Contact wafer

Information

  • Patent Grant
  • D973599
  • Patent Number
    D973,599
  • Date Filed
    Tuesday, December 14, 2021
    2 years ago
  • Date Issued
    Tuesday, December 27, 2022
    a year ago
Abstract
Description


FIG. 1 is a top, front, and right side perspective view of a contact wafer showing our new design;



FIG. 2 is a bottom, back, and left side perspective view thereof;



FIG. 3 is a front view thereof;



FIG. 4 is a back view thereof



FIG. 5 is a left view thereof;



FIG. 6 is a right view thereof;



FIG. 7 is a top view thereof; and,



FIG. 8 is a bottom view thereof.


The dot-dash broken lines represent the bounds of the claimed design while all other evenly spaced broken lines are directed to environment and are for illustrative purposes only; the broken lines form no part of the claimed design.


Claims
  • The ornamental design for a contact wafer, as shown and described.
US Referenced Citations (23)
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6652318 Winings Nov 2003 B1
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Foreign Referenced Citations (8)
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Non-Patent Literature Citations (2)
Entry
Buck et al., “Contact Wafer”, U.S. Appl. No. 29/725,389, filed Feb. 25, 2020.
Buck et al., “Electrical Connector”, U.S. Appl. No. 29/841,152, filed Jun. 3, 2022.
Continuations (2)
Number Date Country
Parent 29725389 Feb 2020 US
Child 29819343 US
Parent 29652017 Dec 2018 US
Child 29725389 US