This disclosure generally relates to insoles for footwear and, more particularly, to a contoured insole assembly having a flexible full-length insole base and a rigid reinforcement cap which underlies the heel end of the insole base so as to provide support at predetermined areas.
Cushioning insoles of various types are known for use in footwear, particularly for use in running shoes and other footwear intended for athletic activities. Typically, these insoles take the form of a relatively thin layer of foam material which rests atop the midsole of the footwear, and are often removable for washing or replacement. While commonly used, conventional insoles of this general type have proven less than ideal in several respects. For example, the top surface of the foam material is often given a pronounced contour in an effort to support and cradle the wearer's foot, but because the foam is intended mainly to cushion the foot, it typically lacks sufficient strength and firmness to simultaneously provide the necessary support for proper biomechanical function of the foot, particularly in the heel and arch areas.
Other insoles are known which provide effective cushioning for a foot while also providing greater support in the heel and arch areas so as to optimize the biomechanical motions of the foot. Examples of such insoles include the BLUE, GREEN and BLACK premium insoles sold by Superfeet Worldwide, Inc. of Ferndale, Wash. Other examples are shown and described in Superfeet Worldwide's U.S. Pat. No. 6,233,847, which is incorporated herein by reference in its entirety.
The insole assemblies for footwear shown and described herein are configured to provide enhanced foot support in particularly lightweight and sleek form factors. Embodiments are also particularly well adapted to fit within footwear of varying configurations. The insole assemblies generally include a full-length insole base made of a flexible and resilient material and a rigid heel cap attached thereto that mimics the contours of insole base to provide proper biomechanical support of the heel and arch areas of a foot in a particularly lightweight and sleek form factor.
At least one embodiment of an insole assembly to be inserted in footwear to provide foot support may be summarized as including a flexible full-length insole base and a rigid heel cap coupled thereto. The insole base has an upper contoured surface for engaging a plantar surface of a foot and a lower contoured surface opposite the upper contoured surface. The heel cap has an upper contoured surface and a lower contoured surface opposite the upper contoured surface with the same general contours as the upper contoured surface to define a thin shell structure. The heel cap is bonded to the insole base with the upper contoured surface of the heel cap in contact with the lower contoured surface of the insole base to underlie at least a heel portion thereof and provide support thereto. The heel cap may also include a plurality of engagement features protruding from the lower contoured surface thereof to engage a midsole of the footwear during use and to resist motion of the insole assembly relative to the midsole. The insole base may comprise a resiliently compressible foam material and the heel cap may comprise a carbon fiber reinforced polymer material.
The upper contoured surface of the heel cap may have contours that are the same general contours as the lower contoured surface of the heel portion of the insole base such that the heel cap and the insole base nest closely together.
A thickness of the thin shell structure defined between the upper and the lower contoured surfaces of the heel cap may be generally uniform throughout an entirety of the heel cap. In some instances, the thickness of the thin shell structure defined may be exactingly uniform. In other instances, the thickness of the thin shell structure defined between the upper and the lower contoured surfaces of the heel cap may narrow slightly with increasing distance away from a heel end of the heel cap, or otherwise vary slightly along the length of the heel cap. In some instances, an entirety of the heel cap may be located within a reference boundary that is offset from the lower contoured surface of the insole base by a thickness of the insole base. In other instances, an entirety of the heel cap apart from the plurality of engagement features may be located within a reference boundary that is offset from the lower contoured surface of the insole base by a thickness of the insole base.
When provided, the plurality of engagement features protruding from the lower contoured surface of the heel cap may comprise a series of elongated, intersecting ridges. The series of elongated ridges may intersect to provide enhanced structural integrity to at least a rear portion of the heel cap and may intersect to form isolated regions of the lowered contoured surface of the heel cap. At least some of the isolated regions may have a general diamond shape. Apart from the series of intersecting ridges, the heel cap may lack any other projections in a heel region thereof.
A rear heel portion of the upper contoured surface of the heel cap may be rounded and concave to cup a heel of a user, and a corresponding heel portion of the lower contoured surface of the heel cap may mimic the upper contoured surface such that an entirety of the corresponding heel portion is similarly rounded and concave.
In some instances, the forefoot portion of the insole base may include a beveled edge region extending along a periphery thereof. The beveled edge region may taper toward a point at the upper contoured surface of the insole base such that a thickness of the base increases with increasing distance inwardly away from an outer edge of the forefoot portion.
The insole base may extend beyond the outer periphery of the heel cap in all directions. A width of the heel cap at a location midway between opposing ends of the heel cap may be substantially less than a width of the insole base at a corresponding location. For example, the width of the heel cap at the location midway between opposing ends of the heel cap may be at least 0.25 inch less than the width of the insole base at the corresponding location. In some instances, a width of the heel cap may be less than a corresponding width of the insole base along an entire length of the heel cap.
The forefoot portion of the insole base may include a series of depressions formed on the lowered contoured surface thereof. A depth of the series of depressions may vary over a length thereof. For example, the depth of the series of depressions may decrease with increasing distance from a toe end of the insole assembly.
The insole base may further include an array of perforations extending completely through at least one of the forefoot and midfoot portions of the insole base. For example, the insole base may include a first array of circular apertures extending completely through a region of the forefoot portion and a second array of circular apertures extending completely through a region of the midfoot portion.
The various aspects and features described above and other aspects and features described herein may be combined to provide insole assemblies that are particularly well adapted to support a user's foot in a particularly lightweight and sleek form factor. It is appreciated that such insole assemblies may be used in conjunction with a wide range of footwear, including without limitation, athletic shoes, casual shoes, dress shoes, work boots and recreational footwear such as snowboard boots and ski boots.
In the following description, certain specific details are set forth in order to provide a thorough understanding of various disclosed embodiments. However, one skilled in the relevant art will recognize that embodiments may be practiced without one or more of these specific details. In other instances, well-known structures and manufacturing techniques associated with insoles for footwear and orthotic devices may not be shown or described in detail to avoid unnecessarily obscuring descriptions of the embodiments. For example, it will be appreciated that the full-length insole base on the insole assemblies described herein may include an upper fabric lining with or without antibacterial properties that is adhered or otherwise bonded to or formed with the full-length insole.
Unless the context requires otherwise, throughout the specification and claims which follow, the word “comprise” and variations thereof, such as, “comprises” and “comprising” are to be construed in an open, inclusive sense, that is as “including, but not limited to.”
Reference throughout this specification to “one embodiment” or “an embodiment” means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of the phrases “in one embodiment” or “in an embodiment” in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” include plural referents unless the content clearly dictates otherwise. It should also be noted that the term “or” is generally employed in its sense including “and/or” unless the content clearly dictates otherwise.
According to some embodiments, the insole base 20 may comprise a resiliently compressible foam material. The resiliently compressible foam material may be formed by an irradiation process which minimizes the size of air pockets formed therein and may lead to a reduction in weight of the resulting insole base 20 relative to insoles formed of chemically cross-linked foams, for example. This may result in an insole base 20 that is particularly lightweight yet sufficiently resilient to provide adequate cushioning and durability.
According to some embodiments, the rigid heel cap 40 may comprise a carbon fiber reinforced polymer material. The carbon fiber reinforced polymer material may comprise, for example, a polymer blend having up to or exceeding ten percent of carbon fibers by mass or volume to enhance the structural rigidity of the heel cap 40. This may result in a heel cap 40 that is particularly lightweight yet sufficiently rigid to provide adequate biomechanical support of a user's foot when combined with the base insole 20 to form the insole assembly 10.
With continued reference to the example embodiment of the insole assembly 10 shown in
The rigid heel cap 40 includes an upper contoured surface 42 (
The heel cap 40 may being bonded, such as, for example, via adhesive, to the insole base 20 with the upper contoured surface 42 of the heel cap 40 in contact with the lower contoured surface 24 of the insole base 20 to underlie at least the heel portion 26 thereof and provide support thereto. The upper contoured surface 42 of the heel cap 40 may have contours that are the same general contours as the lower contoured surface 24 of the heel portion 26 of the insole base 40 such that the heel cap 40 and the insole base 20 nest closely together in an assembled configuration. Collectively, the insole base 20 and the heel cap 40 provide a contoured support structure for engaging the plantar surface of a user's foot and for providing proper biomechanical support of the heel and arch areas of the foot during use of the insole assembly 10.
As can be appreciated from the example embodiment shown in
With continued reference to
According to the example embodiment of
According to some embodiments, including the example embodiment shown in
According to the example embodiment of
According to the example embodiment of
According to the example embodiment of
According to the example embodiment of
According to the example embodiment of
Although certain specific details are shown and described with reference to one example embodiment shown in
All of the U.S. patents, U.S. patent application publications, U.S. patent applications, foreign patents, foreign patent applications and non-patent publications referred to in this specification and/or listed in the Application Data Sheet are incorporated herein by reference, in their entirety, including U.S. Provisional Patent Application Ser. No. 61/835,442, filed Jun. 14, 2013, from which the present application claims benefit under 35 U.S.C. §119(e). Aspects of the embodiments can be modified, if necessary, to employ concepts of the various patents, applications and publications to provide yet further embodiments.
These and other changes can be made to the embodiments in light of the above-detailed description. In general, in the following claims, the terms used should not be construed to limit the claims to the specific embodiments disclosed in the specification and the claims, but should be construed to include all possible embodiments along with the full scope of equivalents to which such claims are entitled.
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Number | Date | Country | |
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