This is a continuation of co-pending application Ser. No. 719,249 filed on Jun. 21, 1991, abandoned.
Number | Name | Date | Kind |
---|---|---|---|
4748538 | Tsuji | May 1988 | |
4899208 | Dietsch et al. | Feb 1990 | |
4926242 | Itoh et al. | May 1990 | |
4943844 | Oscilowski et al. | Jul 1990 | |
5006921 | Ishizuka et al. | Apr 1991 | |
5006923 | Warren | Apr 1991 | |
5006924 | Frankeny et al. | Apr 1991 | |
5006925 | Bregman et al. | Apr 1991 | |
5010386 | Groover, III | Apr 1991 | |
5010389 | Gansuage et al. | Apr 1991 | |
5010390 | Tanaka | Apr 1991 | |
5012324 | martin et al. | Apr 1991 | |
5012325 | Mansuria e tal. | Apr 1991 | |
5014112 | Gelsomini | May 1991 | |
5014113 | Casto | May 1991 | |
5014161 | Lee et al. | May 1991 | |
5016084 | Nakao | May 1991 | |
5168926 | Watson et al. | Dec 1992 |
Number | Date | Country |
---|---|---|
60-7155 | Jan 1985 | JPX |
60-18942 | Jan 1985 | JPX |
63-289847 | Jan 1988 | JPX |
Entry |
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Arnold, et al., "Two-Stage Module Seal", IBM TDB, vol. 21, No. 2, Jul. 1978, pp. 611-612. |
"Thermally-Enhanced Tape Automated Bonded Package", IBM TDB, vol. 31, No. 5, Oct., 1988, pp. 34-35. |
"Cho-Therm.RTM. Thermal Interface Materials," Chomerics, Inc. |
Number | Date | Country | |
---|---|---|---|
Parent | 719249 | Jun 1991 |