Controlled delivery of process gas using a remote pressure measurement device

Information

  • Patent Grant
  • 11003198
  • Patent Number
    11,003,198
  • Date Filed
    Tuesday, September 15, 2015
    8 years ago
  • Date Issued
    Tuesday, May 11, 2021
    3 years ago
Abstract
A flow node includes characterized restrictor in series and adjacent with a valve to provide a primary flow restriction with a minimized volume between the two. A conductance of the characterized restrictor is low enough relative to the valve seat to cause a pressure drop that is sufficiently large relative to the pressure drop across the valve seat that a pressure measurement device is located upstream of the valve is used to determine the pressure to the inlet of the restrictor. A vent can be included to reduce bleed time. Multiple flow nodes in parallel increase a dynamic range.
Description
FIELD OF THE INVENTION

The invention relates generally to gas delivery systems, and more specifically, to delivering a process gas using a remote pressure transducer.


BACKGROUND

Applications such as semiconductor fabrication processing increasingly require more accurate measurements, lower equipment costs, and quicker and more consistency in timing in the delivery of gases from components such as a mass flow controller (MFC).


An MFC is a device used to measure and control the flow of fluids and gasses. Conventionally, in pressure based MFC, a pressure transducer is needed within an MFC to measure the process gas pressure in a known volume and temperature.



FIG. 1A is a schematic diagram illustrating a prior art pressure based MFC 100 with a volume(V1) in conduit 198A that is used to measure pressure, according to a prior art embodiment. MFC 100 has an inlet port 101A, an outlet port 102A, a proportional inlet valve 103A, a first pressure transducer 104A, a restrictor 105A, a second pressure transducer 106A and a temperature sensor 107A. The first pressure transducer 104A measures pressure over V1 as an input for pressure regulation and is operates so that pressure at the first pressure transducer 104A closely matches the pressure at an inlet of the restrictor 105A. The second pressure transducer 106A is located downstream and a temperature sensor 107A is used to increase accuracy.



FIG. 1B is a block diagram of FIG. 1A illustrating a flow order for a process gas through the prior art pressure based MFC 100B, according to an embodiment of prior art. As shown, a process gas moves through a proportional valve 103B to a conduit containing V1198B where the process gas is measured by a first pressure transducer 104B. Next the gas passes through restrictor 105B into a conduit with volume V2, 199B, where the pressure representative of the pressure at the outlet of the restrictor is measured. Finally, the process gas often exhausts from the MFC 100B to a process through an isolation valve actuator and seat 110.


Problematically, the space consumed by V1 hinders further efficiencies in accuracy, bleed down performance, space consumption and costs of gas delivery systems used for processing. Furthermore, when an external control directs the MFC to stop or reduce the magnitude of the gas flow to a lower rate of flow, V1 produces undesirable slow bleed down times to the new flow value.


What is needed is a flow node to provide an accurate delivery of process gas without the inefficiencies of a conventional MFC having an local pressure measurement directly on V1, by utilizing a remote pressure measurement of V1 pressure to reduce the bleed down volume while still providing pressure measurements that represent the pressure of the gas inlet to the restrictor with sufficient accuracy to maintain the specified accuracy of the flow device.


SUMMARY

The present invention addresses these shortcomings by providing a device, a method to deliver process gas using a remote pressure measurement device.


In one embodiment, an apparatus (e.g., a flow node) operates in conjunction with an upstream, remotely-located pressure regulation for controlled delivery of process gas. The apparatus includes a valve controlled by an actuator to receive a process gas into a conduit. A characterized restrictor is placed in series and adjacent with the valve seat to provide a primary flow restriction while having a minimized volume between the valve seat and the characterized restrictor.


In one embodiment, a conductance of the characterized restrictor is low enough relative to a conductance of the valve seat that the valve seat creates a negligible pressure drop compared to the pressure drop created by the characterized restrictor. Once the process gas has passed through the characterized restrictor, an outlet exhausts the process gas from the conduit. By knowing the characterization of the restrictor, and accordingly controlling a pressure of the process gas, the desired mass flow is delivered.


In one embodiment, a pressure measurement device, such as a pressure transducer, is located within an upstream pressure regulator such as an electronic regulator. In another embodiment, a vent is provided to bleed down the process gas. As a result of venting, the process gas pressure can be quickly reduced.


In some embodiments, a plurality of parallel flow nodes provides a wider dynamic range of flow rates in less space than a standard mass flow controller (MFC) and with less cost than providing multiple MFC to cover an equivalent operating range. For example, one flow node can be activated for low flow rates, while another flow node can be activated for higher flow rates. Further, the flow nodes can share an upstream pressure measurement and control device and an outlet. Numerous other embodiments are possible, as described in more detail below.


Advantageously, space and cost are reduced, while improving a dynamic range relative to a conventional MFC device.





BRIEF DESCRIPTION OF THE DRAWINGS

In the following drawings, like reference numbers are used to refer to like elements. Although the following figures depict various examples of the invention, the invention is not limited to the examples depicted in the figures.



FIG. 1A is a schematic diagram illustrating a prior art pressure based mass flow controller (MFC) with a volume (V1) to measure pressure, according to a prior art embodiment.



FIG. 1B is a block diagram of FIG. 1A illustrating a flow order for a process gas through a prior art pressure based MFC, according to an embodiment of prior art.



FIG. 2A is a schematic diagram illustrating a gas stick including a flow node with a remote pressure measurement, according to an embodiment.



FIG. 2B is a block diagram of FIG. 2A illustrating a flow order for a process gas though a gas stick including a flow node making use of a remote pressure measurement, according to an embodiment.



FIGS. 3A-3B are schematic diagrams illustrating alternative configurations of a valve relative to a characterized restrictor, according to some embodiments.



FIGS. 4A-4C are schematic diagrams illustrating alternative configurations of multiple flow nodes, according to some embodiments.



FIG. 5A is a block diagram illustrating a flow node supplied by a self-venting electronic regulator, according to some embodiments.



FIGS. 5B-5C are schematic diagrams illustrating an electronic regulator of FIG. 5A used in conjunction with self-venting mechanisms, according to some embodiments.



FIG. 6 is a flow chart illustrating a method for delivering a process gas making use of a remote pressure measurement device and flow node, according to an embodiment.





DETAILED DESCRIPTION

A device and method for a flow node to control gas flow utilizing a remote pressure measurement device are disclosed. In general, the flow node disclosed herein eliminates the local pressure measurement directly on V1 needed by MFCs (mass flow controllers) because a resulting pressure drop across conduits and poppet and valve seat of the flow node is designed to be insignificant relative to the remote measurement. The disclosed techniques can be implemented in a semiconductor fabrication process, or any other environment requiring flow rates of gas or fluid (e.g., low flow, high flow, 0.1 sccm, or 30,000 sccm) within tight tolerance limits or where reduced equipment cost is desired.



FIG. 2A is a block diagram illustrating a gas stick 200A that includes a flow node 201A making use of a remote pressure measurement, according to an embodiment. The gas stick 200A also includes an electronic regulator 202A and an inlet 203A and outlet 204A to a conduit.


The inlet 203A of a VCR fitting (e.g., as produced by Parker Corporation) receives a process gas into a conduit. Nitrogen is an exemplary process gas, but any suitable gas or fluid could be substituted. The conduit(s) can be any suitable tubing or plumbing, either rigid or flexible, to move the process gas through and to the electronic regulator 202A and the flow node 201A. The conduit can have an outside diameter of, for example, ¼ inch and inside diameter of 3/16 inch. K1S substrate blocks 203, as manufactured by Hytron Corporation, serve as an interconnecting platform for the electronic regulator 202A, the flow node 201A and the inlet conduit 203A and outlet 204A conduit.


The outlet 204A of a VCR fitting delivers the process gas to a next conduit for eventual use by the process. In some embodiments, additional processing is performed on the process gas, such as mixing with other gases, or the like.


The flow node 201A includes a valve seat and poppet assembly 205A, an actuator 222 (represented by the arrow up/down arrow), internal conduits 207 (can represent one or more portions of conduit), interface sealing surfaces 208 and a characterized restrictor 209A. The flow node 201A is connected in series with an upstream electronic regulator 202A having a pressure transducer 206A. Generally, the flow node 201A limits a mass flow of gas or liquids in known manner that is in accordance with a pressure of a gas or liquids as measured upstream. Optionally a pressure measurement and/or temperature assumed, measured or communicated by other instrumentation elsewhere in the system can be used to improve the accuracy of the flow if available.


The valve seat and poppet assembly 205A includes an opening for gas flow and a movable poppet to preclude gas flow. In operation, the poppet moves between on and off by opening to allow process gas to flow into the conduit and closing to stop the process gas. In one embodiment, the valve seat has a high conductance relative to the characterized restrictor 209A (or alternatively, has low impedance relative to the characterized restrictor), for example, a ratio of 10:1, 200:1 (preferred) or higher. The conductance of an on/off valve such as used in the flow node, can be the maximum practical amount for a design envelope. With the conventional MFC using a proportional valve as opposed to an on/off isolation valve, conductance has to be balanced with (and thus, is limited by) flow resolution needs.


The characterized restrictor 209A is located, in one embodiment, directly adjacent to and in series with the valve seat and poppet assembly 205A. The characterized flow restrictor 209A can be a laminar flow element (compressible or in-compressible flow), an orifice (sonic, sub sonic or molecular), a venturi nozzle (sonic, sub sonic or molecular), or the like. As discussed, the characterized restrictor 209A is selected to provide the desired full-scale flow at or slightly below the target full scale pressure to be delivered to the flow node 201A and still have a low conductance relative to a conductance of the valve seat. A resulting pressure drop from the pressure regulator output, through the conduits to the flow node 201A and across the valve seat of the flow node 201A is small enough to be ignored so that a pressure measurement within the flow node 201A is not required to achieve a desired accuracy.


For example, a characterized restrictor designed to flow 5,000 sccm at P1=2000 Torr is placed in the throat of an air valve with a flow impedance and associated plumbing that generates, for instance, a 0.15 Torr pressure drop when delivering the 5000 sccm flow through the restrictor at 2000 Torr. The induced flow error would be roughly 0.15% of reading if the characterized restrictor is a compressible laminar flow element. The 0.15% is well within the 1% reading of the device and is acceptable allowing the device to maintain it specified accuracy.


An electronic regulator 202A with the pressure 206A transducer and a proportional valve 211A measures and correspondingly controls a pressure of the process gas within the conduit. A proportional valve 211A of the electronic regulator 202A modulates to control a pressure of the process gas inlet in accordance with pressure set points. The pressure set points can be received automatically from a controller or manually input. In some embodiments, the pressure set points are externally calculated to cause a desired mass flow rate. In some embodiments, the electronic regulator can maintain accuracy from an upstream location for flows up to 8 SLM (standard liter per minute) on N2 (nitrogen) or 4 SLM on SF6 (sulfur hexafluoride) for flow nodes using a ¼″ air valve commonly used in the industry. In other embodiments, flow rates can be higher if larger standard components or non-standard modified components are used. At a certain point as flow rate gets larger, parasitic losses of pressure across the valve seat make the overall pressure drop larger, relative to the pressure delivered to the restrictor 209A, than manageable to maintain flow measurement accuracy.



FIG. 2B is a block diagram of FIG. 2A illustrating a flow order for a process gas though a gas stick 200B that includes a flow node 201B with a remote pressure measurement, according to an embodiment.


The gas is received through an inlet 203B to a proportional valve 211B that is modulated in coordination with a pressure transducer 206B to control pressure to the 201B flow node. A volume 298 for bleed down between the valve seat and poppet assembly 205B and the characterized restrictor 209B is minimized for faster bleed down (e.g., 50× faster). By minimizing the distance and geometry, the volume 298 of gas between the components is minimized relative to a conventional MFC. An exemplary volume of the resulting bleed off volume can be a negligible at 0.02 cc, 0.01 cc or less. As shown in FIG. 1B, an exemplary bleed off volume of an MFC can be 0.50 cc. Optionally, a temperature sensor 252 provides an internal temperature measurement, although temperature can also be received from external components such as a gas box temperature controller or sensor.


Additionally, the MFC has typical measurements of 1.1″ (W)×4.1″ (L)×5″ (H), compared to a flow node constructed from an air valve having measurements of 1.1″ (W)×1.1″ (L)×4′ (H) for similar operational parameters. Further, the pressure based MFC can cost $2,500, while an air valve can cost $90 in volume and a characterized restrictor to press in the air valve and make a flow node from the air valve, can cost an additional $20.



FIGS. 3A-3B are schematic diagrams illustrating alternative configurations of a valve relative to a characterized restrictor, according to some embodiments.


In more detail, the valve seat and poppet assembly 301A of a first configuration in FIG. 3A are located upstream of the characterized restrictor 303A. In some cases, the characterized restrictor 303A can be exposed to the multiple gases from other flow nodes and MFCs exhausting to a common conduit. In a no flow condition, the isolation on the flow node is closed, and small amounts of these other gases can backflow into the restrictor 303A which can lead to reliability issues such as corrosion or particle generation in the case where the gases are incompatible or in reacting families. In an alternative configuration of FIG. 3B, a characterized restrictor 303B is located upstream of a valve seat and poppet assembly 301B. By locating the valve seat and poppet assembly 301B downstream, the backflow is remediated. On the other hand, the buildup of gas pressure between the restrictor 303B and the downstream valve seat can cause a microburst which may be objectionable in some cases. So long as the ratio of conductance remains, the flow node operates within tolerable error limits.



FIGS. 4A-4C are schematic diagrams illustrating alternative configurations of multiple flow nodes, according to some embodiments.


Specifically, FIG. 4A shows a gas stick 400A with two flow nodes 401A,B in parallel. An additional K1S substrate 402 is needed to support the additional flow nodes.


In operation, the process gas can flow through either flow node or both. When flow node 401A is open, the process gas flows to a conduit 403 and when flow node 401B is open, the process gas flows to a conduit 404. For example, one flow node can be configured to accurately handle low flows while the other flow node accurately handles all non-low flows. The dual flow node thus increases an overall dynamic range that is superior to an MFC. Further efficiency is achieved because a single pressure transducer is shared between the flow nodes.


While the characterized restrictors are located downstream of the valve seat in the FIG. 4A, FIG. 4B shows an example of characterized restrictors located upstream of the valve seat. When a flow node 413A is open, the process gas inlets through a conduit 411, and when a flow node 413B is open, the process gas inlets through a conduit 412.


A further example of FIG. 4C shows an embodiment of a gas stick 400C with three flow nodes 421A-C in a parallel configuration. This configuration provides the equivalent capability as three separate MFCs, but only occupies one third the space while providing a cost savings. The embodiment also shows characterized restrictor located downstream of the valve seat and poppet assemblies, although the opposite configuration is also possible. When the flow node 421A is open, the process gas flows through a conduit 422, when the flow node 421B is open, the process gas flows through a conduit 423, and when the flow node 421C is open, the process gas flows through a conduit 424.



FIGS. 5A-5C are schematic diagrams illustrating a flow node supplied by a self-venting electronic regulator, according to some embodiments.


The proportional dump valve, or optional on/off valve with flow limiting restrictor in series, allows process gas to be vented from the additional conduit routed to a vent. By quickly depressurizing the conduit in a low flow scenario, changes in mass flow rate are realized with reduced bleed times.


As shown in FIG. 5A, an electronic regulator 501A includes a valve 502 and optional flow limiting restrictor 503 in series with a conduit to a vent. A feedback and control 599 can coordinate components. The configuration can relieve a volume of gas between a proportional valve 504 and a flow node 505 (and coupled to a pressure transducer 506) allowing it to transition more quickly from a higher pressure set point to a new lower pressure set point than could occur without the venting of gas, thus avoiding intolerable slow bleed down.


In an embodiment of FIG. 5B, a proportional valve 511 provides a controlled release of the process gas to a conduit 512 for venting. In an embodiment of FIG. 5C, an on/off valve 531 with a limiting flow restrictor is used release the process gas to a conduit 532 for venting. The on/off valve 531 and limiting flow restrictor are preferred in some cases due to lower cost and less complexity for control.



FIG. 6 is a flow chart illustrating a method for delivering a process gas with a remote pressure measurement, according to an embodiment. The method can be implemented by any of the flow nodes discussed above.


At step 610, pressure points associated with mass flow parameters of a process gas are received. For example, an electronic regulator can receive pressure set points from a controller that is aware of characteristics of the flow node and a temperature and pressure, P2 (assumed or measured).


At step 620, a process gas is received through a high conductance valve and poppet assembly. An actuator changes position to move the poppet, thereby allowing or preventing gas flow.


At step 630, a primary flow of the process gas is limited by the low conductance characterized restrictor. As the restrictor is characterized so that flow is known as a function of pressure to the restrictor, a mass flow through the restrictor is known if one knows the pressure delivered to the flow node. Correspondingly, one can change mass flow to a new desired value by changing the pressure delivered to the flow node. As discussed, a ratio of conductance between the valve seat and the characterized restrictor, along with a minimized volume between the two, produces a very low pressure drop allowing the remote pressure measurement to represent the pressure at the inlet of the restrictor with sufficient accuracy to allow sufficiently accurate flow measurement.


At step 640, the process gas is delivered to an exhaust. The process gas can move on to be mixed with other gases, heated, cooled, or the like.


This description of the invention has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form described, and many modifications and variations are possible in light of the teaching above. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications. This description will enable others skilled in the art to best utilize and practice the invention in various embodiments and with various modifications as are suited to a particular use. The scope of the invention is defined by the following claims.

Claims
  • 1. A control apparatus for delivery of a process gas, comprising: an inlet conduit to receive the process gas;a valve fluidly coupled to the inlet conduit and alterable between an open condition and a closed condition, the valve having a first conductance and being downstream of the inlet conduit;a characterized restrictor inserted into an opening of the valve, said characterized restrictor being adjacent to and in series with the valve, the characterized restrictor having a second conductance; andan outlet conduit to exhaust a controlled flow of the process gas passing through the characterized restrictor;wherein a ratio of the first conductance to the second conductance is 10:1 or higher.
  • 2. The control apparatus of claim 1, further comprising: a pressure measurement device coupled to measure a pressure of the process gas upstream of the characterized restrictor.
  • 3. The control apparatus of claim 2, wherein the pressure measurement device outputs measurements to an electronic regulator coupled upstream of the characterized restrictor.
  • 4. The control apparatus of claim 3, wherein the electronic regulator receives an adjusted set point at least partially based upon a measurement of a pressure downstream from the characterized restrictor and a temperature.
  • 5. The control apparatus of claim 2, wherein the pressure measurement device is part of an electronic pressure regulator coupled upstream of the characterized restrictor.
  • 6. The control apparatus of claim 5, wherein the electronic pressure regulator receives an adjusted set point at least partially based upon a measurement of a pressure downstream from the characterized restrictor and a temperature.
  • 7. The control apparatus of claim 1, wherein the characterized restrictor comprises one of: a laminar flow element and a sonic nozzle.
  • 8. The control apparatus of claim 1, wherein the valve is an air valve.
  • 9. The control apparatus of claim 1, further comprising a substrate block, the valve operably coupled to the substrate block and comprising a valve body, a valve seat, and a closure member, the characterized restrictor located within the valve body.
  • 10. The control apparatus of claim 9, wherein the inlet conduit and the outlet conduit are located within the substrate block.
  • 11. The control apparatus of claim 1, wherein in the closed condition, a volume exists between the valve and the characterized restrictor, the volume being 0.5 cubic centimeters or less.
  • 12. A control apparatus for delivery of a process gas, comprising: an inlet conduit to receive the process gas;an electronic pressure regulator coupled to the inlet conduit and an internal conduit, said electronic pressure regulator including a pressure measurement device coupled to said internal conduit;a substrate block;a valve fluidly coupled to said internal conduit and alterable between an open condition and a closed condition, the valve operably coupled to the substrate block, the valve further comprising a valve body, a valve seat, and a closure member, the valve being downstream of the inlet conduit;a characterized restrictor inserted into an opening of the valve body of the valve, said restrictor being adjacent to and in series with the valve; andan outlet conduit to exhaust a controlled flow of the process gas passing through the characterized restrictor;wherein in the closed condition, a volume exists between the valve and the characterized restrictor, the volume being 0.02 cubic centimeters or less.
  • 13. The control apparatus of claim 12, wherein the characterized restrictor is downstream of the valve.
  • 14. The control apparatus of claim 12, further comprising: a second characterized restrictor connecting said internal conduit to the outlet fluid conduit, to bypass the valve fluidly coupled to the internal conduit, for defeating the total shut off capability of the valve closed condition.
  • 15. The control apparatus of claim 12, wherein the valve has a first conductance and the characterized restrictor has a second conductance, a ratio of the first conductance to the second conductance is 10:1 or higher.
  • 16. A control apparatus for delivery of a process gas, comprising: an inlet conduit to receive the process gas;an electronic pressure regulator coupled to the inlet conduit and a first internal conduit, said regulator including a pressure measurement device coupled to the first internal conduit;a substrate block;a first valve fluidly coupled to the first internal conduit and alterable between an open condition and a closed condition, the first valve operably coupled to the substrate block, the first valve further comprising a first valve body, a first valve seat, and a first closure member, the first valve being downstream of the inlet conduit;a first characterized restrictor inserted into an opening of the first valve body of the first valve, said first restrictor being adjacent to and in series with the first valve;a second valve fluidly coupled to the first internal conduit for actuating into an open condition and a closed condition, the second valve being downstream of the inlet conduit;a second characterized restrictor inserted into an opening of the second valve, said second restrictor being adjacent to and in series with the second valve; andan outlet conduit to exhaust a controlled flow of the process gas flowing through the first characterized restrictor and the second characterized restrictor;wherein in the closed condition, a first volume exists between the first characterized restrictor and the first valve, the first volume being 0.5 cubic centimeters or less, and in the closed condition, a second volume exists between the second characterized restrictor and the second valve, the second volume being 0.5 cubic centimeters or less.
  • 17. The control apparatus of claim 16, wherein the first characterized restrictor is downstream of the first valve, and the second characterized restrictor is downstream of the second valve.
  • 18. The control apparatus of claim 16, wherein the first and second characterized restrictor are arranged in parallel.
  • 19. The control apparatus of claim 16, wherein the first and second valves are arranged in parallel.
CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of priority under 35 U.S.C. 120 as a continuation to U.S. application Ser. No. 13/590,253, filed on Aug. 20, 2012, entitled FLOW NODE TO DELIVER PROGESS GAS USING A REMOTE PRESSURE MEASUREMENT DEVICE, by Daniel T. Mudd et al., which in turn claims the benefit of priority under 35 U.S.C. 119(e) to U.S. Application No. 61/575,359, filed Aug. 20, 2011, entitled NEXT GENERATION GAS PANEL, FLOW NODES AND SELF RELIEVING REGULATOR, by Daniel T. Mudd et al., the contents of both being hereby incorporated by reference in their entirety.

US Referenced Citations (238)
Number Name Date Kind
2666297 Skousgaard Jan 1954 A
3271994 Fournier et al. Sep 1966 A
3335748 Klemm et al. Aug 1967 A
3453861 Levasseur Jul 1969 A
3491946 Muller Jan 1970 A
3504692 Goldstein Apr 1970 A
3559482 Baker et al. Feb 1971 A
3570807 Sturman et al. Mar 1971 A
3807456 Colletti Apr 1974 A
3814541 Dent et al. Jun 1974 A
3841520 Bryant et al. Oct 1974 A
3910113 Brown Oct 1975 A
4015626 Thordarson Apr 1977 A
4096746 Wilson et al. Jun 1978 A
4118009 Chmura Oct 1978 A
4203465 Rissi May 1980 A
4253156 Lisle et al. Feb 1981 A
4275752 Collier et al. Jun 1981 A
4304263 Choate Dec 1981 A
4315523 Mahawili et al. Feb 1982 A
4327757 Weevers May 1982 A
4406161 Locke et al. Sep 1983 A
4462915 Friedman Jul 1984 A
4576043 Nguyen Mar 1986 A
4589440 Panet May 1986 A
4718443 Adney et al. Jan 1988 A
4741359 Siebald May 1988 A
4796651 Ginn et al. Jan 1989 A
4858643 Vavra et al. Aug 1989 A
4888117 Brown et al. Dec 1989 A
4904285 Yamada et al. Feb 1990 A
4918995 Pearman et al. Apr 1990 A
5003810 Jepson et al. Apr 1991 A
5044199 Drexel et al. Sep 1991 A
5052363 Stiles Oct 1991 A
5062446 Anderson Nov 1991 A
5080131 Ono et al. Jan 1992 A
5100100 Benson et al. Mar 1992 A
5100551 Pall et al. Mar 1992 A
5114447 Davis et al. May 1992 A
5123439 Powers Jun 1992 A
5129418 Shimomura et al. Jul 1992 A
5152483 Maeng Oct 1992 A
5159951 Ono et al. Nov 1992 A
5161576 Hekkert et al. Nov 1992 A
5187771 Uchida Feb 1993 A
5187972 Defriez Feb 1993 A
5190068 Philbin Mar 1993 A
5259243 Drexel et al. Nov 1993 A
5280773 Becker Jan 1994 A
5285673 Drexel et al. Feb 1994 A
5297427 Shambayati Mar 1994 A
5305638 Saghatchi et al. Apr 1994 A
5311762 Drexel May 1994 A
5321992 Mudd et al. Jun 1994 A
5325705 Tom Jul 1994 A
5329966 Fenimore et al. Jul 1994 A
5359878 Mudd Nov 1994 A
5419133 Schneider May 1995 A
5439026 Moriya Aug 1995 A
5445035 Delajoud Aug 1995 A
5511585 Lee Apr 1996 A
5542284 Layzell et al. Aug 1996 A
5549272 Kautz Aug 1996 A
5583282 Tom Dec 1996 A
5624409 Seale Apr 1997 A
5660207 Mudd Aug 1997 A
5669408 Nishino et al. Sep 1997 A
5711786 Hinishaw Jan 1998 A
5730181 Doyle et al. Mar 1998 A
5762086 Ollivier Jun 1998 A
5804717 Lucas Sep 1998 A
5816285 Ohmi et al. Oct 1998 A
5865205 Wilmer Feb 1999 A
5868159 Loan et al. Feb 1999 A
5904170 Harvey et al. May 1999 A
5911238 Bump et al. Jun 1999 A
5917066 Eisenmann et al. Jun 1999 A
5918616 Sanfilippo et al. Jul 1999 A
5935418 Chakrabarty et al. Aug 1999 A
5944048 Bump et al. Aug 1999 A
5970801 Ciobanu et al. Oct 1999 A
5975126 Bump et al. Nov 1999 A
5988211 Cornell Nov 1999 A
6015590 Suntola Jan 2000 A
6026834 Azima Feb 2000 A
6026847 Reinicke et al. Feb 2000 A
6062246 Tanaka et al. May 2000 A
6062256 Miller May 2000 A
6074691 Schmitt et al. Jun 2000 A
6080219 Jha et al. Jun 2000 A
6116269 Maxson Sep 2000 A
6119710 Brown Sep 2000 A
6125869 Horiuchi Oct 2000 A
6138708 Waldbusser Oct 2000 A
6152162 Balazy et al. Nov 2000 A
6178995 Ohmi et al. Jan 2001 B1
6269692 Drexel et al. Aug 2001 B1
6303501 Chen et al. Oct 2001 B1
6314991 Gill Nov 2001 B1
6352001 Wickert et al. Mar 2002 B1
6422256 Balazy Jul 2002 B1
6422264 Ohmi et al. Jul 2002 B2
6425281 Sheriff et al. Jul 2002 B1
6443174 Mudd Sep 2002 B2
6539968 White et al. Apr 2003 B1
6561218 Mudd May 2003 B2
6564825 Lowery et al. May 2003 B2
6631334 Grosshart Oct 2003 B2
6655408 Linthorst Dec 2003 B2
6712084 Shajii et al. Mar 2004 B2
6752166 Lull et al. Jun 2004 B2
6799603 Moore Oct 2004 B1
6832628 Thordarson et al. Dec 2004 B2
6868862 Shajii et al. Mar 2005 B2
6881263 Lindfors et al. Apr 2005 B2
6948508 Shajii et al. Sep 2005 B2
7037372 Lindfors et al. May 2006 B2
7073392 Lull et al. Jul 2006 B2
7136767 Shajii et al. Nov 2006 B2
7216019 Tinsley et al. May 2007 B2
7252032 Scheffel et al. Aug 2007 B2
7334602 Ahn Feb 2008 B2
7337805 Brown et al. Mar 2008 B2
7353841 Kono et al. Apr 2008 B2
7370664 Glite May 2008 B2
7424346 Shajii et al. Sep 2008 B2
7431045 Mudd et al. Oct 2008 B2
7474968 Ding et al. Jan 2009 B2
7552015 Shajii et al. Jun 2009 B2
7615120 Shajii et al. Nov 2009 B2
7628861 Clark Dec 2009 B2
7662233 Sneh Feb 2010 B2
7680399 Buchanan et al. Mar 2010 B2
7682946 Ma et al. Mar 2010 B2
7693606 Ahmad et al. Apr 2010 B2
7706925 Ding et al. Apr 2010 B2
7717061 Ishizaka et al. May 2010 B2
7757554 Ding et al. Jul 2010 B2
7809473 Shajii et al. Oct 2010 B2
7826986 McDonald Nov 2010 B2
7850779 Ma et al. Dec 2010 B2
7874208 Redemann et al. Jan 2011 B2
7881829 Yoneda et al. Feb 2011 B2
7891228 Ding et al. Feb 2011 B2
7905139 Lull Mar 2011 B2
7918238 Tanaka et al. Apr 2011 B2
7922150 Cripps et al. Apr 2011 B2
7974544 Kobayashi et al. Jul 2011 B2
7979165 Gotoh et al. Jul 2011 B2
8100382 Robertson, III et al. Jan 2012 B2
8104323 Yasuda Jan 2012 B2
8112182 Tokuhisa et al. Feb 2012 B2
8183781 Sangam May 2012 B2
8201989 Itoh et al. Jun 2012 B2
8205629 Gregor et al. Jun 2012 B2
8265795 Takahashi et al. Sep 2012 B2
8282992 Myo et al. Oct 2012 B2
8291857 Lam et al. Oct 2012 B2
8293015 Lam et al. Oct 2012 B2
8340827 Yun et al. Dec 2012 B2
8343258 Guan Jan 2013 B2
8343279 Myo et al. Jan 2013 B2
8356623 Isobe et al. Jan 2013 B2
8376312 Mudd et al. Feb 2013 B2
8382897 Sangam Feb 2013 B2
8408245 Feldman et al. Apr 2013 B2
8443649 Yasuda et al. May 2013 B2
8460753 Xiao et al. Jun 2013 B2
8504318 Mendelson et al. Aug 2013 B2
8505478 Suekane et al. Aug 2013 B2
8511337 Nishimura Aug 2013 B2
8573247 Ushigusa et al. Nov 2013 B2
8744784 Yasuda et al. Jun 2014 B2
8746057 Yasuda et al. Jun 2014 B2
8770215 Mudd et al. Jul 2014 B1
8789556 Yasuda et al. Jul 2014 B2
8793082 Ding et al. Jul 2014 B2
8800589 Minami et al. Aug 2014 B2
8851105 Kashima et al. Oct 2014 B2
8910656 Yasuda Dec 2014 B2
9027585 Smirnov May 2015 B2
9081388 Tanaka et al. Jul 2015 B2
9188989 Mudd et al. Nov 2015 B1
9207139 Jones et al. Dec 2015 B2
9223318 Takeuchi et al. Dec 2015 B2
9690301 Mudd Jun 2017 B2
20010013363 Kitayama et al. Aug 2001 A1
20020002996 Mudd Jan 2002 A1
20020014206 Mudd Feb 2002 A1
20020046612 Mudd Apr 2002 A1
20020095225 Huang et al. Jul 2002 A1
20040007180 Yamasaki et al. Jan 2004 A1
20040083807 Mudd et al. May 2004 A1
20050056211 Lindfors et al. Mar 2005 A1
20050087299 Okabe et al. Apr 2005 A1
20050098906 Satoh et al. May 2005 A1
20060005883 Mudd et al. Jan 2006 A1
20060037644 Nishikawa et al. Feb 2006 A1
20060060139 Meneghini et al. Mar 2006 A1
20060124173 An Jun 2006 A1
20060130755 Clark Jun 2006 A1
20060185746 Doyle Aug 2006 A1
20070089789 Mudd et al. Apr 2007 A1
20070110636 Lee et al. May 2007 A1
20070227659 Iizuka Oct 2007 A1
20080041481 Mudd et al. Feb 2008 A1
20080305014 Honda Dec 2008 A1
20090101217 Ushigusa Apr 2009 A1
20100110399 Lyons May 2010 A1
20100138051 Glime Jun 2010 A1
20100224264 Homan et al. Sep 2010 A1
20100269924 Yasuda Oct 2010 A1
20110108126 Monkowski et al. May 2011 A1
20120116596 Yoneda et al. May 2012 A1
20120132291 Monkowski et al. May 2012 A1
20120180876 Hayashi et al. Jul 2012 A1
20120318383 Yasuda Dec 2012 A1
20130092256 Yasuda et al. Apr 2013 A1
20130092258 Yasuda et al. Apr 2013 A1
20130118596 Horsky May 2013 A1
20130186499 Yada et al. Jul 2013 A1
20140034164 Yasuda Feb 2014 A1
20140069527 Mudd et al. Mar 2014 A1
20140083514 Ding Mar 2014 A1
20140158211 Ding et al. Jun 2014 A1
20140190578 Hayashi Jul 2014 A1
20140230915 Mudd et al. Aug 2014 A1
20140260963 Wang Sep 2014 A1
20150007897 Valentine et al. Jan 2015 A1
20150027558 Kehoe et al. Jan 2015 A1
20150121988 Banares et al. May 2015 A1
20150212524 Kehoe et al. Jul 2015 A1
20150362391 Suzuki et al. Dec 2015 A1
20160011604 Mudd et al. Jan 2016 A1
20160018828 Mudd et al. Jan 2016 A1
20160041564 Mudd et al. Feb 2016 A1
20160124439 Yasuda et al. May 2016 A1
Foreign Referenced Citations (30)
Number Date Country
1816733 Aug 2006 CN
102354228 Feb 2012 CN
103838261 Jun 2014 CN
69535683 Jan 2009 DE
0468793 Jan 1992 EP
0671484 Sep 1995 EP
0689040 Dec 1995 EP
11119835 Apr 1999 JP
2000018407 Jan 2000 JP
2004157719 Jun 2004 JP
3557087 Aug 2004 JP
2004302914 Oct 2004 JP
2007041870 Feb 2007 JP
4137666 Aug 2008 JP
4146746 Sep 2008 JP
2009079667 Apr 2009 JP
4351495 Oct 2009 JP
2009300403 Dec 2009 JP
4572139 Oct 2010 JP
4589846 Dec 2010 JP
4705140 Jun 2011 JP
2011171337 Sep 2011 JP
4974000 Jul 2012 JP
5090559 Dec 2012 JP
5091821 Dec 2012 JP
201414990 Apr 2014 TW
WO8700267 Jan 1987 WO
WO03081361 Oct 2003 WO
WO200401516 Dec 2003 WO
WO2011040409 Apr 2011 WO
Related Publications (1)
Number Date Country
20160011604 A1 Jan 2016 US
Provisional Applications (1)
Number Date Country
61575359 Aug 2011 US
Continuations (1)
Number Date Country
Parent 13590152 Aug 2012 US
Child 14854043 US