The invention relates to an audio device and, more particularly, to an audio device having a thermal control capability and a control method of the audio device.
However, in the conventional audio device 100, the temperature of the speaker 102 is decreased by attenuating the audio signal Dau, but the working voltage for the speaker 102 is still unchanged to cause considerable power consumption. Besides, according to the thermal control method of the audio device 100, the temperature of the speaker 102 is adjusted merely around a preset value to result in unsatisfactory control accuracy.
The invention provides a thermal protection mechanism for a speaker, where the thermal protection mechanism is established by an individual thermal model of the speaker based on the detection of speaker temperature.
The invention also provides a device and method capable of reducing power consumption of a speaker and protecting the speaker.
According to an embodiment of the invention, an audio device having a thermal control capability includes a digital-to-analog converter, an amplifier, a speaker, a power management unit and a temperature sensor. The digital-to-analog converter is configured to convert a digital audio signal into an analog audio signal. The amplifier is coupled to the digital-to-analog converter and configured to amplify the analog audio signal and generate an amplified analog audio signal. The speaker is coupled to the amplifier and configured to broadcast the amplified analog audio signal. The power management unit is configured to provide the amplifier with a first working voltage and provide the digital-to-analog converter with a second working voltage. The temperature sensor is coupled to the speaker and configured to generate a temperature detection signal according to a temperature of the speaker. Wherein, the power management unit adjusts at least one of the first working voltage and the second working voltage according to the temperature detection signal.
According to another embodiment of the invention, a control method of an audio device includes the following steps. First, a highest thermal threshold and a lowest thermal threshold are set for a speaker according to the characteristic of the speaker, and then the temperature of the speaker is detected. When the temperature of the speaker is higher than the highest thermal threshold, a working voltage for the amplifier and/or a working voltage for the digital-to-analog converter are decreased. When the temperature of the speaker is lower than the lowest thermal threshold, the working voltage for the amplifier and/or the working voltage for the digital-to-analog converter are increased until the temperature of the speaker is higher than the lowest thermal threshold.
According to another embodiment of the invention, a control method of an audio device includes the following steps. First, multiple thermal control stages are set according to the characteristic of a speaker, where each of the thermal control stages corresponds to a preset voltage adjustment procedure. Then, the speaker temperature is detected to recognize which thermal control stage the current temperature is located in and to select a corresponding voltage adjustment procedure. The selected voltage adjustment procedure is applied to adjusting a working voltage for an amplifier and/or a working voltage for a digital-to-analog converter.
Accordingly to the above embodiments, the temperature of the speaker can be lowered by decreasing at least one of a first working voltage and a second working voltage generated by a power management unit, without simply attenuating an input audio signal. Therefore, the dissipation of electric power is reduced to achieve the purpose of power saving, and the control accuracy is also improved.
Other objectives, features and advantages of the invention will be further understood from the further technological features disclosed by the embodiments of the invention wherein there are shown and described preferred embodiments of this invention, simply by way of illustration of modes best suited to carry out the invention.
In the following detailed description of the preferred embodiments, reference is made to the accompanying drawings which form a part hereof, and in which are shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology, such as “top,” “bottom,” “front,” “back,” etc., is used with reference to the orientation of the Figure(s) being described. The components of the present invention can be positioned in a number of different orientations. As such, the directional terminology is used for purposes of illustration and is in no way limiting. On the other hand, the drawings are only schematic and the sizes of components may be exaggerated for clarity. It is to be understood that other embodiments may be utilized and structural changes may be made without departing from the scope of the present invention. Also, it is to be understood that the phraseology and terminology used herein are for the purpose of description and should not be regarded as limiting. The use of “including,” “comprising,” or “having” and variations thereof herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. Unless limited otherwise, the terms “connected,” “coupled,” and “mounted” and variations thereof herein are used broadly and encompass direct and indirect connections, couplings, and mountings. Similarly, the terms “facing,” “faces” and variations thereof herein are used broadly and encompass direct and indirect facing, and “adjacent to” and variations thereof herein are used broadly and encompass directly and indirectly “adjacent to”. Therefore, the description of “A” component facing “B” component herein may contain the situations that “A” component directly faces “B” component or one or more additional components are between “A” component and “B” component. Also, the description of “A” component “adjacent to” “B” component herein may contain the situations that “A” component is directly “adjacent to” “B” component or one or more additional components are between “A” component and “B” component. Accordingly, the drawings and descriptions will be regarded as illustrative in nature and not as restrictive.
The digital-to-analog converter 204 is configured to convert a digital audio signal Dau into an analog audio signal Aau.
The amplifier 203 is coupled to the digital-to-analog converter 204. The amplifier 203 is configured to amplify the analog audio signal Aau to generate an amplified analog audio signal AAau that is output to the speaker 202.
The speaker 202 is coupled to the amplifier 203 and configured to broadcast the amplified analog audio signal AAau.
The temperature sensor 205 is coupled to the speaker 202, and is configured to detect a temperature of the speaker 202 and generate a temperature detection signal Td according to the temperature of the speaker 202. In one embodiment, the temperature sensor 205 may detect a temperature of a resistor in the speaker 202. Certainly, among various designs of the speaker 202, the temperature sensor 205 may detect a temperature of other internal component of the speaker 202 or a room temperature inside the speaker 202.
The power management unit 201 is coupled to a power supply voltage VDD. The power management unit 201 is configured to provide the amplifier 203 with a first working voltage Vdd_amp and provide the digital-to-analog converter 204 with a second working voltage Vdd_dac. The power management unit 201 is allowed to adjust at least one of the first working voltage Vdd_amp and the second working voltage Vdd_dac. For example, the power management unit 201 may lower the first working voltage Vdd_amp and/or the second working voltage Vdd_dac to decrease a sound volume of the speaker 202 and hence the temperature of the speaker 202.
Therefore, according to the above embodiment, at least one of the first working voltage Vdd_amp for the amplifier 203 and the second working voltage Vdd_dac for the digital-to-analog converter 204 can be adjusted to decrease the temperature of the speaker 202 and protect the speaker 202 as a result.
When the temperature of the speaker 202 reaches a preset value, the audio device 200a may adjust both of the first working voltage Vdd_amp and the second working voltage Vdd_dac simultaneously or in a time-division manner. Alternatively, the audio device 200a may adjust either the voltage Vdd_amp or the second working voltage Vdd_dac. Besides, the first working voltage Vdd_amp and the second working voltage Vdd_dac may be adjusted to any extent according to actual needs. For example, the first working voltage Vdd_amp and the second working voltage Vdd_dac may be set to be equal or non-equal.
In one embodiment, the audio procession unit 301 may be an equalizer (EQ) or an automatic level controller (ALC). In this embodiment, the audio procession unit 301 may include a gain controller (not shown) to apply gain to an audio signal received by the audio procession unit 301, and the gain may have a fixed value. In an alternate embodiment, the audio procession unit 301 may not include the gain controller.
The up-converter 302 is used to adjust the frequency of an audio signal, and the modulation unit 302b may modulate the frequency of the audio signal to a preset frequency band. The modulated audio signal is digitalized to form a digital audio signal Dau that is to be sent to the digital-to-analog converter 304.
The digital audio signal Dau is supplied to the digital-to-analog converter 304, the amplifier 303, the speaker 302, the power management unit 301a, the power management unit 301b and the audio device 200b to perform subsequent operations similar to afore-mentioned embodiments, which is not explained in further detail here. During operation, the temperature sensor 305 detects a temperature of the speaker 302 to generate a temperature detection signal Tdd, and the temperature detection signal Tdd is sent to the voltage control unit 306. The voltage control unit 306 generates a first voltage control signal Vdd_amp_ctr and a second voltage control signal Vdd_dac_ctr that signal a variation in the temperature of the speaker 202 according to the temperature detection signal Tdd. Then, the first power management unit 301a adjusts the first working voltage Vdd_amp for the amplifier 303 according to the first voltage control signal Vdd_amp_ctr, and the second power management unit 301b adjusts the second working voltage Vdd_dac for the digital-to-analog converter 304 according to the second voltage control signal Vdd_dac_ctr.
In comparison, as shown in
Further, in one embodiment, when the temperature of the speaker is unduly high, the voltage supplied to a digital-to-analog converter may be lowered by a low dropout regulator (LDO) to attenuate an output audio signal and thus lower the sound volume, the power consumption and the temperature of the speaker. Further, under the condition that an output audio signal is not clipped, the voltage supplied to an amplifier may be also lowered to reduce power consumption. According to the above embodiments, the first working voltage for the amplifier and/or the second working voltage for the digital-to-analog converter can be reduced, without attenuating an input signal, to decrease power consumption and prevent the speaker from being overheated.
The control method of an audio device may include the following steps.
Step S502: Start.
Step S504: Set a durable temperature range for a speaker, where the temperature range may depend upon the characteristic of the speaker. An audio device may set a highest thermal threshold and a lowest thermal threshold for the speaker according to the characteristic of the speaker. In one embodiment shown in
Step S506: Detect a temperature of the speaker.
Step S508: Determine whether the temperature is lower than the upper limit (110° C.). If yes, go to Step S512; if no, go to Step S510.
Step: S510: When the temperature sensor detects that the temperature of the speaker is higher than the upper limit, the thermal control process moves to the overdrive stage to trigger a mechanism of voltage attenuation, where the power management unit decreases the first working voltage Vdd_amp for the amplifier and/or the second working voltage Vdd_dac for the digital-to-analog converter. Therefore, the sound volume of the speaker is lowered to decrease the temperature of the speaker; that is, the thermal control process moves at the attenuation stage.
Step S512: Determine whether the temperature is higher than the lower limit (100). If yes, go to Step S516; if no, go to Step S514.
Step S514: When the temperature sensor detects that the temperature of the speaker is smaller than the lower limit, the thermal control process moves to a release stage, where the first working voltage Vdd_amp and/or the second working voltage Vdd_dac is too low to sustain a proper working temperature for the speaker. Therefore, the first working voltage Vdd_amp and/or the second working voltage Vdd_dac should be released to a higher level. That is, in the release stage, the power management unit increases the second working voltage Vdd_dac and/or the first working voltage Vdd_amp to increase the temperature of the speaker and allow the thermal control process to move to a safe stage to achieve a maximum audio output.
Step S516: Determine whether the temperature of the speaker is located between the upper limit and the lower limit to stay in the safe stage of the thermal control process.
Step S518: End.
Note the afore-mentioned four stages are described only for exemplified purposes, and the transition sequence of the four stages can be adjusted according to actual demands. The upper or lower temperature limit mainly depends on the characteristic of the speaker and can be arbitrary selected according to actual demands. Further, the thermal control process is not limited to be divided into four stages, and the number of control stages may vary according to actual demands.
Accordingly to the above embodiments, the temperature of the speaker can be lowered by decreasing the working voltage for at least one of the digital-to-analog converter and the amplifier, without simply attenuating an input audio signal. Therefore, the dissipation of electric power is reduced to achieve the purpose of power saving, and the working temperature of the speaker is decreased to prevent the speaker from being overheated and damaged.
The foregoing description of the preferred embodiments of the invention has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form or to exemplary embodiments disclosed. Accordingly, the foregoing description should be regarded as illustrative rather than restrictive. Obviously, many modifications and variations will be apparent to practitioners skilled in this art. The embodiments are chosen and described in order to best explain the principles of the invention and its best mode practical application, thereby to enable persons skilled in the art to understand the invention for various embodiments and with various modifications as are suited to the particular use or implementation contemplated. It is intended that the scope of the invention be defined by the claims appended hereto and their equivalents in which all terms are meant in their broadest reasonable sense unless otherwise indicated. Therefore, the term “the invention”, “the present invention” or the like does not necessarily limit the claim scope to a specific embodiment, and the reference to particularly preferred exemplary embodiments of the invention does not imply a limitation on the invention, and no such limitation is to be inferred. The invention is limited only by the spirit and scope of the appended claims. The abstract of the disclosure is provided to comply with the rules requiring an abstract, which will allow a searcher to quickly ascertain the subject matter of the technical disclosure of any patent issued from this disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Any advantages and benefits described may not apply to all embodiments of the invention. It should be appreciated that variations may be made in the embodiments described by persons skilled in the art without departing from the scope of the present invention as defined by the following claims. Moreover, no element and component in the present disclosure is intended to be dedicated to the public regardless of whether the element or component is explicitly recited in the following claims.
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