BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 shows a diagram of the current draw during grinding of 100 wafers with a diamond grinding wheel which has a porosity or diamond grit size of 2000 mesh, by a process according to the prior art and with the use of a coolant according to an embodiment of the invention.
FIG. 2 shows a diagram of the current draw during grinding of 100 wafers with a diamond grinding wheel which has a porosity or diamond grit size of 4000 mesh, by a process according to the prior art and with the use of a coolant according to an embodiment of the invention.
FIG. 3 shows a diagram of the current draw during grinding of 100 wafers with a diamond grinding wheel which has a porosity or diamond grit size of 8000 mesh, by a process according to the prior art and with the use of a coolant according to an embodiment of the invention.