Number | Date | Country | Kind |
---|---|---|---|
197 08 210 | Feb 1997 | DE |
Filing Document | Filing Date | Country | Kind |
---|---|---|---|
PCT/DE98/00549 | WO | 00 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO98/38843 | 9/3/1998 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
5434362 | Klosowiak et al. | Jul 1995 | A |
Number | Date | Country |
---|---|---|
41 42 138 | Apr 1993 | DE |
43 00 342 | Jul 1994 | DE |
195 46 164 | Jun 1996 | DE |
2 094 503 | Sep 1982 | GB |
Entry |
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Feldmann, I., “Molded Interconnect Devices—Recent Developments and Future Trends”, (Second International Congress on Molded Interconnect Devices), pp. 5-16 (1996). |