Materials and devices with nonlinear electromagnetic responses may be used for nonlinear frequency generation, frequency conversion, parametric amplification, and other processes. For example, a radio-frequency or microwave mixer may use the nonlinear response of diodes to convert two signals at two input frequencies into additional signals at frequencies equal to linear combinations of the two input frequencies (e.g., the sum or difference of the two input frequencies). Additional sources of nonlinearity that may be used for nonlinear processes include transistors biased near cutoff, inductors driven into saturation, and analog multipliers. In the infrared and optical regions of the electromagnetic spectrum, certain types of crystals exhibit high levels of nonlinearity, making them particularly useful for optical nonlinear processes.
For superconducting quantum circuits, the millimeter-wave region of the electromagnetic spectrum presents a fascinating frequency regime between microwaves and optics. Compared to lower frequencies (e.g., radio frequencies and microwaves below 30 GHz), millimeter waves cover a wider range of energies and offer lower sensitivity to thermal background noise due to higher photon energies. Many advances have been made refining microwave quantum devices, typically relying on ultra-low temperatures in the millikelvin range to reduce noise and quantum decoherence. Using millimeter-wave photons as building blocks for superconducting quantum devices offers transformative opportunities by allowing quantum experiments to be run at liquid helium-4 temperatures, allowing higher device power dissipation and enabling large-scale direct integration with semiconductor devices. Millimeter-wave quantum devices could also provide new routes for studying strong-coupling light-matter interactions in this frequency regime, and present new opportunities for quantum-limited frequency conversion and detection.
Realizing quantum systems in the millimeter range (i.e., 30-300 GHz) requires low-loss components, i.e., device materials with low absorption rates and resonators with long photon lifetimes. Furthermore, nonlinear interactions are needed, which for circuit quantum optics can be realized with four-wave-mixing Kerr terms in the Hamiltonian. One approach commonly used at microwave frequencies relies on aluminum Josephson junctions, which yield necessary four-wave mixing at low powers. However, to avoid breaking Cooper pairs with high-frequency photons, millimeter-wave devices must be fabricated with materials with relatively high superconducting critical temperatures (Tc). Higher Tc junctions have been implemented as high-frequency mixers for millimeter-wave detection, and ongoing efforts are improving losses for quantum applications.
The present embodiments utilize kinetic inductance (KI) as an alternative source of Kerr nonlinearity in millimeter-wave electromagnetic resonators. Arising from the inertia of Cooper pairs in a superconductor, KI has gained recent interest for microwave quantum applications and has been successfully demonstrated for millimeter-wave detection. Niobium nitride (NbN) is an excellent material for KI due to its high intrinsic sheet inductance, a relatively high Tc between 14 and 18 K, and low microwave loss. Among deposition methods, atomic layer deposition (ALD) offers conformal growth of NbN and promising avenues for realizing repeatable high KI devices on a wafer-scale. Other deposition methods that may be used include sputtering and electron-beam evaporation.
In some embodiments, a nonlinear parametric device includes a planar substrate and a resonator formed from superconductive material deposited on the planar substrate. The resonator is sized to resonate at a millimeter-wave frequency, and when cooled below a critical temperature, exhibits nonlinear kinetic inductance.
In other embodiments, a method for nonlinear frequency generation includes cooling a resonator below a critical temperature to exhibit nonlinear kinetic inductance. The resonator is formed from superconductive material deposited on a planar substrate, and is sized to resonate at a millimeter-wave frequency. The method also includes generating one or more outputted millimeter waves, via the nonlinear kinetic inductance, from one or more inputted millimeter waves coupled into the resonator.
One challenge with using the electromagnetic resonator as a qubit is that no two of the resonator's energy levels can be used to approximate a two-level quantum system. To appreciate this challenge, consider the resonator to initially be in the ground state |0. When subsequently driven with an electromagnetic signal whose frequency is at, or near, f0, the electromagnetic signal will coherently transfer the resonator from the ground state |0 into a linear superposition of the ground state |0 and the first excited state |1. Due to the ladder structure, the electromagnetic signal is also resonant with all transitions |n→|n±1, and therefore will also drive a population of the first excited state |1 into the ground state |0 and the second excited state |2, a population of the second excited state |2 into the first excited state |1 and the third excited state |3, and so on. Once the electromagnetic signal is extinguished and no longer driving the resonator, the resonator will be in a superposition of several energy levels |n. That is, the resonator will not necessarily be in a Fock state (i.e., a state with a definite integer number of photons). Accordingly, any attempt to coherently control the resonator within a two-level subsystem of the energy-level diagram 100 (e.g. the states 10) and |1) can result in several other energy levels outside of the two-level subsystem becoming populated. This loss of population to energy levels outside of the two-level subsystem can significantly degrade fidelity of a quantum computational process implemented with the two-level subsystem.
The nonlinear energy shifts shown in the energy-level diagram 110 advantageously remove the ladder structure of the energy-level diagram 100. As a result, an electromagnetic signal resonantly driving the nonlinear resonator between the states |0′ and |1′ will non-resonantly drive other nonlinear-resonator transitions (i.e., |1′→|2′, |2′→|3′, etc.). The two lowest states |0′ and |1′ of the nonlinear resonator form a two-level subsystem that is more weakly coupled to the higher energy levels |n′ as compared to the states |0 and |1 of the bare resonator, and therefore better approximates an ideal two-level quantum system that is fully isolated from other energy levels. While the energy-level diagram 110 illustrates a Kerr nonlinearity, another type of nonlinearity may be used to remove the ladder structure of the energy-level diagram 100.
One aspect of the present embodiments is the realization that the nonlinear kinetic inductance ΔLk scales as the ω02, and therefore a millimeter-wave resonator 304 with a fundamental frequency of ω0=(2π)×100 GHz will exhibit a 100-fold greater nonlinearity than a microwave resonator with a fundamental frequency of ω0=(2π)×10 GHz. Another motivation for increasing the fundamental frequency into the millimeter-wave regime is that it moves the frequency of the two-state subsystem transition away from the peak of the blackbody spectrum in cryogenic systems, which advantageously reduces the cooling requirements when using the millimeter-wave resonator 304 as a superconducting qubit.
In the example resonator 304 of
Examples of superconductive materials that may be used to form the millimeter-wave resonator 304 include niobium (N), aluminum (Al), niobium nitride (NbN), titanium nitride (TiN), niobium titanium nitride (NbTiN), tantalum (Ta), and indium (In). One advantage of NbN is that its critical temperature Tc≈13 K is higher than that of Nb (9 K), Al (1 K), and TiN (4 K). Advantageously, a higher critical temperature Tc reduces the cooling requirements needed to observe the onset of nonlinear kinetic inductance. However, another type of superconductive material may be used without departing from the scope hereof.
The planar substrate 302 may be formed from any material that acts as a dielectric medium for millimeter waves, and is compatible with cryogenic cooling. Examples of such materials include sapphire, quartz, fused silica, crystalline silicon, and silicon-on-insulator. Another material may be used for the planar substrate 302 without departing from the scope hereof. A thickness of the planar substrate 302 in the z direction (see the right-handed coordinate system 320) may be less than 10 mm (e.g., 100 μm). While
The superconductive material may be deposited onto the planar substrate 302 via atomic layer deposition, chemical vapor deposition, sputtering, electron-beam evaporation, or another thin-film deposition technique known in the art. A thickness of the single trace may be 50 nm or less. A width 314 of the single trace may be 200 μm or less. For example, the width 314 may be 4 μm.
A length 310 of the transmission line in the x direction (see right-handed coordinate system 320) is selected such that resonator 304 has a fundamental frequency ω0 in the millimeter-wave regime. More specifically, the length 310 is equal to one-fourth of the wavelength corresponding to the fundamental frequency ω0, corrected for the dielectric constant (at cryogenic temperatures) of the material forming the planar substrate 302. For example, the length 310 is approximately 100 μm for ω0=(2π)×100 GHz and a planar substrate 302 formed from sapphire (i.e., λ0≈400 μm). Alternatively, the length 310 may equal an integer multiple of λ0/4 (i.e., λ0/4 where n is any positive integer). The planar substrate 302 may have a length in the x direction greater than the length 310 (e.g., 1 mm or more). Similarly, the planar substrate 302 may have a width in the y direction that is greater than a corresponding width of the resonator 304 (e.g., 1 mm or more). The internal quality factor of the resonator 304, also denoted herein as Qi, may be 10,000 or higher (e.g., 80,000). Note that Qi represents only the intrinsic quality factor of the resonator 304, and therefore excludes the effects of coupling to the resonator 304. With coupling included, the effective quality factor of the resonator 304 tends to be less than Qi.
The nonlinear parametric device 300 is mounted into a copper block 510 with a clear aperture (not shown) such that the inputted millimeter waves 502 can directly couple into the nonlinear parametric device 300, and such that the outputted millimeter waves 508 can directly couple out of the nonlinear parametric device 300. The copper block 510 also provide good electrical connectivity between the walls of the input waveguide 504 and the output waveguide 506. More details about how the copper block 510, the input waveguide 504, and the output waveguide 506 are provided below (see
In
When the nonlinear parametric device 300 is cooled below the critical temperature of the resonator 304, it exhibits nonlinear kinetic inductance. Under this condition, the nonlinear parametric device 300 generates the one or more outputted millimeter waves 508 from the one or more inputted millimeter waves 502. Due to the nonlinear kinetic inductance, the nonlinear parametric device 300 can be used to implement any fourth-order nonlinear process, such as parametric amplification and four-wave mixing. More details about these nonlinear frequency processes are presented below.
In a block 606 of the method 600, one or more outputted millimeter waves are generated, via the nonlinear kinetic inductance, from one or more inputted millimeter waves coupled into the resonator. The block 606 may occur simultaneously with the block 604. In one example of the block 606, the one or more outputted millimeter waves 508 are generated from the one or more inputted millimeter waves 502.
In some embodiments, the method 600 includes a block 602 in which the one or more inputted millimeter waves are coupled into the resonator. The block 602 may occur simultaneously with one or both of the blocks 604 and 606. In one example of the block 602, the one or more inputted millimeter waves 502 are coupled into the nonlinear parametric device 300. Furthermore, the method 600 may also include a block 608 in which the one or more outputted millimeter waves are coupled out of the resonator. The block 608 may occur simultaneously with one or more of the blocks 602, 604, and 606. In one example of the block 608 the one or more outputted millimeter waves 508 are coupled out of the nonlinear parametric device 300.
In some embodiments, the method 600 implements parametric amplification. Specifically, the one or more inputted millimeter waves include a pump and a signal, and the one or more outputted millimeter waves include an amplified signal and an idler. In the block 606 of these embodiments, the signal is parametrically amplified into the amplified signal by transferring energy from the pump into the signal, and by emitting the idler. Thus, the amplified signal and the signal have the same signal frequency, the pump has a pump frequency greater than the signal frequency, and the idler has an idler frequency less than the pump frequency.
In some embodiments, the method 600 implements four-wave mixing. Specifically, the one or more inputted millimeter waves include a first input at a first frequency f1, a second input at a second frequency f2 different from the first frequency f1, and a third frequency f3 different from each of the first frequency f1 and the second frequency f2. Furthermore, the one or more outputted millimeter waves include an output at an output frequency equal to at least one of ±f1±f2±f3. In the block 606 of these embodiments, the output is generated via four-wave mixing of the first, second, and third inputs.
In some embodiments, the method 600 implements degenerate four-wave mixing. Specifically, the one or more inputted millimeter waves include a first input at a first frequency f1 and a second input at a second frequency f2 different from the first frequency f1. Furthermore, the one or more outputted millimeter waves include an output at an output frequency equal to 2f1−f2. In the block 606 of these embodiments, the output is generated via degenerate four-wave mixing of the first and second.
In the block 602 of some embodiments of the method 600, the one or more inputted millimeter waves are coupled into the resonator with an input waveguide abutting a first surface of the planar substrate such that the one or more inputted millimeter waves, after propagating along the input waveguide, couple into the planar substrate through the first surface. The resonator may be formed on the first surface. Alternatively, the resonator may be formed on a second surface, opposite the first surface, of the planar substrate. In one example of the block 602 of these embodiments, the input waveguide 504 couples the one or more inputted millimeter waves 502 into the bottom surface of the planar substrate 302 of the nonlinear parametric device 300.
In the block 608 of some embodiments of the method 600, the one or more outputted millimeter waves are coupled out of the resonator with an output waveguide abutting the second surface of the planar substrate such that the one or more outputted millimeter waves, couple into the output waveguide through the second surface. In one example of the block 608 of these embodiments, the output waveguide 506 couples the one or more outputted millimeter waves 508 out of the top surface of the planar substrate 302 of the nonlinear parametric device 300.
In some embodiments, any one or more of the resonators 304, 404, and 704 is used to upconvert thermal photons from a first frequency to a second frequency that is higher than the first frequency. At the second frequency, the thermal photons are easier to cool, thereby removing the thermal energy. As such, the present embodiments may be used enhance cooling of superconducting circuits.
In some embodiments, any one or more of the resonators 304, 404, and 704 is used as a superconducting-insulator-superconducting (SIS) Josephson junction or a weak-link Josephson junction.
In some embodiments, any one or more of the resonators 304, 404, and 704 is operated non-reciprocally, wherein said one or more of the resonators 304, 404, and 704 may be used to construct a millimeter-wave isolator or circulator.
Device Measurement
We investigate properties of millimeter-wave high-KI resonators in the quantum regime (at temperatures of 1 K) in a helium-4 adsorption refrigerator. Using a frequency multiplier, cryogenic mixer, and low-noise amplifier, we measure the complex transmission response as shown in
Materials and Loss Mechanisms
To understand the quality of the NbN films grown by ALD and accurately predict resonant frequencies, we characterize material properties with DC electrical measurements. All devices in this work are deposited on sapphire with a process based described in “Plasma-enhanced atomic layer deposition” by Mark J. Sowa et al. (J. Vac. Sci. Technol. A: Vacuum Surfaces Films 35, 01B14, 2017), and etched with a fluorine-based inductively coupled plasma (see “Device Fabrication” below). We measure resistivity at ambient magnetic fields as a function of temperature (see “Film Characterization” below), which we use to extract Tc for a range of film thicknesses (see
From the resistivity and critical temperature, we determine the sheet inductance LE=hR□/πΔ0, where the normal sheet resistance R□=ρn/t is taken as the maximum value of normal resistivity ρn, occurring just above Tc, and Δ0=2.08Tc is the superconducting energy gap predicted by Bardeen-Cooper-Schrieffer (BCS) theory for NbN. We observe a monotonic increase in L□ for thinner films, achieving a maximum L□=212 pH/, comparable to that for similar high-KI films.
By characterizing complex transmission spectra of resonators fabricated on a range of film thicknesses, we explore loss mechanisms at millimeter-wave frequencies. The sheet inductance, thickness, and Tc measured for a given film are used to adjust the resonator design length. This spreads resonances out in frequency from 80 to 110 GHz, while varying antenna lengths allows us to adjust coupling strengths. A typical normalized transmission spectrum taken at single-photon-occupation powers (
where Q−1=Qi−1+Re Qe−1 and the coupling quality factor Qe=Qe*e−iϕ has undergone a complex rotation ϕ due to an impedance mismatch, likely induced by the sapphire chip and slot altering the waveguide geometry. The plot of fitted internal quality factors with respect to photon occupation in
To study effects of film thickness on Qi, we repeat the measurements summarized in
Kerr Nonlinear Dynamics
A key aspect of high-KI resonators is their fourth-order nonlinearity, an important component for realizing quantum devices, and similar to the nonlinearity term found in Josephson junctions for low powers. Nonlinear kinetic inductance takes the general form L=Lk+ΔLkI2/Ic2, where Lk is the linear kinetic inductance, ΔLk is the nonlinear kinetic inductance, and is the critical current, which sets the nonlinearity scale. This adds nonlinear terms of the form (ℏ/2)K(a†a)2 to the Hamiltonian, with K∝ω02ΔLk/Ic2, shifting the fundamental frequency ω0 by the self-Kerr-constant K for each photon added. To characterize the strength of the resonator nonlinearity, we measure the resonance-frequency shift as a function of photon number. A linear fit for a resonator (t=29 nm, w=0.5 μm) yielding K/2π=1.21 kHz is shown in
A hallmark of Kerr nonlinearity is the distortion of the transmission lineshape in frequency space at high powers, ultimately leading to a multivalued response above the bifurcation power. If we rewrite γ=ω0/Qi and K=ω0/ReQe, the steady-state nonlinear response takes the form (see “Kerr Nonlinear Dynamics for a Side-Coupled Resonator” below):
where the frequency detuning is written in reduced form δ=ω−ω0/κ+γ, and n=nph/ñin is a function of frequency and reduced circulating power ξ=K[κ/hf(κ+γ)3]Pin. We plot steady-state transmission data taken near the bifurcation power in
Kerr Nonlinear Dynamics for a Side-Coupled Resonator
This section describes a procedure to decompose a side-coupled resonator into a linear network containing a one-sided cavity, which is well understood in the language of input-output theory used in quantum optics. With this procedure, well-modelled dynamics of a Kerr nonlinear cavity driven in reflection can be mapped to a side-coupled resonator measured in transmission.
Based on the circuit model in
If we describe the black box with an arbitrary reflection term Γ=aout(t)/ain(t), the scattering matrix of the system reduces to:
We can now verify that far off-resonance, for an open-circuit perfect reflection Γ→1, we recover perfect transmission. With a map of waveguide inputs and outputs, we replace the black box with a Kerr nonlinear one-port coupled resonator, which has the steady state condition
We have been careful to use the microwave convention for Fourier transforms, and nph=|a|2 corresponds to the average number of photons in the resonator. Multiplying Eqn. A3 by its complex conjugate, we obtain an equation governing the normalized number n of photons in the resonator:
Far off resonance, an impedance mismatch on output port 2 results in nonzero reflection |r|=sin ϕ and transmission |t|=cos ϕ less than unity. To account for this while preserving the unitarity of the S matrix, we apply transformations of the form eiϕ to each path of the three-port network, yielding S21=(Γeiϕ+e−iϕ)/2. Mapping Eqn. A8 to the modified three-port network, we obtain the result obtained above:
At low powers (ξn→0), Eqn. A9 reduces to Eqn. 1.
We follow a similar approach to obtain expressions for parametric conversion gain. With use of microwave conventions for Fourier transforms, the one-port gain of a signal detuned from the pump by +Δ=ωs−ωp/κ+γ is given by
with λ±=½±√{square root over ((ξn)2−(δ−2ξn)2)}. Use of the three-port-network transformations above yields the normalized forward (in the direction of propagation) signal gain:
Device Fabrication
All devices were fabricated on 100±25 μm thick C-plane (0001) sapphire wafers with a diameter of 50.8 mm. Wafers were cleaned with organic solvents (toluene, acetone, methanol, isopropanol, and deionized (DI) water) in an ultrasonic bath to remove contamination, then were annealed at 1200° C. for 1.5 hours. Before film deposition, the wafers underwent a second cleaning with organic solvents (toluene, acetone, methanol, isopropanol, and DI water) in an ultrasonic bath, followed by 2 minutes of cleaning at 50° C. in a Nano-Strip™etch, and a rinse with high-purity DI water. The wafers then underwent a dehydration bake at 180° C. in air for 3 minutes.
Immediately afterwards, the wafers were loaded into an Ultratech Fiji G2 plasma-enhanced-atomic-layer-deposition tool for metallization, where they underwent a one-hour bake at 300° C. under a vacuum continuously purged with 5 sccm of argon gas. Chamber walls matched the substrate temperature. (t-Butylimido)tris(diethylamido)niobium(V) (TBTDEN) was used as the niobium precursor, which was kept at 100° C. and delivered by a precursor Boost™ system, which introduced argon gas into the precursor cylinder to promote material transfer of the low vapor pressure precursor to the wafer. The deposition cycle consisted of three 0.5-s pulses of boosted TBTDEN followed by 40 s of 300-W plasma consisting of 80 sccm of hydrogen and 5 sccm of nitrogen. A flow of 5 sccm of nitrogen and 10 sccm of argon was maintained throughout the deposition process. After deposition the wafer was passively cooled to 250° C. under vacuum.
Following deposition, the wafers were cleaned with DI water in an ultrasonic bath to remove particulates, then underwent a dehydration bake at 180° C. in atmosphere for 3 minutes before being coated with resist. For optical lithography, to avoid defocusing from wafer deformation, the wafers were mounted to a silicon handle wafer with AZ MiR 703 photoresist cured at 115° C. The wafers were then coated with approximately 1 μm of AZ MiR 703 positive I-line photoresist, and exposed with a Heidelberg MLA150 direct writer. For electron-beam lithography, the wafers were first coated with approximately 200 nm of ARN 7520 negative resist, followed by 40 nm of Elektra AR PC 5090 conductive resist, and then exposed with a Raith EBPG5000 Plus electron-beam writer. The conductive coating was removed by a 60-s DI water quench. Both optical and electron-beam resists were baked at 110° C. for further hardening, and then developed for 60 s in AZ MIF 300, followed by a 60-s quench in DI water. Rounded corners of the devices are by design to diffuse electric fields and reduce coupling to two-level systems.
The NbN films were etched in a Plasma-Therm inductively coupled plasma etcher. Etch chemistry, substrate etch depth and etch time are known to affect planar resonator quality factors, in particular due to the formation of cross-linked polymers at the metal-resist interface after the bulk metal is etched away. For this reason, sample etch times were scaled to metal thickness, with a fixed overetch time of 30 s to ensure complete metal removal. A fluorine-based ICP etch chemistry was used with a plasma consisting of 15 sccm of SF6, 40 sccm of CHF3, and 10 sccm of Ar. ICP and bias powers were kept at 100 W, and the substrate was cooled to 10° C. Following etching, the resist was stripped in a combination of acetone and 80° C. Remover PG (N-methyl-2-pyrrolidone) which also serves to release the wafer from the silicon carrier wafer. The wafers were then cleaned with organic solvents (acetone, 2-propanol) and DI water, coated with an approximately 2 μm protective layer of photoresist, and diced into 3.3 mm×2.3 mm chips. These were stripped of protective resist with 80° C. Remover PG, cleaned with organic solvents (acetone, 2-propanol), and DI water, dried on an unpolished sapphire carrier wafer in air at 80° C., then mounted with indium wire in the copper box described previously.
Film Characterization
DC film-characterization measurements were performed with a Quantum Design physical property measurement system (PPMS) with a base temperature of 1.8 K. Test structures consisting of a 1.5 mm×40 μm wire were patterned on 7 mm×7 mm chips undergoing the process described above (see Device Fabrication) along with device wafers, and were then wire-bonded for four-wire measurements. Finished structures were kept in a low vacuum (approximately 500 mTorr) to minimize oxide growth before measurement, as it was observed that Tc decreases by up to 1 K for samples aged for several days in air, likely a result of oxide growth reducing the superconducting-film thickness.
After the sampled were cooled to 10 K (3 K in the case of the 8-nm film) in ambient magnetic fields, it was verified that the residual resistance of the film dropped below the instrument noise floor of around 5×10−3Ω. After thermalization for 1 hour, the samples were warmed up to 20 K at a rate of 0.1 K/min, and were then warmed to 300 K at a rate of 1 K/min.
Millimeter-Wave Measurement Setup and Calibration
All millimeter-wave characterizations were performed in a custom-built 4He adsorption refrigerator with a base temperature of 0.9 K, and a cycle duration of 3 hours. We generate millimeter-wave signals between 75 and 115 GHz at room temperature by sending microwave signals between 12 and 19 GHz into a frequency multiplier. We convert the generated waveguide TE10 mode to a coaxial mode in a 1-mm-diameter stainless steel and beryllium copper coaxial cable, which carries the signal to the 1-K stage of the fridge, with mechanical thermalization at each intermediate stage, and then convert the coaxial signal back to a WR10 waveguide, which leads to the device under test. The cables and waveguide-cable converters have a combined frequency-dependent loss ranging from 55.6 to 75.8 dB in the W band, which is dominated by the cable loss. We confirm the attenuation and incident device power at room temperature with a calibrated power meter (Agilent W8486A) and a referenced measurement with a VNAx805 receiver. However, cryogenic shifts in cable transmission and minute shifts in waveguide alignment likely result in small variations in transmitted power. We further confirmed the applied power by measuring the lowest observed bifurcation point, and finding that most bifurcation powers agree with predictions, yielding a maximum combined power uncertainty of approximately ±5 dBm, which sets the uncertainty in our photon-number measurements.
The sample is isolated from both millimeter-wave and thermal radiation from the 4-K plate with two stainless steel waveguides two inches long and a Faraday isolator. Using a resistive heater and a standard-curve ruthenium oxide thermometer, we can perform temperature sweeps on the sample without significantly affecting the fridge-stage temperatures. A low-noise amplifier (TN˜28 K) amplifies the signal before it passes through another Faraday isolator, which further blocks any leaking signals. The signal then passes to a cryogenic mixer, which converts the signal to radio waves (e.g., 100 to 300 MHz), which we filter amplify, and measure at room temperature with a network analyzer. We control the signal power by varying the input attenuation and multiplier input power, confirming the incident power at the sample with room-temperature calibrations as described above. For two-tone measurements, we move the signal path to the 20-dB port of the input directional coupler, and add an additional frequency multiplier fed by a reference-locked microwave signal generator. For single-tone measurements, the 20-dB port is capped with a short to minimize incident stray radiation.
BCS-Conductivity Temperature Dependence
Because of the large kinetic inductance fraction α, or magnetic field participation ratio of the thin-film resonators, we expect higher sensitivity to loss from complex conductivity, which in turn is sensitive to temperature.
Q
i(T)−1=Qi,max−1+Qσ(T)−1, (E1)
where Qi,max−1 is a temperature-independent upper bound arising from other sources of loss, and the conduction loss Qσ is given by
where σ1 and σ2 are the real and imaginary parts, respectively, of the complex surface impedance. Values for σ1 and σ2 are calculated by numerically integrating the Mattis-Bardeen equations for Γ1/σn and σ2/σn. We use α and Tc as fit parameters in the model. Below 2 K (T/Tc˜0.15), Qi saturates, which indicates that conduction loss does not limit Qi for these devices. We note minor deviations from theory at higher temperatures, which may be a result of physical deviations from the standard-curve calibrations used for the ruthenium oxide thermometer. Since these resonators are fabricated with Qe>104, measuring resonators at higher temperatures where Qi is below 103 proves experimentally challenging.
BCS theory also predicts a shift in London length as a function of temperature, which in the dirty (high-disorder) limit is given by
We can measure this by tracking the resonance-frequency shift. For sufficiently large kinetic inductance fractions, or Lk»L9, the kinetic inductance will dominate the total inductance, so the normalized frequency shift will be given by
Controlling Nonlinearity in the Presence of Additional Losses
We expect the self-Kerr-nonlinearity originating from kinetic inductance of a λ/4 resonator to be
where in our case the nonlinear kinetic inductance ΔL is constant along the transmission line, so integrating over the fundamental mode profile u0 yields a constant. We also transform the critical current into a critical current density Jc, and use the assumption that the nonlinear kinetic inductance is proportional to the linear kinetic inductance.
Nonlinear kinetic inductance is also associated with a nonlinear resistance of the same form R=R0+ΔRI2/Ic2. Assuming the nonlinear resistance scales with kinetic inductance, the losses associated with nonlinear resistance will be given by
This indicates that upper bounds on nonlinear losses should scale as Q3˜ω02/|K|. In
In our analysis, we also do not account for higher harmonics of the resonator, which will be coupled to the fundamental mode by cross-Kerr-interactions χmn, which for evenly spaced harmonics scale as
Given the proportionality to K, the correlation described above may also potentially be a result of cross-Kerr-effects. For linewidths great enough to cover any deviations from evenly spaced higher harmonics, we anticipate that we will see power-dependent conversion processes: in particular, for a Kerr nonlinear system with harmonics spaced at ω0 and 3ω0, at powers approaching the critical power we would expect increased conversion efficiency from the fundamental to the third harmonic, which in our experiment would be observed as increased resonator loss at higher powers.
In
In
Combination of Features
Features described above as well as those claimed below may be combined in various ways without departing from the scope hereof. The following examples illustrate possible, non-limiting combinations of features and embodiments described above. It should be clear that other changes and modifications may be made to the present embodiments without departing from the spirit and scope of this invention:
(A1) A nonlinear parametric device may include a planar substrate and a resonator formed from superconductive material deposited on the planar substrate. The resonator may be sized to resonate at a millimeter-wave frequency. The resonator, when cooled below a critical temperature, exhibited nonlinear kinetic inductance.
(A2) In the device denoted (A1), the superconductive material may be one of niobium, aluminum, niobium nitride, titanium nitride, niobium titanium nitride, tantalum, and indium.
(A3) In either one of the devices denoted (A1) and (A2), the planar substrate may be fabricated from one of sapphire, quartz, crystalline silicon, and silicon-on-insulator.
(A4) In any one of the devices denoted (A1) through (A3), the superconductive material may form a single trace shaped as a shorted quarter-wave transmission line at the millimeter-wave frequency.
(A5) In the device denoted (A4), the shorted quarter-wave transmission line may be implemented as a balanced coplanar stripline waveguide.
(A6) In either one of the devices denoted (A4) and (A5), a width of the trace may be no greater than 200 μm.
(A7) In any one of the devices denoted (A4) through (A6), a thickness of the single trace may be no greater than 50 nm.
(A8) In any one of the devices denoted (A1) through (A7), an internal Q of a resonance of the resonator, when cooled below the critical temperature, may be at least 10,000.
(A9) In any one of the devices denoted (A1) through (A8), the superconductive material may be deposited on the planar substrate via atomic layer deposition.
(A10) In any one of the devices denoted (A1) through (A9), the device may further include an input waveguide abutting a first surface of the planar substrate such that one or more inputted millimeter waves, after propagating along the input waveguide, couple into the planar substrate through the first surface.
(A11) In the device denoted (A11), the resonator may be formed on the first surface of the planar substrate.
(A12) In any one of the devices denoted (A1) through (A11), the device may further include an output waveguide abutting a second surface of the planar substrate that is opposite to the first surface of the planar substrate, such that one or more outputted millimeter waves couple into the output waveguide through the second surface.
(A13) In any one of the devices denoted (A1) through (A12), the device may further include a second resonator formed from additional superconductive material deposited on the planar substrate. The second resonator may be sized to resonate at a second millimeter-wave frequency different than the millimeter-wave frequency.
(B1) A method for nonlinear frequency generation may include cooling a resonator below a critical temperature to exhibit nonlinear kinetic inductance. The resonator may be formed from superconductive material deposited on a planar substrate, and may be sized to resonate at a millimeter-wave frequency. The method may further include generating one or more outputted millimeter waves, via the nonlinear kinetic inductance, from one or more inputted millimeter waves coupled into the resonator.
(B2) In the method denoted (B1), the method may further include coupling the one or more inputted millimeter waves into the resonator, and coupling the one or more outputted millimeter waves out of the resonator.
(B3) In either one of the methods denoted (B1) and (B2), the one or more inputted millimeter waves may include a pump and a signal, the one or more outputted millimeter waves may include an amplified signal and an idler, and said generating may include parametrically amplifying the signal into the amplified signal by transferring energy from the pump into the signal and by emitting the idler.
(B4) In either of the methods denoted (B1) and (B2), the one or more inputted millimeter waves may include a first input at a first frequency f1, a second input at a second frequency f2 different from the first frequency, and a third input at a third frequency f3 different from each of the first and second frequencies. The one or more outputted millimeter waves may include an output at an output frequency equal to at least one of ±f1±f2±h. Said generating may include four-wave mixing of the first, second, and third inputs to generate the output.
(B5) In either one of the methods denoted (B1) and (B2), the one or more inputted millimeter waves may include a first input at a first frequency ft and a second input at a second frequency f2 different from the first frequency. The one or more outputted millimeter waves may include an output at an output frequency equal to 2f1−f2. Said generating comprises may include degenerate four-wave mixing of the first and second inputs to generate the output.
(B6) In any one of the methods denoted (B2) through (B5), said coupling the one or more inputted millimeter waves may use an input waveguide abutting a first surface of the planar substrate such that the one or more inputted millimeter waves, after propagating along the input waveguide, couple into the planar substrate through the first surface.
(B7) In the method denoted (B6), the resonator may be formed on the first surface of the planar substrate.
(B8) In any one of the methods denoted (B2) through (B7), said coupling the one or more outputted millimeter waves may use an output waveguide abutting a second surface of the planar substrate that is opposite to the first surface of the planar substrate, such that the one or more outputted millimeter waves couple into the output waveguide through the second surface.
(B9) In any one of the methods denoted (B1) through (B8), the superconductive material may be one of niobium, aluminum, niobium nitride, titanium nitride, niobium titanium nitride, tantalum, and indium.
(B10) In any one of the methods denoted (B1) through (B9), the planar substrate may be fabricated from one of sapphire, quartz, crystalline silicon, and silicon-on-insulator.
(B11) In any one of the methods denoted (B1) through (B10), the superconductive material may form a single trace shaped as a shorted quarter-wave transmission line at the millimeter-wave frequency.
(B12) In the method denoted (B11), the shorted quarter-wave transmission line may be implemented as a balanced coplanar stripline waveguide.
(B13) In either one of the methods denoted (B11) and (B12), the width of the single trace may be no greater than 200 μm.
(B14) In any one of the methods denoted (B11) through (B13), a thickness of the single trace may be no greater than 50 nm.
(B15) In any one of the methods denoted (B1) through (B14), an internal Q of a resonance of the resonator may be at least 10,000.
(B16) In any one of the methods denoted (B1) through (B15), a second resonator may be formed from additional superconductive material deposited on the planar substrate. The second resonator may be sized to resonant at a second millimeter-wave frequency different than the millimeter-wave frequency. Said cooling may include cooling the second resonator below a second critical temperature to exhibit nonlinear kinetic inductance. The method may further include generating, via the nonlinear kinetic inductance of the second resonator, one or more additional millimeter waves from the one or more inputted millimeter waves when the one or more inputted millimeter waves are coupled into the second resonator.
(B17) In the method denoted (B16), the method may further include simultaneously coupling the one or more inputted millimeter waves into both the resonator and the second resonator.
Changes may be made in the above methods and systems without departing from the scope hereof. It should thus be noted that the matter contained in the above description or shown in the accompanying drawings should be interpreted as illustrative and not in a limiting sense. The following claims are intended to cover all generic and specific features described herein, as well as all statements of the scope of the present method and system, which, as a matter of language, might be said to fall therebetween.
This application claims priority to U.S. Provisional Patent Application No. 62/813,066, filed Mar. 3, 2019 and titled “Accessing Nonlinearity in Superconducting Millimeter Coplanar Resonators”, the entirety of which is included herein by reference.
This invention was made with government support under grant number W911NF-17-C-0024 awarded by the Army Research Office, and grant number DMR1420709 awarded by the National Science Foundation. The government has certain rights in the invention.
Filing Document | Filing Date | Country | Kind |
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PCT/US2020/020831 | 3/3/2020 | WO | 00 |
Number | Date | Country | |
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62813066 | Mar 2019 | US |