of the hollow cylindrical body;defining at least one spring member from the at least one linear side wall; andbending the at least one spring member such that at least a portion of the at least one spring member extends beyond the end on which the rim is provided to form a contact surface.
  • 7. A method for making an electrical contact, comprising the steps of: providing a sheet of material;deep drawing a portion of the sheet of material to form a hollow tubular body having a first end, a second end and at least two linear side walls;forming a rim by a non-drawn portion of the sheet of material on either the first end or the second end, the rim extends perpendicularly from the at least two linear side walls, having a thickness which is less than the length of the hollow tubular body;defining at least one spring member from at least one of the at least two linear side walls; andbending the at least one spring member such that at least a portion of the at least one spring member extends beyond the end on which the rim is provided to form a contact surface.
  • 8. A method for making an electrical contact, comprising the steps of: providing a sheet of material;deep drawing a portion of the sheet to form a hollow tubular body having a first end, a second end and at least two linear side walls;forming a rim by a non-drawn portion of the sheet of material on either the first end or the second end, the rim extends perpendicularly from the at least two linear side walls, having a thickness which is less than the length of the hollow tubular body;defining at least two spring members, each of the at least two spring members being formed from a corresponding one of the at least one of the at least two linear side walls; andbending each of the at least two spring members such that at least a portion of each of the at least two spring members extends beyond the end on which the rim is provided to form a contact surface.
US Referenced Citations (288)
Number Name Date Kind
3212049 Mittler et al. Oct 1965 A
3543587 Kawada Dec 1970 A
3634807 Grobe et al. Jan 1972 A
3670409 Reimer Jun 1972 A
4087146 Hudson, Jr. May 1978 A
4175810 Holt et al. Nov 1979 A
4548451 Benarr et al. Oct 1985 A
4592617 Seidler Jun 1986 A
4657336 Johnson et al. Apr 1987 A
4734053 Imai Mar 1988 A
4790777 Iimori et al. Dec 1988 A
4893172 Matsumoto et al. Jan 1990 A
4998885 Beaman Mar 1991 A
5053083 Sinton Oct 1991 A
5135403 Rinaldi Aug 1992 A
5148266 Khandros et al. Sep 1992 A
5152695 Grabbe et al. Oct 1992 A
5161983 Ohno et al. Nov 1992 A
5173055 Grabbe Dec 1992 A
5199879 Kohn et al. Apr 1993 A
5228861 Grabbe Jul 1993 A
5257950 Lenker et al. Nov 1993 A
5292558 Heller et al. Mar 1994 A
5299939 Walker et al. Apr 1994 A
5316496 Imai May 1994 A
5338209 Brooks et al. Aug 1994 A
5358411 Mroczkowski et al. Oct 1994 A
5366380 Reymond Nov 1994 A
5380210 Grabbe et al. Jan 1995 A
5423687 Laub Jun 1995 A
5468655 Greer Nov 1995 A
5483741 Akram et al. Jan 1996 A
5509814 Mosquera Apr 1996 A
5528456 Takahashi Jun 1996 A
5530288 Stone Jun 1996 A
5532612 Liang Jul 1996 A
5562487 Ii et al. Oct 1996 A
5575662 Yamamoto et al. Nov 1996 A
5590460 DiStefano et al. Jan 1997 A
5593903 Beckenbaugh et al. Jan 1997 A
5629837 Barabi et al. May 1997 A
5632631 Fjelstad et al. May 1997 A
5634821 Crane Jun 1997 A
5691913 Tsuchida et al. Nov 1997 A
5751556 Butler et al. May 1998 A
5772451 Dozier, II et al. Jun 1998 A
5791911 Fasano et al. Aug 1998 A
5802699 Fjelstad et al. Sep 1998 A
5812378 Fjelstad et al. Sep 1998 A
5842273 Schar Dec 1998 A
5860585 Rutledge et al. Jan 1999 A
5896038 Budnaitis et al. Apr 1999 A
5903059 Bertin et al. May 1999 A
5906498 Nagafuji May 1999 A
5911597 Oshitani Jun 1999 A
5934914 Fjelstad et al. Aug 1999 A
5938453 Ichimura Aug 1999 A
5956575 Bertin et al. Sep 1999 A
5967797 Maldonado Oct 1999 A
5967850 Crane Oct 1999 A
5980335 Barbieri et al. Nov 1999 A
5981870 Barcley et al. Nov 1999 A
5984704 Hashiguchi Nov 1999 A
5989994 Khoury et al. Nov 1999 A
5993247 Kidd Nov 1999 A
6000280 Miller et al. Dec 1999 A
6019611 McHugh et al. Feb 2000 A
6027366 Mori et al. Feb 2000 A
6029344 Khandros et al. Feb 2000 A
6031282 Jones et al. Feb 2000 A
6032356 Eldridge et al. Mar 2000 A
6042387 Jonaidi Mar 2000 A
6044548 Distefano et al. Apr 2000 A
6056572 Matsumoto et al. May 2000 A
6063640 Mizukoshi et al. May 2000 A
6072323 Hembree et al. Jun 2000 A
6083837 Millet Jul 2000 A
6084312 Lee Jul 2000 A
6089904 Wu Jul 2000 A
6133534 Fukutomi et al. Oct 2000 A
6142789 Nolan et al. Nov 2000 A
6146151 Li Nov 2000 A
6156484 Bassous et al. Dec 2000 A
6181144 Hembree et al. Jan 2001 B1
6184699 Smith et al. Feb 2001 B1
6191368 Di Stefano et al. Feb 2001 B1
6196852 Neumann et al. Mar 2001 B1
6200143 Haba et al. Mar 2001 B1
6203347 Crane Mar 2001 B1
6204065 Ochiai Mar 2001 B1
6205660 Fjelstad et al. Mar 2001 B1
6208157 Akram et al. Mar 2001 B1
6218848 Hembree et al. Apr 2001 B1
6220869 Grant et al. Apr 2001 B1
6221750 Fjelstad Apr 2001 B1
6224392 Fasano et al. May 2001 B1
6250933 Khoury et al. Jun 2001 B1
6255727 Khoury Jul 2001 B1
6255736 Kaneko Jul 2001 B1
6263566 Hembree et al. Jul 2001 B1
6264477 Smith et al. Jul 2001 B1
6293806 Yu Sep 2001 B1
6293808 Ochiai Sep 2001 B1
6297164 Khoury et al. Oct 2001 B1
6298552 Li Oct 2001 B1
6300782 Hembree et al. Oct 2001 B1
6306752 DiStefano et al. Oct 2001 B1
6315616 Hayashi Nov 2001 B1
6332801 Watanbe Dec 2001 B1
6335210 Farooq et al. Jan 2002 B1
6336269 Eldridge et al. Jan 2002 B1
6337575 Akram Jan 2002 B1
6345987 Mori et al. Feb 2002 B1
6352436 Howard Mar 2002 B1
6361328 Gosselin Mar 2002 B1
6373267 Hiroi Apr 2002 B1
6374487 Haba et al. Apr 2002 B1
6375474 Harper, Jr. et al. Apr 2002 B1
6384475 Beroz et al. May 2002 B1
6392524 Biegelsen et al. May 2002 B1
6392534 Flick May 2002 B1
6397460 Hembree Jun 2002 B1
6399900 Khoury et al. Jun 2002 B1
6402526 Schreiber et al. Jun 2002 B1
6409521 Rathburn Jun 2002 B1
6420661 Di Stefano et al. Jul 2002 B1
6420789 Tay et al. Jul 2002 B1
6420884 Khoury et al. Jul 2002 B1
6428328 Haba et al. Aug 2002 B2
6431881 Engbring et al. Aug 2002 B1
6436802 Khoury Aug 2002 B1
6437591 Farnworth et al. Aug 2002 B1
6442039 Schreiber Aug 2002 B1
6447305 Roberts Sep 2002 B1
6452407 Khoury et al. Sep 2002 B2
6454573 Hayashi et al. Sep 2002 B2
6461892 Beroz Oct 2002 B2
6465748 Yamanashi et al. Oct 2002 B2
6472890 Khoury et al. Oct 2002 B2
6474997 Ochiai Nov 2002 B1
6492251 Haba et al. Dec 2002 B1
6497581 Slocum et al. Dec 2002 B2
6517362 Hirai et al. Feb 2003 B2
6520778 Eldridge et al. Feb 2003 B1
6524115 Gates et al. Feb 2003 B1
6551112 Li et al. Apr 2003 B1
6558187 Aoki May 2003 B2
6576485 Zhou et al. Jun 2003 B2
6577003 Crane et al. Jun 2003 B1
6604950 Maldonado et al. Aug 2003 B2
6612861 Khoury et al. Sep 2003 B2
6616966 Mathieu et al. Sep 2003 B2
6622380 Grigg Sep 2003 B1
6627092 Clements et al. Sep 2003 B2
6640432 Mathieu et al. Nov 2003 B1
6661247 Maruyama et al. Dec 2003 B2
6663399 Ali et al. Dec 2003 B2
6664131 Jackson Dec 2003 B2
6669489 Dozier, II et al. Dec 2003 B1
6671947 Bohr Jan 2004 B2
6672879 Neidich et al. Jan 2004 B2
6677245 Zhou et al. Jan 2004 B2
6692263 Villain et al. Feb 2004 B2
6692265 Kung et al. Feb 2004 B2
6700072 Distefano et al. Mar 2004 B2
6701612 Khandros et al. Mar 2004 B2
6719569 Ochiai Apr 2004 B2
6730134 Neidich May 2004 B2
6733326 Lee May 2004 B2
6736664 Ueda et al. May 2004 B2
6736665 Zhou et al. May 2004 B2
6749459 Urbaniak et al. Jun 2004 B2
6750136 Zhou et al. Jun 2004 B2
6750551 Frutschy et al. Jun 2004 B1
6763581 Hirai et al. Jul 2004 B2
6791171 Mok et al. Sep 2004 B2
6814584 Zaderej Nov 2004 B2
6814587 Ma Nov 2004 B2
6815961 Mok et al. Nov 2004 B2
6821129 Tsuchiya Nov 2004 B2
6843659 Liao et al. Jan 2005 B2
6847101 Fjelstad et al. Jan 2005 B2
6848173 Fjelstad et al. Feb 2005 B2
6848929 Ma Feb 2005 B2
6853210 Farnworth et al. Feb 2005 B1
6857880 Ohtsuki et al. Feb 2005 B2
6869290 Brown et al. Mar 2005 B2
6869307 Endo Mar 2005 B2
6881070 Chiang Apr 2005 B2
6887085 Hirai May 2005 B2
6898580 Curran et al. May 2005 B1
6898773 Teig et al. May 2005 B1
6902425 Huang Jun 2005 B2
6916181 Brown et al. Jul 2005 B2
6920689 Khandros et al. Jul 2005 B2
6923656 Novotny et al. Aug 2005 B2
6926536 Ochiai Aug 2005 B2
6939143 Rathburn Sep 2005 B2
6957963 Rathburn Oct 2005 B2
6960924 Akram Nov 2005 B2
6976888 Shirai et al. Dec 2005 B2
6980017 Farnworth et al. Dec 2005 B1
6995557 Goldfine et al. Feb 2006 B2
6995577 Farnworth et al. Feb 2006 B2
7001208 Huang Feb 2006 B2
7002362 Farnworth et al. Feb 2006 B2
7004775 Sakurai et al. Feb 2006 B1
7009413 Alghouli Mar 2006 B1
7021941 Chuang et al. Apr 2006 B1
7021970 Ozai Apr 2006 B2
7025601 Dittmann Apr 2006 B2
D521455 Radza May 2006 S
D521940 Radza May 2006 S
7048548 Mathieu et al. May 2006 B2
7053482 Cho May 2006 B2
D522461 Radza Jun 2006 S
D522972 Long et al. Jun 2006 S
7056131 Williams Jun 2006 B1
7063560 Asao Jun 2006 B2
D524756 Radza Jul 2006 S
7070419 Brown et al. Jul 2006 B2
7074074 Zhang et al. Jul 2006 B2
7083425 Chong et al. Aug 2006 B2
7086869 Dangler et al. Aug 2006 B1
7090503 Dittmann Aug 2006 B2
7097496 Zhang et al. Aug 2006 B2
7112089 Liu et al. Sep 2006 B1
7113408 Brown et al. Sep 2006 B2
7114961 Williams Oct 2006 B2
7140883 Khandros et al. Nov 2006 B2
7189090 Aizawa et al. Mar 2007 B2
7210942 Uchida et al. May 2007 B2
7238044 Uchida et al. Jul 2007 B2
7244125 Brown et al. Jul 2007 B2
7252540 Tanaka Aug 2007 B2
7261569 Uchida et al. Aug 2007 B2
7261595 Shino Aug 2007 B2
7263771 Ochiai Sep 2007 B2
7285015 Helbok et al. Oct 2007 B2
7347698 Dittmann Mar 2008 B2
20010001080 Eldridge et al. May 2001 A1
20010024890 Maruyama et al. Sep 2001 A1
20020006744 Tashiro Jan 2002 A1
20020008966 Fjelstad et al. Jan 2002 A1
20020011859 Smith et al. Jan 2002 A1
20020055282 Eldridge et al. May 2002 A1
20020055289 Murakami et al. May 2002 A1
20020058356 Oya May 2002 A1
20020079120 Eskildsen et al. Jun 2002 A1
20020117330 Eldridge et al. Aug 2002 A1
20020129866 Czebatul et al. Sep 2002 A1
20020129894 Liu et al. Sep 2002 A1
20020133941 Akram et al. Sep 2002 A1
20020146919 Cohn Oct 2002 A1
20020178331 Beardsley et al. Nov 2002 A1
20030000739 Frutschy et al. Jan 2003 A1
20030003779 Rathburn Jan 2003 A1
20030022503 Clements et al. Jan 2003 A1
20030035277 Saputro et al. Feb 2003 A1
20030049951 Eldridge et al. Mar 2003 A1
20030064635 Ochiai Apr 2003 A1
20030089936 McCormack et al. May 2003 A1
20030092293 Ohtsuki et al. May 2003 A1
20030096512 Cornell May 2003 A1
20030099097 Mok et al. May 2003 A1
20030129866 Romano et al. Jul 2003 A1
20030147197 Uriu et al. Aug 2003 A1
20030194832 Lopata et al. Oct 2003 A1
20040029411 Rathburn Feb 2004 A1
20040033717 Peng Feb 2004 A1
20040072467 Jordan et al. Apr 2004 A1
20040118603 Chambers Jun 2004 A1
20040127073 Ochiai Jul 2004 A1
20050088193 Haga Apr 2005 A1
20050142900 Boggs et al. Jun 2005 A1
20050167816 Khandros et al. Aug 2005 A1
20050208788 Dittmann Sep 2005 A1
20050287828 Stone et al. Dec 2005 A1
20060028222 Farnworth et al. Feb 2006 A1
20070054544 Hirata Mar 2007 A1
20070054545 Takahira Mar 2007 A1
20070105433 Shioda et al. May 2007 A1
20070123074 Nishimura May 2007 A1
20070178751 Yamamoto Aug 2007 A1
20070275579 Si et al. Nov 2007 A1
20080045076 Dittmann et al. Feb 2008 A1
20080050958 Hashiguchi et al. Feb 2008 A1
20080076282 Yamaji et al. Mar 2008 A1
Foreign Referenced Citations (14)
Number Date Country
1280241 Jan 2003 EP
0692823 Feb 2003 EP
1005086 Sep 2003 EP
0839321 Jan 2006 EP
0839321 Jan 2006 EP
2000-114433 Apr 2000 JP
2001-203435 Jul 2001 JP
WO-9602068 Jan 1996 WO
WO-9743653 Nov 1997 WO
WO-9744859 Nov 1997 WO
WO-0213253 Feb 2002 WO
WO-2005034296 Apr 2005 WO
WO-2005036940 Apr 2005 WO
WO-2005067361 Jul 2005 WO
Related Publications (1)
Number Date Country
20090193654 A1 Aug 2009 US