The present invention relates generally to the removal from heat from electronic devices. More specifically, the present invention relates to an improved cooling structure that removes heat from an enclosure such as a projection television system.
This section is intended to introduce the reader to various aspects of art, which may be related to various aspects of the present invention that are described and/or claimed below. This discussion is believed to be helpful in providing the reader with background information to facilitate a better understanding of the various aspects of the present invention. Accordingly, it should be understood that these statements are to be read in this light, and not as admissions of prior art.
Many components that make up electronic devices or systems such as projection televisions generate heat during normal operation. It is typically desirable to disperse generated heat to prevent overheating and facilitate efficient operation of the system. An example of an electronic component that generates a large amount of heat in an associated system is a high power lamp in a digital light projection (DLP) or liquid crystal display (LCD) television system. The high power lamp is used to generate a video display for viewing by a user.
Many systems comprise enclosures into which electrical and/or electronic components are placed in very close proximity to reduce overall system size. In such systems, space within the enclosure is at a premium. Dispersing heat from a high-power lamp disposed in a relatively confined television system enclosure is a difficult challenge.
This problem is compounded by a further need to meet standard requirements on many consumer electronic devices. For example, rigorous standards on many aspects of device operation are imposed by organizations such as Underwriters Laboratories (UL). One such requirement relates to the temperature of external surfaces of the device, which must remain cool enough to prevent injury to users of the system. This means that heat may not be dispersed from a device through an external surface at a rate that would cause the temperature of the external surface to exceed maximum UL temperature requirements.
An additional design constraint is overall system cost. Materials that are able to effectively disperse heat while remaining cool are relatively expensive. A system and method that effectively disperses heat generated in an enclosure in a cost-effective manner while also facilitating compliance with external surface temperature requirements is desirable.
Certain aspects commensurate in scope with the disclosed embodiments are set forth below. It should be understood that these aspects are presented merely to provide the reader with a brief summary of certain forms the invention might take and that these aspects are not intended to limit the scope of the invention. Indeed, the invention may encompass a variety of aspects that may not be set forth below.
The disclosed embodiments relate to a system and method that is adapted to cool a heat generating device. An electronic device in accordance with an exemplary embodiment of the present invention comprises an enclosure that contains a source of heat, and a cooling structure adjacent to the enclosure, the cooling structure being adapted to draw an internal intake comprising heat generated by the source of heat and to draw an external intake from outside the enclosure, the cooling structure being further adapted to combine the internal intake with the external intake to form an exhaust.
Advantages of the invention may become apparent upon reading the following detailed description and upon reference to the drawings in which:
One or more specific embodiments of the present invention will be described below. In an effort to provide a concise description of these embodiments, not all features of an actual implementation are described in the specification. It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation-specific decisions must be made to achieve the developers' specific goals, such as compliance with system-related and business-related constraints, which may vary from one implementation to another. Moreover, it should be appreciated that such a development effort might be complex and time consuming, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure.
A lamp access door 104 is also disposed on the back of the enclosure 100. The lamp access door 104 provides access to a lamp to facilitate periodic replacement thereof. A cooling structure 106 is disposed adjacent to the lamp access door 104. As explained below, the cooling structure 106 is adapted to remove heat from inside the enclosure 100 via a chimney effect while preventing access by a user to portions of the enclosure 100 that may be hot enough to cause injury.
The enclosure 100 is adapted to provide several airflows to remove the radiated heat 204, while maintaining the enclosure 100 at a temperature that will reduce the likelihood of injury to a user. One source of airflow may be a fan (not shown) disposed inside the enclosure 100.
The enclosure 100 may include louvers in its floor to facilitate entry of a floor intake, as indicated by an arrow 206. The floor intake 206 is adapted to travel through the interior of the enclosure 100 to facilitate dispersal of the radiated heat 204 through the back of the enclosure 100.
A second airflow may be pulled from outside the enclosure 100 through louvers in the lamp access door 104. This airflow is indicated by an arrow 208 in
In the exemplary embodiment illustrated in
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Exemplary embodiments of the present invention further allow construction of the enclosure 100 with materials that have a relatively low heat resistance. For example, an exemplary embodiment of the present invention may allow the chassis cover 102 (
While the invention may be susceptible to various modifications and alternative forms, specific embodiments have been shown by way of example in the drawings and will be described in detail herein. However, it should be understood that the invention is not intended to be limited to the particular forms disclosed. Rather, the invention is to cover all modifications, equivalents and alternatives falling within the spirit and scope of the invention as defined by the following appended claims.
This application is a National Phase 371 Application of PCT Application No. PCT/US06/08017, filed Mar. 3, 2006, entitled “COOLING STRUCTURE FOR HEAT GENERATING DEVICE”.
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/US06/08017 | 3/3/2006 | WO | 00 | 8/27/2008 |