This application claims priority to Japanese Patent Application No. 2015-131396 filed on Jun. 30, 2015, the entire contents of which are incorporated by reference herein.
This disclosure relates to a cooling mechanism and an image forming apparatus, and more specifically to a technology for cooling a unit or a component forming an image forming apparatus.
Following an increase in the number of functions and downsizing of an image forming apparatus, there have been increasing needs for efficiently cooling an inside of the apparatus while adequately arranging a large number of units and components forming the image forming apparatus in a narrow space.
Thus, for example, an image forming apparatus has been suggested which has an electric circuit dispersed on a plurality of circuit boards and arranges each of the circuit boards in their respective storage spaces. An image forming apparatus has also been suggested which has a duct provided between a fixing unit and a process unit and has air flow through the duct to prevent an influence of heat of the fixing unit imposed on the process unit. Further known is an image forming apparatus which efficiently cools a plurality of cooled objects by directing blowing air from a single fan to the cooled object or guiding this air to the cooled object through the duct.
As one aspect of this disclosure, a technology obtained by further improving the technology described above will be suggested.
A cooling mechanism according to one aspect of this disclosure is a cooling mechanism used for cooling, as a cooled object, either of a unit and a component forming an image forming apparatus.
The cooling mechanism includes: a fan, a fan-attached part, and a duct semi-completed part.
The fan-attached part is formed on the frame in a manner such as to permit fan attachment thereto.
The duct semi-completed part is provided on the frame for forming a duct introducing, to the cooled object, cooling wind generated by the fan attached to the fan-attached part, and has one non-formed wall part.
Further, a circuit board can be attached to a portion of the non-formed wall part of the duct semi-completed part, and the duct is formed by the attached circuit board and the duct semi-completed part.
An image forming apparatus according to one aspect of this disclosure includes: the cooling mechanism, and an image formation section performing image formation on a recording medium.
Hereinafter, an embodiment of this disclosure will be described with reference to the drawings.
As shown in
The operation section 47 accepts instructions, such as an image formation operation execution instruction, from an operator, and also includes a display section 473 displaying, for example, an operation guide to the operator.
The image formation section 120, based on image data, forms a toner image on a recording paper P supplied from the paper feed section 14.
Image formation units 12M, 12C, 12Y, and 12Bk of the image formation section 120 each include: a photoconductive drum 122, a neutralization section neutralizing a surface of the photoconductive drum 122; a cleaning blade cleaning the surface of the photoconductive drum 122; a charging section evenly charging the surface of the photoconductive drum 122; an exposure section 123 exposing the surface of the photoconductive drum 122 to light and then forming an electrostatic latent image thereon; a developing section developing the electrostatic latent image on the surface of the photoconductive drum 122 into a toner image; and a primary transfer roller 126.
Onto an intermediate transfer belt 125, the respective toner images formed by the image formation units 12M, 12C, 12Y, and 12Bk are transferred by the primary transfer roller 126. The toner images of respective color components transferred in this manner are superposed on each other on the intermediate transfer belt 125 through transfer timing adjustment, turning into a color toner image. By a secondary transfer roller 210, this color toner image is secondarily transferred at a nip part N onto the recording paper P conveyed from the paper feed section 14 through a conveyance path 190. Then the fixing section 13 fixes the toner image on the recording paper P thereon through thermal compression. The recording paper P on which the color image already subjected to the fixing processing has been formed is discharged from a discharge tray 151.
Next, a cooling mechanism 51 will be described in detail.
The cooling mechanism 51 is used for cooling, as a cooled object, units or its components forming the image forming apparatus 1. The cooling mechanism 51 is attached to the main body frame 52 to be part of the image forming apparatus 1. The cooling mechanism 51 includes: a sub-frame (one example of a frame in the scope of the claims 53, a fan-attached part 55, and a duct semi-completed part 54.
The main body frame 52 shown in
As shown in
To the fan-attached part 55, a fan 58 is attached as shown in
Here, upon operation of the fan 58 as shown in
When the circuit board 50 is attached to the duct semi-completed part 54 as described above, a cooled object on the circuit board 50, for example, an electronic component required to be cooled is included by the duct 57 formed by the upper wall part 54a, the lower wall part 54b, and the terminal end wall part 54c. That is, the duct 57 is so shaped as to include the cooled object on the carrier 50 therein. Upon flow of the air inside of the duct 57, the circuit board 50 is cooled, and, for example, components mounted on the circuit board 50 are also cooled.
Further, in the cooling mechanism 51, the circuit board 50 is also used as the side wall part of the duct 57, thus achieving space saving by an amount corresponding to the circuit board 50.
As described above, in this embodiment, by use of the single fan 58 and the duct 57, the intermediate transfer belt 125, each photoconductive drum 122, and the circuit board 50 arranged inside of the image forming apparatus 1 can be cooled, and the circuit board 50 is also used as the side wall part of the duct 57, thus achieving the space saving.
Next, processes of manufacturing the image forming apparatus 1 of this embodiment will be described with reference to a flowchart shown in
The processes of manufacturing this image forming apparatus 1 is based on assumption that while manufacturing the image forming apparatus 1 with basic configuration as shown in
For example, upon manufacture of the image forming apparatus 1 with only the basic functions, the circuit board 50 does not have to be attached (“NO” in step S11), the cooling mechanism 51 does not have to be attached either (“NO” in step S12). Thus, as shown in
Moreover, upon manufacture of a high-function image forming apparatus 1 with units added and an increased process speed, the circuit board 50 needs to be attached (“YES” in step S11), and the cooling mechanism 51 also needs to be attached (“YES” in , step S14). Thus, as shown in
Further, upon manufacture of the image forming apparatus 1 with units added but without an increased process speed, the circuit board 50 needs to be attached (“YES” in step S11), but the cooling mechanism 51 does not have to be attached (“NO” in step S14). Thus, as shown in
Moreover, upon manufacture of the image forming apparatus 1 without units added but with an increased process speed, the circuit board 50 does not have to be attached (“NO” in step S11), but the cooling mechanism 51 needs to be attached (“YES” in step S12). Thus, as shown in
Selection or non-selection among the respective processes for attaching the circuit board 50, the fan 58, and the duct dedicated wall part 57b to the sub frame 53 makes it easy to support the functional changes of the image forming apparatus 1. Moreover, the selective attachment of the circuit board 50 and the duct dedicated wall part 57b avoids waste of a component, achieving space saving.
For example, the image forming apparatus indicated in the Background has a plurality of circuit boards independently provided in their respective dedicated components, and thus is limited in space saving. Similarly, the current image forming apparatus has the duct itself as one dedicated component, and thus is limited in space saving.
On the contrary, in the embodiment described above, the circuit board 50 is also used as part of the duct 57A, thus making it possible to achieve further space saving.
Moreover, the configuration and processing described with reference to
Number | Date | Country | Kind |
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2015-131396 | Jun 2015 | JP | national |