Contact field for a printed circuit board

Information

  • Patent Grant
  • D821337
  • Patent Number
    D821,337
  • Date Filed
    Tuesday, January 20, 2015
    10 years ago
  • Date Issued
    Tuesday, June 26, 2018
    6 years ago
  • US Classifications
    Field of Search
    • US
    • D13 120
    • D13 121
    • D13 179
    • D13 182
    • D13 184
    • D13 199
    • CPC
    • H05K2201/10287
    • H05K2201/10378
    • H05K2201/10659
    • H05K2201/10689
    • H05K2201/10719
    • H05K7/1084
    • H05K3/222
    • H05K3/325
    • H05K1/00
    • H05K1/0213
    • H05K1/0215
    • H05K1/182
    • Y10T29/49147
    • Y10T29/49149
    • Y10T29/49156
  • International Classifications
    • 1303
    • Term of Grant
      14Years
Abstract
Description


FIG. 1 is a top perspective view of a contact field for a printed circuit board;



FIG. 2 is a bottom perspective view thereof;



FIG. 3 is a right side elevation view thereof;



FIG. 4 is a left side elevation view thereof;



FIG. 5 is a front elevation view thereof;



FIG. 6 is a rear elevation view thereof;



FIG. 7 is a top plan view thereof;



FIG. 8 is a bottom plan view thereof;



FIG. 9 is a first close up bottom plan view thereof; and,



FIG. 10 is a second close up bottom plan view thereof.


The broken lines shown represent portions of the contact field for a printed circuit board that form no part of the claimed design.


Claims
  • The ornamental design for a contact field for a printed circuit board, substantially as shown and described.
US Referenced Citations (9)
Number Name Date Kind
4330684 Hayward May 1982 A
D319629 Hasegawa Sep 1991 S
5159536 Silverio Oct 1992 A
D334175 Barabi Mar 1993 S
5296652 Miller, Jr. Mar 1994 A
6255600 Schaper Jul 2001 B1
D457146 Yamamoto May 2002 S
D465772 Poulter Nov 2002 S
7012196 Swetland Mar 2006 B2