Coolant for the treatment and production of wafers

Abstract

The invention relates to a coolant for use in the production and/or treatment of ingots and/or wafers, the coolant containing a surfactant in order to improve the quality of the production or treatment.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a diagram of the current draw during grinding of 100 wafers with a diamond grinding wheel which has a porosity or diamond grit size of 2000 mesh, by a process according to the prior art and with the use of a coolant according to an embodiment of the invention.

FIG. 2 shows a diagram of the current draw during grinding of 100 wafers with a diamond grinding wheel which has a porosity or diamond grit size of 4000 mesh, by a process according to the prior art and with the use of a coolant according to an embodiment of the invention.

FIG. 3 shows a diagram of the current draw during grinding of 100 wafers with a diamond grinding wheel which has a porosity or diamond grit size of 8000 mesh, by a process according to the prior art and with the use of a coolant according to an embodiment of the invention.

Claims

1. A coolant for use in the production and/or treatment of ingots and/or wafers, said coolant comprises at least one surfactant.

2. The coolant as claimed in claim 1, wherein said at least one surfactant is employed in a proportion of from ≧0 to ≦1% by weight of the coolant.

3. The coolant as claimed in claim 1, wherein said coolant is an aqueous solution containing 0.1% by weight of said at least one surfactant, said at least one surfactant having a surface tension of ≦35 mN/m at 20° C. and 0.5 Hz.

4. The coolant as claimed in claim 1, wherein said coolant is a 0.1% by weight solution of said at least one surfactant that has a spread of ≧50 mm.

5. The coolant as claimed in claim 1, wherein said at least one surfactant has a molecular weight of ≦1500 (g/mol).

6. The coolant as claimed in claim 1, wherein said at least one surfactant contains a material having the following structure:

7. The coolant as claimed in claim 1, wherein said at least one surfactant contains a material having the following structure:

8. The coolant as claimed in claim 1, wherein said at least one surfactant contains a material having the following structure:

9. The coolant as claimed in claim 1, wherein said at least one surfactant contains a material having the following structure:

10. The coolant as claimed in claim 1, wherein said at least one surfactant contains a material having the following structure:

11. The coolant as claimed in claim 1, wherein said at least one surfactant contains a material having the following structure:

12. A process for the treatment and/or production of at least one of an ingot and a wafer, comprising contacting said at least one ingot and wafer with a coolant, said coolant comprises at least one surfactant.

13. The process as claimed in claim 12, wherein said at least one surfactant is employed in a proportion of from ≧0 to ≦1% by weight of the coolant.

14. The process as claimed in claim 12, wherein said coolant is an aqueous solution containing 0.1% by weight of said at least one surfactant, said at least one surfactant having a surface tension of ≦35 mN/m at 20° C. and 0.5 Hz.

15. The process as claimed in claim 12, wherein said at least one surfactant contains a material having the following structure:

16. The process as claimed in claim 12, wherein said at least one surfactant contains a material having the following structure:

17. The process as claimed in claim 12, wherein said at least one surfactant contains a material having the following structure:

18. The process as claimed in claim 12, wherein said at least one surfactant contains a material having the following structure:

19. The process as claimed in claim 12, wherein said at least one surfactant contains a material having the following structure:

20. The process as claimed in claim 12, wherein said at least one surfactant contains a material having the following structure: