Contact wafer

Information

  • Patent Grant
  • D941780
  • Patent Number
    D941,780
  • Date Filed
    Tuesday, February 25, 2020
    4 years ago
  • Date Issued
    Tuesday, January 25, 2022
    2 years ago
Abstract
Description


FIG. 1 is a top, front, and right side perspective view of a contact wafer showing our new design;



FIG. 2 is a bottom, back, and left side perspective view thereof;



FIG. 3 is a front view thereof;



FIG. 4 is a back view thereof;



FIG. 5 is a left thereof;



FIG. 6 is a right view thereof;



FIG. 7 is a top view thereof; and,



FIG. 8 is a bottom view thereof.


The broken lines in the drawing views are included to show portions of the contact wafer that form no part of the claimed design.


Claims
  • The ornamental design for contact wafer, as shown and described.
US Referenced Citations (21)
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Non-Patent Literature Citations (9)
Entry
Official Communication issued in corresponding Taiwanese Patent Application No. 109301707, dated Oct. 30, 2020.
Official Communication issued in corresponding Taiwanese Patent Application No. 107304340D01 dated Sep. 26, 2020.
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Official Communication issued in corresponding Taiwanese Patent Application No. 106306823D02 dated Sep. 25, 2020.
Buck et al., “Contact Wafers”, U.S. Appl. No. 29/652,017, filed Dec. 20, 2018.
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Continuations (1)
Number Date Country
Parent 29652017 Dec 2018 US
Child 29725389 US