Patent Application
20070044482
1. Field of the Invention
The present invention is related to a cooling system capable of reducing ambient temperature of a computer and particularly to a device, which is able to offer low temperature air flow at interior of a computer, such that heat exchange efficiency of the radiator is enhanced substantially.
2. Brief Description of the Related Art
In order to lower working temperature in the casing of a computer, ways such as using a radiator for the microprocessor, cooling fans of the radiator and system fans are mounted and, even more, various intake and outgoing air slots are provided at the computer casing for effectively ventilating air in the computer casing so that heat exchange for the radiator attached to the microprocessor can be enhanced significantly.
There are typical examples of the radiator being fixedly attached to the microprocessor such as Taiwanese Utility Model Application Nos. 087,200,769, 088,220,189, 090,213,401, 090,218,045, 091,203,000, 091,200,680, 091203000 and 09220391.
The preceding prior art devices are made with a cooling fin assembly, which guides and remove heat, are fixedly touched the microprocessor and the heat generated by the microprocessor can be removed via the cooling fin assembly contacting with the air. Hence, the over excessive working temperature of the microprocessor can be restricted. Further, a fan can be joined to the cooling fin assembly to speed up removal of air surrounding the cooling fin assembly by means of air flow created during the fan rotating such that fresh air flow is able to approach the cooling fin assembly for increasing heat exchange efficiency.
Further, the computer casing is mounted a plurality of system fans to guide outside air into the casing and discharge inside air outward to keep the heat exchange of the surroundings continuously as shown in
However, the preceding conventional simple design of air intake and discharge is incapable of meeting need of the current high speed microprocessor. Because the high speed microprocessor results in fast temperature rise and much higher temperature rise, material of the radiator and cooling fins is strictly restricted to have feature of fast heat guide and fast heat dissipation. Unfortunately, development of the radiator is slow with limited heat dissipation capability. Thus, if ambient temperature of the computer casing is reduced, heat exchange capability of the radiator must increase largely for enhancing effect of the radiator. Therefore, how to offer heat dissipation means suitable for the high speed microprocessor has to be endeavored urgently.
A primary object of the present invention is to provide a cooling system capable of reducing ambient temperature of a computer according to the present invention includes a cooling device, a cool connection part, a heat dissipation part and a base box. The cooling device provides a cool part and a hot part. The cool connection part connects with both the cool part and the hot part. The heat dissipation part connects with both the cool part and the hot part too. The base box receives the preceding parts. The cool part and the hot part create low temperature and high temperature respectively. The hot part is connected to the heat dissipation part so that heat from the hot part is guided outward the base box. Low temperature air moves toward interior of a computer casing due to the cool part connecting with cool connection part. Hence, ambient temperature of the microprocessor reduces abruptly for enhancing heat exchange rate.
The detail structure, the applied principle, the function and the effectiveness of the present invention can be more fully understood with reference to the following description and accompanying drawings, in which:
Referring to
Wherein, the cooling device 1 is a chip, which is attached to an inner lateral side of the base box 4 to generate a cool temperature and a hot temperature respectively by means of the cool part 11 and the hot part 12. The hot part 12 has a thermal interface 121 to connect with the heat dissipation part 3 and the heat dissipation part 3 is composed of a discharge fan 31 and a heat guide member 32, which keeps touching the hot part 12. The heat guide member 32 absorbs and guides high heat from the hot part 12 so as to be discharged outside the base box 4 directly via the discharge fan 31.
The cool part 11 has a cool interface 111 corresponding to a cool chamber 41 preset in the base box 4 and the cool interface 111 is connected to the cool connection part 2. The cool connection part 2 is composed of a blowing out fan 21 and a cool guide member 22, which touches the cool interface 111. The cool guide member 22 is capable of absorbing low temperature cool energy from the cool part 11 to allow the low temperature cool energy congregating at the outer surface thereof so as to be blown toward outside the base box 4.
Furthermore, an air outlet 42 is disposed at a lateral side of the cool chamber 41 and an oblique guide zone 43 is disposed corresponding to the outlet 42 to allow air being blown by the fan 3 smoothly and to guide air flow. The air outlet 42 can be arranged to face the radiator W3 such that the low temperature air flow is concentrated to move toward the radiator W3 for reducing temperature surrounding the radiator W3 and enhancing heat exchange efficiency thereof.
Besides, a further fan 5 can be added to the casing W based on actual need for guiding outside air into the casing W for increasing exchange between the outside air and the inside air.
Referring to
While the invention has been described with referencing to a preferred embodiment thereof, it is to be understood that modifications or variations may be easily made without departing from the spirit of this invention, which is defined by the appended claims.
