This application claims priority to Chinese Patent Application No. 202321022802.3, filed on Apr. 28, 2023, which is hereby incorporated by reference in its entirety.
The present disclosure relates to, but is not limited to the technical field of cooling devices and, in particular, to a cooling device.
The cooling device achieves heat dissipation of a heating device through heat exchange between a flowing internally fluid and the heating device. A goal pursued by those skilled in the art is to continuously enhance a heat dissipation effect of the cooling device.
In view of this, a problem of the present application is how to enhance the heat dissipation effect of the cooling device.
The present application provides a cooling device with an enhanced heat dissipation effect.
The present application provides a cooling device. The cooling device includes a first plate body and a second plate body, a first surface of the first plate body is provided with a flow channel for accommodating a fluid, the flow channel includes at least two straight segments and at least one bent segment, the at least two straight segments are communicated via the at least one bent segment, and the first surface of the first plate body is in contact with the second plate body.
Herein, the flow channel is configured to have at least two straight segments and at least one bent segment. This is beneficial for increasing an overlapping area between the flow channel and a heating device, thereby promoting heat exchange between the fluid and the heating device, so that the cooling device has an excellent heat dissipation effect.
In some possible implementations, the first plate body and the second plate body are formed by casting.
In these implementations, the first plate body and the second plate body are formed by casting. Due to that the casting can form all flow channels in one casting process, manufacturing time of the cooling device is greatly reduced. In addition, the casting of the first plate body and the second plate body only requires the use of a specific mold, thereby reducing a processing cost of the cooling device. Furthermore, by using different molds, different flow channels can be obtained in the cooling device, thereby it is easy to achieve diverse flow channel arrangements.
In some possible implementations, the first plate body and the second plate body are integrally formed by welding.
In these implementations, the first plate body and the second plate body are integrally formed by brazing, thereby achieving an assembly of the first plate body and the second plate body. In this way, the use of brazing technology improves an assembly speed of the first plate body and the second plate body, further shortening the manufacturing time of the cooling device.
At the same time, the flow channel is configured to have at least two straight segments and at least one bent segment. This is beneficial for increasing the overlapping area between the flow channel and the heating device, thereby promoting heat exchange between the fluid and the heating device, so that the cooling device has a strong heat dissipation effect.
In some possible implementations, an end of the flow channel is provided with an inlet and outlet nozzle, the inlet and outlet nozzle is configured for the fluid entering into and exiting from the flow channel, and the inlet and outlet nozzle is connected to the flow channel at an obtuse angle.
In these implementations, by setting the inlet and outlet nozzle to be connected to the flow channel at an obtuse angle, a flow resistance of the fluid at the inlet and outlet nozzle is reduced, thereby promoting flowing of the fluid in the flow channel.
In some possible implementations, a bottom surface of the flow channel is provided with a micro rib structure.
In these implementations, the micro rib structure provided on the bottom surface of the flow channel can cause disturbance to the fluid flowing in the flow channel. This disturbance can promote heat exchange between the fluid and the heating device, rendering the cooling device to have an excellent heat dissipation effect. In addition, the micro rib structure can also serve as a support between the first plate body and the second plate body, thereby enhancing the strength of the cooling device.
In some possible implementations, there are a plurality of micro rib structures, the plurality of micro rib structures are arranged within the flow channel in a staggered manner.
In these implementations, the plurality of micro rib structures arranged within the flow channel in a staggered manner can further enhance the disturbance of the fluid in the flow channel, so that the cooling device has an excellent heat dissipation effect.
In some possible implementations, a first mounting hole may be provided within the first plate body; the first mounting hole is located in at least one micro rib structure of the plurality of micro rib structures, and the first mounting hole is configured to mount a heating device.
In these implementations, the first mounting hole is provided in the micro rib structure. Due to the fact that micro rib structures can be arranged at different positions in the flow channel, and the micro rib structures can have different sizes and shapes, various positions, sizes, and structures of the micro rib structures can meet the mounting requirements of various heating devices.
In some possible implementations, a first surface of the second plate body may be in contact with the first surface of the first plate body, a strip-shaped protrusion may be provided on the first surface of the second plate body; the strip-shaped protrusion overlaps with a part of the flow channel, and an extension direction of the strip-shaped protrusion is the same as an extension direction of the flow channel.
In these implementations, the strip-shaped protrusion on the first surface of the second plate body allows the flow channel to have different heights and shapes, so that the flow channel can have different cross-section shapes.
It should be understood that the above general descriptions and detailed descriptions in the following are only illustrative and explanatory, and cannot limit the present application.
The accompanying drawings herein, which are incorporated into this specification and form a part of this specification, illustrate embodiments that are in accordance with the present application and are used together with the specification to explain the principles of the present application.
Description of reference signs: 1: cooling device; 10: first plate body; 20: second plate body; 11: flow channel; 11A: straight segment; 11B: bent segment; 12: wall; 13: inlet and outlet nozzle; 14: micro rib structure; 15: first mounting hole; 21: second mounting hole; 13A: uniform segment; 13B: transition segment; H: first height; h: second height; β: transition angle; 22: strip-shaped protrusion.
In the following description, specific details of, for example, structure, device, and technology are proposed for purpose of illustration rather than limitation, in order to thoroughly understand the embodiments of the present application. However, those skilled in the art should be noted that the technical solution of the present application can also be implemented in other embodiments without these specific details. Detailed descriptions of well-known structures, device and methods in other cases are omitted to avoid unnecessary details that may hinder the description of embodiments in the present application.
The embodiment of the present application provides a cooling device. This cooling device can be used for heat dissipating (or cooling) a heating device. In some scenarios, the heating device can be an electronic device. For example, the electronic device can be a central processing unit (CPU), a graphics processing unit (GPU), a digital signal processor (DSP), or other integrated circuit chips. In some scenarios, the heating device can also be an electrical device. For example, the electrical device can be a power module or other electrical devices. It can be understood that the heating device can be any heating equipment, apparatus or device, and the embodiments of the present application have no specific limitation on this.
In this embodiment, the flow channel 11 is configured to have at least two straight segments 11A and at least one bent segment 11B. This is beneficial for increasing an overlapping area between the flow channel 11 and the heating device, thereby promoting heat exchange between the fluid and the heating device and rendering the cooling device 1 to have a strong heat dissipation effect.
In
In this embodiment, the flow channel 11 formed by the at least two straight segments 11A and the least one bent segment 11B can be considered as a “C” shape. In this case, the at least two straight segments 11A are arranged in parallel. The at least two straight segments 11A are communicated at the same end via the at least one bent segment 11B. The at least two straight segments 11A are separated by a wall 12. Therefore, the wall 12 can be referred to as a channel partition.
The first plate body 10 and the second plate body 20 are assembled together. In an embodiment, the first plate body 10 and the second plate body 20 may be formed by casting. Due to that the flow channel 11 is provided within the first surface of the first plate body 10, a development of mold used in the casting needs to take into account the flow channel 11 of the first plate body 10. In an example, the first plate body 10 and the second plate body 20 can be formed by pressure casting. It can be understood that the first plate body 10 and the second plate body 20 can also be made using other casting processes, or a process other than casting. The embodiments of the present application have no specific limitation on this.
Herein, the first plate body 10 and the second plate body 20 are formed by casting. Due to the casting can form all flow channels 11 in one casting process, manufacturing time of the cooling device 1 is greatly reduced. In addition, the casting of the first plate body 10 and the second plate body 20 only requires the use of a specific mold, thereby reducing a processing cost of the cooling device 1. Furthermore, by using different molds, different flow channels 11 can be obtained in the cooling device 1, so that it is easy to achieve diverse flow channel arrangements.
In an embodiment, the first plate body 10 and the second plate body 20 are integrally formed by welding. The first surface of the first plate body 10 is in contact with the first surface of the second plate body 20. In an embodiment, the first plate body 10 and the second plate body 20 can be integrally formed by tunnel brazing. Specifically, materials such as soldering paste, flux and other material are first added to a contact area between the first surface of the first plate body 10 and the first surface of the second plate body 20, and then, a smelting tool is used to press the first plate body 10 and the second plate body 20 together. After pressed together, the first plate body 10 and the second plate body 20 are sent into a tunnel brazing furnace for welding. Here, the first plate body 10 and the second plate body 20 become one piece by brazing, thereby achieving the assembly of the first plate body 10 and the second plate body 20. In this way, the use of brazing process improves an assembly speed of the first plate body 10 and the second plate body 20, thereby further reducing the manufacturing time of the cooling device 1. It can be understood that the first plate body 10 and the second plate body 20 can also be connected using other welding methods such as arc welding, laser beam welding and electric resistance welding, or other methods such as bolt fixation and snap fixation. The embodiments of the present application have no specific limitation on this.
The flow channel 11 is provided within the first surface of the first plate body 10. In other words, the flow channel 11 is a channel provided within the first surface of the first plate body 10 to allow fluid flowing.
In the embodiments of the present application, since the flow channel 11 is C-shaped, the flow channel 11 can occupy as large area as possible on the first surface of the first plate body 10. This is beneficial for increasing the overlapping area between the flow channel 11 and the heating device, thereby promoting heat exchange between the fluid and the heating device, and rendering the cooling device 1 to have a strong heat dissipation effect.
In an embodiment, a bottom surface of the flow channel 11 in the first plate body 1 may be flat. It can be understood that the bottom surface of the flow channel 11 in the first plate body 1 may also have other shapes, and the embodiments of the present application have no specifical limitation on this.
In an embodiment, an end of the flow channel 11 is provided with an inlet and outlet nozzle 13. The inlet and outlet nozzle 13 is used for fluid entering into and exiting from the flow channel 11. The inlet and outlet nozzle 13 is communicated with the flow channel 11 at an obtuse angle.
The inlet and outlet nozzle 13 is tubular and can have various cross-section shapes. For example, the cross-section shape of the inlet and outlet nozzle 13 can be rectangular, square, circular, elliptical, trapezoidal, or other shape.
In an embodiment, as shown in
It can be seen that a transition angle β formed by a top surface of the transition segment 13B and the flow channel 11 is an obtuse angle. Therefore, the inlet and outlet nozzle 13 and the flow channel 11 are considered to be communicated with each other at an obtuse angle.
In the embodiment of the present application, by setting the inlet and outlet nozzle 13 to be communicated with the flow channel 11 at an obtuse angle, a flow resistance of the fluid at the inlet and outlet nozzle 13 is reduced, thereby promoting flowing of the fluid in the flow channel 11.
In an embodiment, a micro rib structure 14 can be provided on a bottom surface of the flow channel 11. Specifically, the micro rib structure 14 is a protrusion part on the bottom and/or side surface of the flow channel 11.
One or more micro rib structures 14 can be provided in the flow channel 11 of the first plate body 10. In most cases, there are a plurality of micro rib structures 14.
In the embodiments of the present application, the micro rib structure 14 provided on the bottom surface of the flow channel 11 can cause a disturbance to the fluid flowing in the flow channel 11. Such disturbance can promote heat exchange between the fluid and the heating device, so that the cooling device 1 has a strong heat dissipation effect.
In an example, as shown in
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In an example, as shown in
It can be understood that the micro rib structures 14 in the flow channel 11 can also be arranged in other ways, and the embodiments of the present application have no specific limitation on this.
In an embodiment, the micro rib structure 14 may be cylindrical in shape. In this case, the extension direction of the micro rib structure 14 can be perpendicular to a plane where the first plate body 1 is located, and a length of the micro rib structure 14 is the same as the height of the flow channel 11. In this way, a top surface of the micro rib structure 14 can be flush with the first surface of the first plate body 10. At this time, the micro rib structure 14 can also serve as a support between the first plate body 10 and the second plate body 20, thereby enhancing the strength of the cooling device 1.
In an example, as shown in
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It can be understood that the micro rib structure 14 can be in other column shapes or in a shape (such as a cone) other than column shape, and the embodiments of the present application have no specific limitation on this.
In the embodiment of the present application, a plurality of micro rib structures 14 arranged within the flow channel 11 in a staggered manner can further enhance the disturbance of the fluid in the flow channel 11, so that the cooling device 1 has a strong heat dissipation effect.
The cooling device 1 in the embodiment of the present application is used for cooling the heating device. For this reason, the first plate body 10 and/or the second plate body 20 can be in contact with the heating device to achieve heat exchange between the fluid in the flow channel 11 and the heating device. In order to achieve a stable heat exchange between the cooling device 1 and the heating device, the heating device can be fixed to the cooling device 1.
In an embodiment, the heating device can be fixed to the cooling device 1 by bonding. In this case, an adhesive can be used to fix the heating device to the cooling device 1.
In an embodiment, the heating device can be fixed to the cooling device 1 by a screw. In this case, the cooling device 1 can be provided with a first mounting hole 15 and a second mounting hole 21 for the screw to pass through. The first mounting hole 15 is located inside the first plate body 10. The second mounting hole 21 is located inside the second plate body 20. The first mounting hole 15 is aligned with the second mounting hole 21. The positions of the first mounting hole 15 and the second mounting hole 21 in the first plate body 10 and the second plate body 20 can be determined based on a mounting position of the heating device.
The first mounting hole 15 is configured to avoid the fluid in the flow channel 11. In an embodiment, the first mounting hole 15 may be located at the wall 12 of the flow channel 11. In an embodiment, the first mounting hole 15 may be located at an edge of the first plate body 10. In an embodiment, the first mounting hole 15 may be located at the micro rib structure 14 in the flow channel 11.
In the embodiment of the present application, the first mounting hole 15 is provided in the micro rib structure 14. Due to the fact that the micro rib structure 14 can be arranged at different positions in the flow channel 11, and the micro rib structure 14 can have different sizes and shapes, various positions, sizes, and structures of the micro rib structure 14 can meet the mounting requirements of various heating devices.
In an embodiment, the first surface of the second plate body 20 can be in contact with the first surface of the first plate body 10, and a strip-shaped protrusion can be provided on the first surface of the second plate body 20. The strip-shape protrusion overlaps with a part of the flow channel 11. An extension direction of the strip-shaped protrusion is the same as that of the flow channel 11.
The strip-shaped protrusion can have multiple arrangement modes.
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In an example, as shown in
It can be understood that the strip-shaped protrusion 22 may also have other arrangements, and the embodiments of the present application have no specific limitation on this.
The strip-shaped protrusions can have multiple cross-section shapes.
In an example, as shown in
In an example, as shown in
It can be understood that the strip-shaped protrusion 22 may also have other cross-section shapes, the embodiments of the present application have no specific limitation on this.
In addition, a height of the strip-shaped protrusion can be set according to actual needs. In an example, the height of the strip-shaped protrusion 22 may be less than or equal to half of the height of the flow channel 11. In an example, the height of the strip-shaped protrusion 22 can be greater than half of the height of the flow channel 11. It can be understood that the height of the strip-shaped protrusion 22 may be smaller than the height of the flow channel 11.
In this implementation, the strip-shaped protrusion 22 on the first surface of the second plate body 20 allows the flow channel 11 to have different heights and shapes, so that the flow channel 11 can have different cross-section shapes.
It should be noted that the first plate body 10 and the second plate body 20 of the cooling device 1 in the embodiments of the present application can be formed of aluminum alloy or other metal materials, and the embodiments of the present application have no specific limitation on this.
In addition, after obtaining the cooling device 1 by pressure casting and brazing, subsequent processing and treatment of the cooling device 1 can be carried out. These processing and treatment include but are not limited to thread processing and surface treatment.
After the production of the cooling device 1 is completed, it is necessary to test the cooling device 1. A thickness of the wall 12 in the first plate body 10 of the cooling device 1 and the subsequent testing pressure for the cooling device 1 are all related to specific requirements.
The above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit the present application. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. These modifications or substitutions do not depart the essence of the corresponding technical solutions from the spirit and scope of the technical solutions in the embodiments of the present application, and should be included in the protection scope of the present application.
Number | Date | Country | Kind |
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2023210228023 | Apr 2023 | CN | national |