Patent Application
20240328726
The present disclosure relates to field of cooling structure technology, particularly to a cooling panel and a cooling device having the cooling panel.
A water-cooled plate is used mainly to facilitate heat dissipation in the new energy vehicle chip module. In the existing technology, the water-cooled plate is directly in contact with the heat source, and the heat is transferred by the heat source to the cooling column on the water-cooled plate and then transferred away by the fluid. In the working process of the water-cooled plate, with the contact of the fluid and the heat dissipation column, the temperature of the fluid itself is becoming higher after each step, which may cause heat to accumulate in the back half of the water-cooled plate flow path, thereby affecting the heat dissipation efficiencies.
Many aspects of the disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
In order to make the above-mentioned objects, features and advantages of the present application more obvious, a detailed description of specific embodiments of the present application will be described in detail with reference to the accompanying drawings. A number of details are set forth in the following description so as to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the contents of the present application. Therefore, the present application is not to be considered as limiting the scope of the embodiments described herein.
Several definitions that apply throughout this disclosure will now be presented.
The term “coupled” is defined as coupled, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections. The connection may be such that the objects are permanently coupled or releasably coupled. The term “substantially” is defined to be essentially conforming to the particular dimension, shape, or other feature that the term modifies, such that the component need not have that exact feature. The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like.
Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one skilled in the art. The terms used in a specification of the present application herein are only for describing specific embodiments and are not intended to limit the present application. The terms “and/or” used herein includes any and all combinations of one or more of associated listed items.
The application provides a cooling panel 100, including a panel body 1 and a plurality of heat dissipation columns 2. The plurality of heat dissipation columns 2 is arranged at an interval on a surface of the panel body 1. The plurality of heat dissipation columns 2 is configured for heat exchange with a heat dissipation medium. Along a flow direction of the heat dissipation medium, a spacing between adjacent heat dissipation columns 2 of part of the plurality of heat dissipation columns 2 is less than a spacing between the adjacent heat dissipation columns 2 of the other part of plurality of heat dissipation columns 2.
By adjusting the spacing between the heat dissipation columns 2, the flow velocity of the heat dissipation medium can be increased and the contact area between the heat dissipation medium and the heat dissipation columns 2 can be enlarged in the region where the spacing between the heat dissipation columns 2 is smaller. This facilitates the heat dissipation medium to remove heat from the heat dissipation plate 100 through heat exchange, reducing thermal resistance and preventing heat accumulation in the flow channel.
Some embodiments of the present application are described in detail. In the case of no conflict, the following embodiments and the features in the embodiments can be combined with each other.
Referring to
Specifically, the plurality of heat dissipation columns 2 are arranged in a plurality of lines, and along the flow direction of the heat dissipation medium, a spacing d between the two adjacent lines of heat dissipation columns 2 in a front section of the flow channel is defined as a first spacing, a spacing d′ between the two adjacent lines of heat dissipation columns 2 in a rear section of the flow channel is defined as a second spacing, and the first spacing is greater than the second spacing. That is, along the direction A, spacings between two adjacent lines of heat dissipation column 2 gradually decreases, so that the density of heat dissipation column 2 gradually increases along the direction of heat dissipation medium flow.
The plurality of heat dissipation columns 2 is set to be sparse to dense along the flow direction of the heat dissipation medium. In the front section of the flow channel, a temperature of the heat dissipation medium is low, a heat exchange capacity of the heat dissipation medium is strong, and the low density of the heat dissipation column 2 can prevent pressure drop of the heat dissipation medium from being too large. In the rear section of the flow channel, the temperature of the heat dissipation medium that has been superheated exchange with the heat dissipation column 2 in the front section of the flow channel increases, and the heat exchange capacity of the heat dissipation medium is weakened. Increasing the density of the heat dissipation column 2 in the rear section of the flow channel can increase a total heat dissipation area of the heat dissipation column 2 in the rear section of the flow channel, a flow velocity of the heat dissipation medium is also increased. Thereby facilitating heat exchange to remove heat, reducing thermal resistance, and preventing heat accumulation in the rear section of the flow channel, improving the heat dissipation performance of heat dissipation plate 100.
Furthermore, the heat dissipation columns 2 of two adjacent lines are interlaced. In other words, in two adjacent lines, any heat dissipation column 2 in one line corresponds to a gap set between heat dissipation columns 2 of the other line. In this way, during the flow of the heat dissipation medium, each heat dissipation column 2 can fully contact and exchange heat with the heat dissipation medium, which is conducive to improving the heat dissipation effect. In the embodiment shown in
In one embodiment, the spacing d or d′ between adjacent heat dissipation columns 2 varies from 2.55 to 1 mm along the flow direction of heat dissipation medium flow. The density of the heat dissipation column 2 can be changed according to the heat exchange capacity of the heat dissipation medium in the cooling panel 100. While improving the heat dissipation efficiency and reducing the local temperature difference of the cooling panel 100, the heat dissipation medium can also flow smoothly in the cooling panel 100, and the influence on the pressure drop is minimal.
Referring to
In the embodiment shown in
In one embodiment, a cross section of the first heat dissipation column 21 is roughly circular, and a cross section of the second heat dissipation column 22 is roughly diamond shaped. When the heat dissipation medium flows through edges of the second heat dissipation column 22 of the diamond-shaped column structure, the edges of the diamond-shaped structure can assist in squeezing the heat dissipation medium and improve the flow velocity of the heat dissipation medium. In other embodiments, the cross section of the second heat dissipation column 22 can also be triangular, rectangular, trapezoid, polygon, oval, etc., to realize effect of increasing the flow velocity of the heat dissipation medium, the cross section shape of the second heat dissipation column 22 is not limited in the application.
Furthermore, a side of the panel body 1 away from the heat dissipation columns 2 is used to contact a plurality of heat sources and absorb heat generated by the plurality of heat sources. Gaps between the second heat dissipation columns 22 and the adjacent heat sources is set accordingly, which is conducive to improve heat dissipation effect of the cooling panel 100 on plurality of heat sources and reduce the problem of large temperature rise of the heat source located at rear area of the flow channel.
In one embodiment, the first heat dissipation columns 21 in the first region 23, the second region 24 and the third region 25 may also be arranged from thin to dense in the flow direction of the heat dissipation medium. That is, the distance between the adjacent first heat dissipation column 21 in the first region 23 is greater than the distance between the adjacent first heat dissipation column 21 in the second region 24, and the distance between the adjacent first heat dissipation column 21 in the second region 24 is greater than the distance between the adjacent first heat dissipation column 21 in the second region 24. Alternatively, the distance between the adjacent first heat dissipation column 21 in each region gradually decreases along the flow direction of the heat dissipation medium. It is beneficial to increase the heat dissipation area and further improve the heat dissipation efficiency while increasing the flow velocity of the heat dissipation medium. Alternatively, the distances between plurality of first heat dissipation columns 21 in the three regions gradually decreases along the flow direction of heat dissipation medium.
Referring to
Furthermore, a first hole 203 and a second hole 204 are defined on the housing 202, and the first hole 203 and the second hole 204 are arranged at opposite sides of the housing 202 respectively. The first hole 203 is configured to import the heat dissipation medium, and the second hole 204 is configured to export the heat dissipation medium, to drive a directional flow of the heat dissipation medium in the inner cavity of the housing 202.
It is to be understood, even though information and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the present embodiments, the disclosure is illustrative only; changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the present embodiments to the full extent indicated by the plain meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202320714052.X | Mar 2023 | CN | national |
