This application claims the benefit of U.S. patent application Ser. No. 10/892,687, filed on Jul. 16, 2004, entitled “Contact and Method for Making Same”, which claims priority to U.S. Provisional Application No. 60/554,818, filed on Mar. 19, 2004, which are incorporated by reference as if fully set forth herein.
The present invention is related to electrical contacts. More particularly, the present invention is directed to an eyelet contact which is suitable for use with an interposer, a printed circuit board (PCB), or the like. The present invention also includes a method for making an eyelet contact.
There are currently many different types of connector technologies which produce a vast array of connectors for all different types of connector applications. However, current connector technologies are deficient in that they are made on a “macro-scale”, in which individual pieces of the connector are formed separately and are then integrated together in a final assembled contact. However, such schemes are cumbersome at best, and can result in a defective contact when the integration does not proceed as planned. Further, such schemes do not scale; as the pitch of contacts becomes smaller, the problems associated with current technologies greatly increase. Accordingly, a new technology which avoids the disadvantages with current technologies is desired.
The present invention will be described with reference to the drawing figures wherein like numerals represent like elements throughout. The terms “down”, “up”, “bottom”, “side”, or “top” as used hereinafter are used only for convenience to differentiate certain aspects of the contact in the orientation shown in the figures. It should be understood that these terms are not meant to limit the functional aspects of the elements to which the terms apply.
The present invention provides an eyelet contact and a method for making the same. The present invention may be utilized with an interposer, on a printed circuit board (PCB), as part of another type of contact, incorporated directly into an electronic device, or may be utilized in a variety of other applications.
Referring to
Referring to
The body 14 generally comprises one or more walls 16 and a bottom 18. Although the body 14 shown in the figures is substantially cylindrical and comprises a single continuous wall 16, if the body 14 is a cubic or other three-dimensional shape, there may be a plurality of side walls 16. Likewise, although a bottom 18 is shown, a deep drawing process may be used such that there is no bottom 18 to the body 14.
If the body 14 includes a bottom 18, the bottom 18 may optionally be removed as shown in
Referring to
Referring to
For example, it is possible to form compound springs by having one spring member, when displaced some distance, hit a lower spring member and take advantage of the compound force that results when a first spring member contacts a second spring member, which results in different spring rates.
As a further example, an angular spring member configuration typically urges the point of contact more forcefully into a corresponding flat land, whereas a rounded arch will glide more easily over a land. These configurations each provide distinct wiping performances.
Due to its configuration, the contact 8 shown in
It should be noted that although
Referring to
Although the two spring members 20a, 20b are shown as being substantially similar in length, this is not required. As aforementioned, the particular length and shape of the spring members 20a, 20b may change depending upon the application. In addition, it is possible to have compound spring performance characteristics by having one spring member, for example 20a, with a higher profile and a second spring member 20b with a lower profile. Alternatively, it is possible to provide the contact areas 24a and 24b extending in the same direction, for example, with the first contact area 24a of the first spring member 20a extending over and spaced apart from the second contact area 24b of the second spring member 20b so that the first spring member 20a, when displaced a predetermined distance, hits the second spring member 20b and therefore provides a compound force that results when one spring member contacts another spring member. This provides a different spring rate.
Although not shown, further forming operations may split the spring members 20 into two or more contact areas 24. This would be particularly advantageous in an application where the multiple contact areas 24 can be specifically tailored to the configuration of the corresponding contact. For example, for a solder ball in a BGA, the distal ends may be configured to “cradle” the solder ball.
In an alternate embodiment as shown in
Referring to
Although the present invention has been described in detail, it is to be understood that the invention is not limited thereto, and that various changes can be made therein without departing form the scope of the invention, which is defined by the attached claims.
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