This patent application claims the benefit of U.S. patent application Ser. No. 11/932,479, filed Oct. 31, 2007, entitled COOLING SYSTEM FOR VARIABLE SPEED DRIVES AND INDUCTORS, for which priority is claimed and the disclosure of which is hereby incorporated by reference.
The present application relates generally to variable speed drives. The application relates more specifically to a liquid-cooled power semiconductor module in a variable speed drive.
Variable speed drives (VSDs) used for heating, ventilation, air-conditioning and refrigeration (HVAC&R) situations typically use metal, for example, copper, cooling members or cooling blocks for mounting and thermal management of insulated gate bipolar transistor (IGBT) semiconductor switches. The metal cooling blocks are expensive due to high material and labor costs associated with manufacturing such as machining. VSDs may also use plastic cooling blocks for cooling, which reduce materials costs, but plastic cooling blocks do not reduce labor costs, since the plastic cooling blocks also require machining. Plastic cooling blocks typically are not suitable for injection molding processes for manufacturing because of their large size and low annual usage quantities. The size of a particular cooling block is determined by the number of components, for example, modules, which are mounted to the cooling block. A cooling block may be mounted to two, to as many as six or more modules. Each module mounted to the cooling block requires multiple channels to be machined into the cooling blocks, forming a tub. Thus, a single cooling block may have six or more tubs, depending on the number of modules mounted thereto. Due to the physical size of the cooling block, the process of injection molding to form the cooling blocks is rendered impractical. Also, VSDs covering applications ranging from low horsepower to high horsepower require cooling blocks with two to six tubs. In such applications, low quantities of each individual size are used, thereby causing large costs for injection molding each individual sized cooling block.
One embodiment of the present invention relates to a variable speed drive with a component that generates heat during operation of the drive and a base with a surface for receiving the component. The base also has a tub formed in the surface of the base and a passageway formed in the base and configured to receive fluid therethrough. A portion of the fluid flowing through the passageway is diverted to the tub and the fluid provides cooling to the component. The base is manufactured from an injection molding process.
Another embodiment of the present invention relates to a variable speed drive with a base with a surface for receiving a component. The base also has a tub formed in the surface of the base and a passageway formed in the base and configured to receive fluid therethrough. A portion of the fluid flowing through the passageway is diverted to the tub and the fluid provides cooling to the component. The base is manufactured from an injection molding process.
Yet another embodiment of the present invention relates to a variable speed drive having at least two components that generate heat during operation of the drive and at least two bases having a surface configured to receive the at least two components. Each base has a tub formed in the surface of the base and a passageway formed in the base for receiving fluid therethrough. A portion of the fluid flowing through the passageway is diverted to the tub and the fluid provides cooling to a component. The at least two bases are manufactured from an injection molding process and the at least two bases are connected to form a continuous passageway therethrough.
Compressor 28 compresses a refrigerant vapor and delivers the vapor to condenser 30 through a discharge line. Compressor 28 can be any suitable type of compressor, for example, a screw compressor, a centrifugal compressor, a reciprocating compressor, a scroll compressor, etc. The refrigerant vapor delivered by compressor 28 to condenser 30 enters into a heat exchange relationship with a fluid, for example, air or water, and undergoes a phase change to a refrigerant liquid as a result of the heat exchange relationship with the fluid. The condensed liquid refrigerant from condenser 30 flows through an expansion device (not shown) to evaporator 32.
Evaporator 32 may include connections for a supply line and a return line of a cooling load. A secondary liquid, for example, water, ethylene, calcium chloride brine or sodium chloride brine, travels into evaporator 32 via return line and exits evaporator 32 via supply line. The liquid refrigerant in evaporator 32 enters into a heat exchange relationship with the secondary liquid to lower the temperature of the secondary liquid. The refrigerant liquid in evaporator 32 undergoes a phase change to a refrigerant vapor as a result of the heat exchange relationship with the secondary liquid. The vapor refrigerant in evaporator 32 exits evaporator 32 and returns to compressor 28 by a suction line to complete the cycle. It is to be understood that any suitable configuration of condenser 30 and evaporator 32 can be used in system 10, provided that the appropriate phase change of the refrigerant in the condenser 30 and evaporator 32 is obtained.
System 10 may include many other features that are not shown in
A variety of different cooling fluids, including water and known refrigerants can be introduced to cooling members 42 and used to cool the electronic components. In addition, a variety of different cooling system, such as known heat exchangers, can be used to cool the cooling fluid that is applied to and exits from cooling members 42.
Cooling member 42 cools modules used to power a motor or compressor of an HVAC system. The modules are fixed to the cooling member 42 in a sealed relationship. The cooling fluid applied to cooling member 42 is preferably water that flows through cooling member 42 and a heat exchanger in a closed loop. The heat exchanger cools the water before it is reintroduced to cooling member 42. Preferably, the heat exchanger is a shell and tube type heat exchanger where water from a cooling tower of the HVAC system is used to cool the water applied to cooling member 42.
In one embodiment, shown in
Base 44 has a tub 41 formed in top surface 48 for providing cooling to a component (not shown). A portion of cooling fluid flowing through inlet passageway 47 is diverted through a tub inlet 51, across tub 41, and discharged through a tub outlet 53. The cooling fluid then flows through outlet passageway 49. Cooling fluid flowing across tub 4 land has direct contact with a component (not shown). The cooling fluid exchanges heat with the component to cool the component.
Base 44 has at least one mounting aperture 62 for mounting a component (not shown) to base 44. In addition, base 44 may have at least one VSD mounting aperture 64 for mounting base 44 to an assembly (not shown) of VSD 26. A fastener (not shown), for example, a screw, may be used to secure base 44 to the component (not shown) and VSD 26. Other types of fasteners may be used. Base 44 also has through hole 66, intended for a throughbolt or other suitable fastener to secure and hold together multiple bases 44 for multiple components. When the throughbolt secures multiple bases 44 together, the o-rings or other suitable sealing devices are compressed in grooves 68, which creates a seal between adjacent bases 44.
While only certain features and embodiments of the invention have been illustrated and described, many modifications and changes may occur to those skilled in the art (For example, variations in sizes, dimensions, structures, shapes and proportions of the various elements, values of parameters (For example, temperatures, pressures, etc.), mounting arrangements, use of materials, colors, orientations, etc.) without materially departing from the novel teachings and advantages of the subject matter recited in the claims. The order or sequence of any process or method steps may be varied or re-sequenced according to alternative embodiments. It is, therefore, to be understood that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the invention. Furthermore, in an effort to provide a concise description of the exemplary embodiments, all features of an actual implementation may not have been described (For example, those unrelated to the presently contemplated best mode of carrying out the invention, or those unrelated to enabling the claimed invention). It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation specific decisions may be made. Such a development effort might be complex and time consuming, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure, without undue experimentation.
Number | Name | Date | Kind |
---|---|---|---|
3593103 | Chandler et al. | Jul 1971 | A |
4308491 | Joyner, Jr. et al. | Dec 1981 | A |
4587474 | Espelage et al. | May 1986 | A |
4628991 | Hsiao et al. | Dec 1986 | A |
4758771 | Saito et al. | Jul 1988 | A |
5005640 | Grote et al. | Apr 1991 | A |
5081368 | West | Jan 1992 | A |
5111280 | Iversen | May 1992 | A |
5123080 | Gillett et al. | Jun 1992 | A |
5127085 | Becker et al. | Jun 1992 | A |
5199487 | DiFrancesco et al. | Apr 1993 | A |
5203401 | Hamburgen et al. | Apr 1993 | A |
5220804 | Tilton et al. | Jun 1993 | A |
5293070 | Burgess et al. | Mar 1994 | A |
5298848 | Ueda et al. | Mar 1994 | A |
5316075 | Quon et al. | May 1994 | A |
5317805 | Hoopman et al. | Jun 1994 | A |
5410230 | Bessler et al. | Apr 1995 | A |
5463528 | Umezawa | Oct 1995 | A |
5539617 | Bochtler | Jul 1996 | A |
5592058 | Archer et al. | Jan 1997 | A |
5631821 | Muso | May 1997 | A |
5646458 | Bowyer et al. | Jul 1997 | A |
5675473 | McDunn et al. | Oct 1997 | A |
5747955 | Rotunda et al. | May 1998 | A |
5796234 | Vrionis | Aug 1998 | A |
5869946 | Carobolante | Feb 1999 | A |
5936855 | Salmon | Aug 1999 | A |
5969966 | Sawa et al. | Oct 1999 | A |
6005362 | Enjeti et al. | Dec 1999 | A |
6031751 | Janko | Feb 2000 | A |
6034872 | Chrysler et al. | Mar 2000 | A |
6072302 | Underwood et al. | Jun 2000 | A |
6118676 | Divan et al. | Sep 2000 | A |
6124632 | Lo et al. | Sep 2000 | A |
6160722 | Thommes et al. | Dec 2000 | A |
6166937 | Yamamura et al. | Dec 2000 | A |
6213195 | Downing et al. | Apr 2001 | B1 |
6239513 | Dean et al. | May 2001 | B1 |
6257320 | Wargo | Jul 2001 | B1 |
6276148 | Shaw | Aug 2001 | B1 |
6313600 | Hammond et al. | Nov 2001 | B1 |
6348775 | Edelson et al. | Feb 2002 | B1 |
6434003 | Roy et al. | Aug 2002 | B1 |
6457542 | Hosono et al. | Oct 2002 | B1 |
6487096 | Gilbreth et al. | Nov 2002 | B1 |
6559562 | Rostron | May 2003 | B1 |
6686718 | Jadric et al. | Feb 2004 | B2 |
6719039 | Calaman et al. | Apr 2004 | B2 |
6768284 | Lee et al. | Jul 2004 | B2 |
6801019 | Haydock et al. | Oct 2004 | B2 |
6867970 | Muller et al. | Mar 2005 | B2 |
6961244 | Tsuchiya et al. | Nov 2005 | B2 |
7025607 | Das et al. | Apr 2006 | B1 |
7031161 | Miettinen et al. | Apr 2006 | B2 |
7081734 | Jadric et al. | Jul 2006 | B1 |
7173823 | Rinehart et al. | Feb 2007 | B1 |
7177153 | Radosevich et al. | Feb 2007 | B2 |
7210304 | Nagashima | May 2007 | B2 |
7212406 | Kaishian et al. | May 2007 | B2 |
7289329 | Chen et al. | Oct 2007 | B2 |
7301772 | Tilton et al. | Nov 2007 | B2 |
7511942 | Thrap | Mar 2009 | B2 |
7522403 | Rinehart et al. | Apr 2009 | B1 |
20020186545 | Fukada et al. | Dec 2002 | A1 |
20030015873 | Khalizadeh et al. | Jan 2003 | A1 |
20030052544 | Yamamoto et al. | Mar 2003 | A1 |
20030133267 | Beihoff et al. | Jul 2003 | A1 |
20050052848 | Hamman | Mar 2005 | A1 |
20050057210 | Ueda et al. | Mar 2005 | A1 |
20050068001 | Skaug et al. | Mar 2005 | A1 |
20050162875 | Rodriguez et al. | Jul 2005 | A1 |
20060209512 | Taniguchi et al. | Sep 2006 | A1 |
20070063668 | Schnetzka et al. | Mar 2007 | A1 |
20070177352 | Monfarad et al. | Aug 2007 | A1 |
20070230127 | Peugh et al. | Oct 2007 | A1 |
20070253164 | Matsuo et al. | Nov 2007 | A1 |
20080310109 | Park et al. | Dec 2008 | A1 |
20090141419 | Pal et al. | Jun 2009 | A1 |
Number | Date | Country |
---|---|---|
33 29 325 | Mar 1984 | DE |
37 44 353 | Apr 1989 | DE |
0272776 | Jun 1988 | EP |
0283954 | Sep 1988 | EP |
0313366 | Apr 1989 | EP |
0422221 | Apr 1991 | EP |
0603860 | Jun 1994 | EP |
0734198 | Sep 1996 | EP |
1300937 | Apr 2003 | EP |
1770774 | Apr 2007 | EP |
2 355 266 | Jan 1978 | FR |
2715773 | Aug 1995 | FR |
60-037756 | Feb 1985 | JP |
62-142021 | Jun 1987 | JP |
4-026374 | Jan 1992 | JP |
5-068376 | Mar 1993 | JP |
5-327257 | Dec 1993 | JP |
5-335769 | Dec 1993 | JP |
6-105563 | Apr 1994 | JP |
7-335798 | Dec 1995 | JP |
8-167529 | Jun 1996 | JP |
11-346480 | Dec 1999 | JP |
2000-058746 | Feb 2000 | JP |
2000-323635 | Nov 2000 | JP |
2001-126948 | May 2001 | JP |
2002-176767 | Jun 2002 | JP |
9314559 | Jul 1993 | WO |
9732168 | Sep 1997 | WO |
Number | Date | Country | |
---|---|---|---|
20090241575 A1 | Oct 2009 | US |