A wide variety of electrical contacts for electronics modules are known. Some contacts are designed especially for removal and insertion under power (RIUP) applications where a circuit board or other electronic device or component is installed in or removed from a backplane or other circuit while the backplane circuit is actively transmitting data (and also usually an operating voltage). Ideally, data continuity is maintained perfectly in the backplane circuit during the insertion and/or removal process. In practice, known contact devices/methods for such backplane circuits often result in data loss during RIUP operations. This data loss or corruption is often due to an intermittent open condition of the contacts during the component removal operation caused by the contacts not closing quickly enough upon removal of the component or by contact bounce after the initial contact closing process. Attempts have been made to overcome this problem by increasing the preload of the contacts, but this is often not sufficient to solve the problem and can lead to other problems such as excessive contact force which makes component insertion removal more difficult and which causes excessive wear on the mating contacts of the circuit board or other component that is repeatedly inserted into and removed from the backplane circuit.
In accordance with one aspect of the present development, a contact device includes first and second contact portions, each of which includes a base and first and second spaced-apart contact arms projecting outwardly from the base. Each of the first and second contact arms includes an inner end connected to the base and an outer end spaced from the base. The first and second contact portions are located relative to each other such that when the contact device is in a first operative condition, the outer ends of the respective first contact arms of the first and second contact portions abut each other and define a first electrical conduction path and the outer ends of the respective second contact arms of the first and second contact portions are spaced from each other and define an open contact insertion slot there between. The contact device is selectively movable to a second operative condition when an associated removable device is inserted in the contact insertion slot such that the outer ends of the respective first contact arms of the first and second contact portions are spaced apart from each other and separated by the associated removable device and the outer ends of the respective second contact arms of the first and second contact portions are electrically connected to each other through the associated removable device so that a second electrical conduction path is defined by the respective second contact arms.
In accordance with another aspect of the present development, a contact method for an electronic device includes electrically connecting a first electrical component to a second electrical component through a first electrical conduction path of a contact device. A removable electronic device is engaged with the contact device such that a second electrical conduction path is established between the first electrical component and the second electrical component in parallel with the first electrical conduction path. After the second electrical conduction path is established, the first electrical conduction path is interrupted.
The contact method can further include disengaging the removable electronic device from the contact device after the first electrical conduction path is interrupted. This disengaging step includes moving the removable electronic device so that the pair of first contact arms engage each other to reestablish the first electrical conduction path and, after the first electrical conduction path is reestablished, separating the removable electronic device from the contact device to interrupt the second electrical conduction path.
In accordance with another aspect of the present development, a backplane includes a first electrical location, a second electrical location, and a contact device. The contact device includes a pair of first resilient contact arms that extend into an open slot between the first electrical location and the second electrical location, and also includes a pair of second resilient contact arms that extend into the open slot between the first electrical location and the second electrical location. The contact device is configured in a first operative condition when the open slot of said backplane is empty and is configured in a second operative condition when an associated removable electrical device is installed in the open slot of said backplane. The first operative condition of the contact device is defined by the second contact arms being spaced apart from each other and the first contact arms being abutted with each other to establish a first electrical conduction path between the first and second electrical locations through the first contact arms. The second operative condition of the contact device is defined by the first contact arms being spaced apart from each other and the second contact arms being abutted with respective component contacts of the associated removable electrical device to establish a second electrical conduction path between the first and second electrical locations through the pair of second resilient contact arms.
The contact device 10 includes a first contact portion 10A located on a first side of a backplane insertion slot SL1 and electrically connected to the first electrical component/location E1, and a second contact portion 10B located on a second side of the backplane insertion slot SL1 and electrically connected to the second electrical component/location E2. The first and second contact portions 10A and 10B are preferably defined as mirror image structures relative to each other as shown herein, but they need not be.
The contact device 10 is shown separately in
When the contact device 10 is installed on a backplane or in another location, the respective bases 12 of the first and second contact portions 10A,10B are connected to the opposite first and second sides of the backplane insertion slot SL1, and the respective first and second contact arms 14,16 extend into the backplane insertion slot SL1.
Referring also to
Those of ordinary skill in the art will recognize that the contact device 10 provides the first electrical conduction path P1 when the contact device is in its first operative condition (
With reference to
The contact device 10 enables a contact method wherein the first electrical component/location E1 of the backplane B is electrically connected to the second electrical component/location E2 of the backplane B through the first electrical conduction path P1. The removable electronic device C is then engaged with the contact device 10 such that the second electrical conduction path P2 is established between said first electrical component/location E1 and the second electrical component/location E2 in parallel with the first electrical conduction path P1 by electrical connection of the second contact arms 16 with the respective component contacts CC1,CC2 of the removable electronic device C. After the second electrical conduction path P2 is established, the first electrical conduction path P1 is interrupted by further insertion of the removable electronic device C into the slots SL1,SL2 such that the first contact arms 14 are separated from each other. The method further includes disengaging the removable electronic device C from the contact device 10. This disengaging step includes moving the removable electronic device so that the pair of first contact arms 14 engage each other to reestablish the first electrical conduction path P1 and, after that, separating the removable electronic device C from the contact device 10 to interrupt the second electrical conduction path P2.
The backplane B comprising the contact device 10 thus enables RIUP operations for the removable device C. The pair of first resilient contact arms 14 extend into the open slot SL1 between the first electrical component/location E1 and the second electrical component/location E2. The pair of second resilient contact arms 16 also that extend into the open slot SL1. The contact device 10 is configured in a first operative condition when the open slot SL1 of said backplane B is empty and is configured in a second operative condition when the removable electrical device C is installed in the open slot SL1 of said backplane B. The first operative condition of the contact device 10 is defined by the pair of second contact arms being spaced apart from each other and the pair of first resilient contact arms being abutted with each other to establish the first electrical conduction path P1. The second operative condition of the contact device 10 is defined by the pair of first contact arms 14 spaced apart from each other and the pair of second resilient contact arms 16 in contact with the respective component contacts CC1,CC2 of the removable electrical device C to establish the second electrical conduction path P2.
As shown in the
The first contact portion 10A′ includes a first base portion 12A1′ from which extends the first contact arm 14′ and includes a second base portion 12A2′ from which the second contact arm 16′ extends. The first and second base portions 12A1′,12A2′ are electrically connected to the first electrical component/location E1 and are optionally physically connected to each other as a one-piece construction and/or by a bridge element BRA that is electrically conductive or not. For example, the first contact portion 10A′, including the first and second base portions 12A1′,12A2′ and the contact arms 14′,16′ can be a one-piece construction defined from a suitable electrically conductive metal or the first and second base portions 12A1′,12A2′ can be separate structures connected by soldering or the like to define the bridge element BRA. The first and second contact arms 14′,16′ of the first contact portion 10A′ are arranged in a stacked configuration so that the second contact arm 16′ is spaced above or outward from the first contact arm 14′ relative to the insertion and removal axis X along with the circuit board C is inserted in the insertion direction I and removed in the removal direction R.
The second contact portion 10B′ is arranged as a mirror image of the first contact portion 10A′. As such, the second contact portion 10B′ includes a first base portion 12B1′ from which extends the first contact arm 14′ and includes a second base portion 12B2′ from which the second contact arm 16′ extends. The first and second base portions 12B1′,12B2′ are electrically connected to the second electrical component/location E2 and are optionally physically connected to each other as a one-piece construction and/or by a bridge element BRB that is electrically conductive or not. For example, the second contact portion 10B′ including the first and second base portions 12B1′,12B2′ and the contact arms 14′,16′, can be a one-piece construction defined from a suitable electrically conductive metal or the first and second base portions 12B1′,12B2′ thereof can be separate structures connected by soldering or the like to define the bridge element BRB. The first and second contact arms 14′,16′ of the second contact portion 10B′ are arranged in a stacked configuration so that the second contact arm 16′ is spaced above or outward from the first contact arm 14′ relative to the insertion and removal axis X along with the circuit board C is inserted in the insertion direction I and removed in the removal direction R.
Those of ordinary skill in the art will recognize that the circuit board or other removable electronic device C being inserted in direction I will first make the connection with both second contact arms 16′ to establish the path P2 before the circuit board C is inserted sufficiently to spread the first contact arms 14′ apart from each other to break the connection path P1. Conversely, upon removal of the circuit board C in the opposite direction R, the first contact arms 14′ will resiliently move into contact with each other to reestablish the path P1 before the circuit board C is electrically disconnected from the second contact arms 16′ to break the path P2. Another issue faced in RIUP applications is that the removal or insertion of a communications or other module including the circuit board or other electronic device C can occur asynchronously. The circuit board or other electronic device C may be in the process of communicating with or through one of the electrical devices/locations E1,E2 of the backplane through one or more of the connection paths P1,P2 that are about to be broken. This is especially a problem in make-before-break type topologies. To overcome these issues, an alternative embodiment of the contact device 10″ as shown in
In particular,
The development has been described with reference to preferred embodiments. Those of ordinary skill in the art will recognize that modifications and alterations to the preferred embodiments are possible. The disclosed preferred embodiments are not intended to limit the scope of the following claims, which are to be construed as broadly as possible, whether literally or according to the doctrine of equivalents.
Number | Name | Date | Kind |
---|---|---|---|
2154301 | Clement | Apr 1939 | A |
4087151 | Robert et al. | May 1978 | A |
4106841 | Vladic | Aug 1978 | A |
4514030 | Triner et al. | Apr 1985 | A |
4863394 | Henshaw, Jr. | Sep 1989 | A |
4872851 | Babuka et al. | Oct 1989 | A |
4999787 | McNally et al. | Mar 1991 | A |
5239748 | Hamilton | Aug 1993 | A |
5286215 | Dewey et al. | Feb 1994 | A |
5336094 | Johnson | Aug 1994 | A |
5584030 | Husak et al. | Dec 1996 | A |
6027379 | Hohorst | Feb 2000 | A |
6171138 | Lefebvre et al. | Jan 2001 | B1 |
6447309 | Ko et al. | Sep 2002 | B1 |
6764345 | Duesterhoeft et al. | Jul 2004 | B1 |
6860766 | Aujla et al. | Mar 2005 | B2 |
6918778 | Ruckerbauer et al. | Jul 2005 | B2 |
7922495 | Masuda | Apr 2011 | B2 |
Number | Date | Country | |
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20120083141 A1 | Apr 2012 | US |