Claims
- 1. A wafer for adhesively attaching an ostomy appliance to peristomal skin surfaces of a wearer, said wafer having an adhesive layer consisting of water-absorbing and water-swellable skin barrier material in which particles of one or more hydrocolloids are dispersed in a soft, pliant adhesive medium, and a flexible backing layer for attaching said wafer to a collection pouch; said adhesive layer being contoured and having a thin peripheral portion and a thick body portion; said wafer having a stoma-receiving opening surrounded by a circular area of reference having a perimeter concentric with said opening and a radius equal to the distance from the center of said opening to the lowermost limits of said thick body portion; said circular area of reference including semicircular upper and lower halves wherein said lower half contains a greater quantity of skin barrier material than said upper half.
- 2. The wafer of claim 1 in which said thick body portion of said adhesive layer surrounds said stoma-receiving opening.
- 3. The wafer of claim 2 in which said thick body portion of said adhesive layer has a circular periphery; said stoma-receiving opening having its center spaced above the center of the circle defining the periphery of said body portion.
- 4. The wafer of claim 1 in which said thick body portion of said adhesive layer is crescent-shaped and is located entirely below and to the sides of said stoma-receiving opening.
- 5. The wafer of claims 1, 2 or 4 in which said semicircular lower half of said circular area of reference contains at least 10% more skin barrier material than said upper half.
- 6. The wafer of claim 1, 2 or 4 in which said thin peripheral portion of said adhesive layer has a bodyside surface thereof embossed to provide a pattern of discrete, non-connecting depressions separated and isolated from each other by skin-contacting ridges dimensioned and arranged so that a skin surface engaged by said embossed surface primarily contacts only said ridges of said adhesive layer.
- 7. The wafer of claim 6 wherein said ridges have flat and co-planar skin-contacting surface portions.
- 8. The wafer of claim 6 wherein said depressions are arranged in a non-rectilinear pattern of random appearance.
- 9. The wafer of claim 7 wherein at least some of said depressions are round in outline.
- 10. The wafer of claim 1 wherein said backing layer is gas-pervious.
- 11. The wafer of claim 10 wherein said backing layer comprises a porous non-woven fabric.
- 12. The wafer of claim 6 in which a removable protective release sheet covers the surface of said adhesive layer opposite from said backing layer.
- 13. The wafer of claim 12 in which said release sheet includes ridges and depressions that conform with the embossed contour of said adhesive layer.
RELATED APPLICATION
This application is a division of application Ser. No. 08/718,955, filed Sep. 26, 1996, now U.S. Pat. No. 5,730,736, which is a continuation-in-part of copending application Ser. No. 08/640,008, filed Apr. 30, 1996.
US Referenced Citations (16)
Foreign Referenced Citations (6)
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Date |
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0 353 972A |
Feb 1990 |
EPX |
0 409 587A |
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Divisions (1)
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Number |
Date |
Country |
Parent |
718955 |
Sep 1996 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
640008 |
Apr 1996 |
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