Claims
- 1. A system for transferring material with a workpiece by convection comprising:
- a fluid which chemically reacts with the workpiece;
- supply means including a plurality of supply nozzles;
- return means including a plurality of return nozzles;
- a facesheet coupled to said supply means and said return means and disposed opposite the workpiece for forming a gap therebetween through which said fluid flows;
- the system characterized such that material is added to the workpiece from the fluid flowing through the supply means, the gap and the return means.
- 2. An apparatus for fabricating a pattern on a printed circuit board comprising:
- fluid supply means including a plurality of supply nozzles;
- an etchant fluid return means including a plurality of return nozzles; and
- a facesheet coupled to said fluid supply means and said fluid return means disposed opposite a printed circuit board thereby forming a gap between said facesheet and the printed circuit board, so that when said etchant fluid flows through said fluid supply means and said supply nozzles, a short segment through said gap and through said fluid return nozzles and said fluid return means a pattern is fabricated on the printed circuit board.
- 3. An apparatus as set forth in claim 2, further comprising personalization means disposed for personalizing an area of the printed circuit board contacted by said flowing fluid.
- 4. An apparatus for fabricating a pattern on a printed circuit board comprising:
- fluid supply means including a plurality of supply nozzles;
- fluid return means including a plurality of return nozzles; and
- a facesheet coupled to said fluid supply means and said fluid return means disposed opposite a printed circuit board including a resist pattern thereby forming a gap between said facesheet and the printed circuit board, so that when a fluid flows through said fluid supply means and said supply nozzles, a short segment through said gap and through said fluid return nozzles and said fluid return means a pattern is fabricated on the printed circuit board.
- 5. An apparatus as set forth in claim 4, wherein said fluid adds or subtracts from material located on said printed circuit board.
- 6. An apparatus as set forth in claim 4, further comprising spacer means for determining the gap dimension.
Parent Case Info
This application is a divisional application of co-pending application Ser. No. 07/515,802 filed Apr. 27, 1990; now pending.
US Referenced Citations (5)
Foreign Referenced Citations (2)
Number |
Date |
Country |
196863 |
Oct 1986 |
EPX |
341950 |
Nov 1989 |
EPX |
Non-Patent Literature Citations (2)
Entry |
I.B.M. Technical Disclosure Bulletin, vol. 32, No. 5A Oct. 1989, pp. 153-154. |
Motorola Technical Developments, vol. 7, Oct. 1987, pp. 22--23. |
Divisions (1)
|
Number |
Date |
Country |
Parent |
515802 |
Apr 1990 |
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