Patent Application
20160234965
This application claims priority to Chinese Patent Application No. 201510067807.1 filed on Feb. 10, 2015 in the China Intellectual Property Office, the contents of which are incorporated by reference herein.
The disclosure generally relates to a cooling module.
With the development of electronic science and technology, electronic devices work more quickly by using electronic components which consume high power. However, these high-power electronic components generate more heat when running In order to quickly dissipate the heat, radiators are installed to cool the electronic components.
Many aspects of the embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts have been exaggerated to better illustrate details and features of the present disclosure.
The term “substantially” is defined to be essentially conforming to the particular dimension, shape, or other feature that the term modifies, such that the component need not be exact. For example, “substantially cylindrical” means that the object resembles a cylinder, but can have one or more deviations from a true cylinder. The term “comprising” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series and the like.
The radiator 40 includes an heat sink 41, a heat pipe 42 and a radiator portion 43. The heat sink 41 includes a base plate 411 and a plurality of fins 45 fixed on the base plate 411. Three fixing portions 412 are located around the base plate 411. The fixing portion 412 defines a through hole 413. One fixing piece 45 can pass through the through hole 413 and be inserted into the fixing hole 211 to fix the radiator 40 on the motherboard 21. The fins 415 are parallel to each other and are substantially perpendicular to the base plate 411.
One end of the heat pipe 42 is received in the heat sink 41 and another end of the heat pipe 42 is received in the radiator portion 43. The heat pipe 42 receives coolant (not shown). The coolant can absorb heat of the heat sink 41 and transfer heat to the radiator portion 43. The radiator portion 43 is fixed on the motherboard 21.
The fan module 50 includes a fixing bracket 51 and a cooling fan 55 received in the fixing bracket 51. A plurality of securing members 52 can pass through the fixing bracket 51 to fix the fan module 50 on the motherboard 21. The fixing bracket 51 defines a plurality of openings 511 and an air vent 512. The radiator portion 43 is aligned with the air vent 512. Airflow can enter into the fan module 50 through the opening 511 and exit the fan module 50 via the air vent 512.
The heat dissipating member 60 includes an absorption end 61 and a radiating end 62. The absorption end 61 can be fixed on the heat sink 41. The absorption end 61 defines three notches 611. The radiating end 62 is covering the fan module 50 and is aligned with the opening 511. A gap is formed between the radiating end 62 and the opening 511 which is configured to let the airflow pass through. The absorption end 61 is near to the heat sink 41 to absorb heat of the heat sink 41 and transfer the heat to the radiating end 62.
When the electronic component 25 is working, the base plate 411 absorbs the heat of the electronic component 25 and transfers the heat to the fins 415. Some of heat of the fins 415 is transferred to the heat pipe 42 and some of heat of the fins 415 is transferred to the absorption end 61. The coolant within the heat pipe 42 absorbs heat and transfers heat to the radiator portion 43. The absorption end 61 transfers heat to the radiating end 62. Airflow enters into the chassis through the air inlets 221, and enters into the fan module 50 after passing through the radiating end 62. Then, the airflow passes through the air vents 512 and the radiator portion 43 under the drive of cooling fan 55. Finally, the airflow leaves the chassis 10 from the air outlets 231 to dissipate heat from the electronic component 25.
It is to be understood, however, that even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in the matters of shape, size, and arrangement of parts within the principles of the present disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201510067807.1 | Feb 2015 | CN | national |
