TREA

Contact wafer

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Information

  • Patent Grant
  • D879724
  • Patent Number
    D879,724
  • Date Filed
    Friday, May 11, 2018
    6 years ago
  • Date Issued
    Tuesday, March 31, 2020
    4 years ago
  • US Classifications
    Field of Search
    • US
    • D13 123
    • D13 133
    • D13 146
    • D13 147
    • D13 154
    • D13 184
    • D13 199
    • CPC
    • H01R4/2404
    • H01R4/2425
    • H01R4/2462
    • H01R4/26
    • H01R9/09
    • H01R9/091
    • H01R9/16
    • H01R9/22
    • H01R9/226
    • H01R12/50
    • H01R12/51
    • H01R12/52
    • H01R12/57
    • H01R12/58
    • H01R12/59
    • H01R12/592
    • H01R12/62
    • H01R12/70
    • H01R12/7005
    • H01R12/73
    • H01R12/732
    • H01R12/737
    • H01R12/777
    • H01R12/778
    • H01R12/79
    • H01R13/05
  • International Classifications
    • 1303
    • Term of Grant
      15Years
Information
Abstract
Description


FIG. 1 is a top, front, and right side perspective view of a contact wafer showing our new design;



FIG. 2 is a top, back, and left side perspective view thereof;



FIG. 3 is a left side elevation view thereof;



FIG. 4 is a right side elevation view thereof;



FIG. 5 is a front elevation view thereof;



FIG. 6 is a back elevation view thereof;



FIG. 7 is a top plan view thereof; and,



FIG. 8 is a bottom plan view thereof.


Claims
  • The ornamental design for a contact wafer, as shown and described.
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2015116407 Aug 2015 WO
Non-Patent Literature Citations (18)
Entry
Buck et al., “Contact Wafers”, U.S. Appl. No. 29/611,655, filed Jul. 24, 2017.
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Divisions (1)
Number Date Country
Parent 29611655 Jul 2017 US
Child 29647260 US