Patent Application
20170044318
The present invention relates to a copolymerized polyamide resin, a method for preparing the same, and a product including the same, and more particularly, to a highly heat-resistant crystalline copolymerized polyamide resin which has excellent heat resistance and melt processability, a method for preparing the same, and a molded product including the same.
Highly heat resistant nylon can be obtained through polycondensation of aromatic dicarboxylic acids or aromatic diamines. Such a highly heat resistant nylon product may have a semi-aromatic structure and a semi-crystalline structure, and can withstand much higher temperature than typical nylon products, thus being applied to various fields requiring high heat-resistance properties. Properties of the highly heat resistant nylon, such as heat resistance and flowability, can vary depending upon comonomers and copolymerization ratio.
Examples of highly heat resistant nylon generally used in the art include PA4T, PA6T, PA9T, PA10T, PA11T, and PA12T. Generally, in preparation of PA4T, PA6T, and the like, which contain a linear alkylene group with low carbon number in a backbone, a large amount (several dozen %) of comonomer is used to improve melt processability instead of using a homopolymer, which has high melting point and poor processability. Examples of the comonomer generally used in the art include adipic acid, isophthalic acid, and the like, specifically short chain or long chain aliphatic diamines, cyclic aliphatic diamines, branched aliphatic diamines, short chain or long chain aliphatic dicarboxylic acids, cyclic aliphatic dicarboxylic acids, and branched aliphatic dicarboxylic acids. Particularly, adipic acid has the same carbon number as terephthalic acid and thus can lower melting point without reduction in crystallinity.
However, when a dicarboxylic acid including a linear aliphatic dicarboxylic acid such as adipic acid is used, a highly heat resistant nylon can be decomposed through cyclization at high temperature, which is a mechanism known in the art (see Archamer B G, Reinhard F W and Kline G M, J Res Natl Bur Stand 4:391(1951)). Upon decomposition of the highly heat resistant nylon, gases such as water vapor, CO, CO2, and NH3 can be generated, causing blistering in some subsequent processes after injection molding.
Therefore, there is a need for a highly heat-resistant crystalline copolymerized polyamide resin which can exhibit excellent melt processability and heat resistance without suffering from decomposition.
It is one aspect of the present invention to provide a highly heat-resistant crystalline copolymerized polyamide resin which can exhibit excellent heat resistance and melt processability, and a method for preparing the same.
It is another aspect of the present invention to provide a copolymerized polyamide resin which can reduce or prevent gas generation during high-temperature processing and exhibit improved discoloration resistance, and a method for preparing the same.
It is a further aspect of the present invention to provide a molded product formed of the copolymerized polyamide resin as set forth above.
The above and other aspects of the present invention will become apparent from the detailed description of the following embodiments.
One aspect of the present invention relates to a copolymerized polyamide resin. The copolymerized polyamide resin includes: a repeat unit derived from a dicarboxylic acid; a repeat unit derived from a diamine; and a repeat unit represented by Formula 1, wherein the copolymerized polyamide resin has a melting point (Tm) of about 280° C. to about 330° C.:
wherein R1 is a C3 to C12 linear, branched, or cyclic alkylene group.
In one embodiment, the repeat unit represented by Formula 1 may be derived from a cyclic amide compound represented by Formula 2 or an amino acid compound represented by Formula 3:
wherein R1 is the same as defined in Formula 1.
In one embodiment, the dicarboxylic acid may include at least one C8 to C20 aromatic dicarboxylic acid.
In one embodiment, the dicarboxylic acid may include about 60 mol % to about 100 mol % of the aromatic dicarboxylic acid and about 40 mol % or less of a C6 to C20 aliphatic dicarboxylic acid.
In one embodiment, the diamine may include at least one C4 to C20 aliphatic diamine.
In one embodiments, the repeat unit represented by Formula 1 may be present in an amount of about 5 parts by mole to about 40 parts by mole based on about 100 parts by mole of the repeat unit derived from the dicarboxylic acid and the repeat unit derived from the diamine, and a mole ratio of the repeat unit derived from the diamine to the repeat unit derived from the dicarboxylic acid (diamine/dicarboxylic acid) may range from about 0.95 to about 1.15.
In one embodiment, the copolymerized polyamide resin may be end-capped with an end-capping agent including at least one of an aliphatic carboxylic acid and an aromatic carboxylic acid.
In one embodiment, the copolymerized polyamide resin may have a crystallization temperature (Tc) of about 240° C. to about 300° C. and a glass transition temperature (TO of about 70° C. to about 120° C.
In one embodiment, the copolymerized polyamide resin may have an intrinsic viscosity of about 0.5 dL/g to about 2.5 dL/g.
In one embodiment, the copolymerized polyamide resin may have a gas generation amount (weight reduction amount)of about 8 wt % or less, as measured after being heated at about 120° C. to about 350° C. for about 30 minutes, and a moisture absorption rate of about 3% or less, as calculated according to Equation 1:
Moisture absorption rate (%)=(|W1−W0|/W0)×100 [Equation 1]
wherein W0 is an initial weight of a specimen, and W1 is a weight of the specimen after the specimen is treated at about 85° C./85% RH for about 24 hours.
Another aspect of the present invention relates to a method for preparing a copolymerized polyamide resin. The method includes: polymerizing a monomer mixture including a dicarboxylic acid, a diamine, and a cyclic amide compound represented by Formula 2 or an amino acid compound represented by Formula 3, wherein the copolymerized polyamide resin has a melting point (Tm) of about 280° C. to about 330° C.
In one embodiment, the method may include: preparing a prepolymer by polymerizing the monomer mixture; and solid-state polymerizing the prepolymer.
In one embodiment, the prepolymer may have an intrinsic viscosity of about 0.1 dL/g to about 0.3 dL/g.
In one embodiment, solid-state polymerization of the prepolymer may include heating the prepolymer to a temperature of about 150° C. to about 280° C.
A further aspect of the present invention relates to a molded product formed of the copolymerized polyamide resin as set forth above.
Embodiments of the present invention can provide a highly heat-resistant crystalline copolymerized polyamide resin which can exhibit excellent heat resistance and melt processability, reduce or prevent gas generation during high-temperature processing, and have low moisture absorption, a method for preparing the same, and a molded product including the same.
Hereinafter, embodiments of the present invention will be described in detail.
A copolymerized polyamide resin according to the present invention includes: (A) a repeat unit derived from a dicarboxylic acid; (B) a repeat unit derived from a diamine; and (C) a repeat unit represented by Formula 1, wherein the copolymerized polyamide resin has a melting point (Tm) of about 280° C. to about 330° C.
wherein R1 is a C3 to C12 linear, branched, or cyclic alkylene group.
As used herein, the term “dicarboxylic acid” includes dicarboxylic acids, alkyl esters thereof (C1 to C4 lower alkyl esters such as monomethyl, monoethyl, dimethyl, diethyl, or dibutyl esters), and acid anhydrides thereof, and the dicarboxylic acid is reacted with a diamine and a cyclic amide compound or an amino acid compound to form the repeat unit derived from the dicarboxylic acid (dicarboxylic acid moiety). In addition, as used herein, the terms “dicarboxylic acid moiety”, “the repeat unit derived from a diamine (diamine moiety)”, and “repeat unit represented by Formula 1” refer to a residue remaining after removal of a hydroxyl group or an alkoxy group (from a carboxylic acid group), a residue remaining after removal of a hydrogen atom (from an amine group), and a ring-opened cyclic amide moiety or a residue remaining after removal of a hydrogen atom (from an amine group) upon polymerization of the dicarboxylic acid, the diamine, and the amino acid compound, respectively.
(A) Repeat Unit Derived from Dicarboxylic Acid
The repeat unit derived from a dicarboxylic acid according to one embodiment of the invention is a residue remaining after removal of a hydroxyl group or an alkoxy group from a carboxylic acid group of the dicarboxylic acid. For example, the repeat unit may be represented by Formula 4.
wherein R2 is the remainder of the dicarboxylic acid excluding the carboxylic acid group. For example, R2 may be a C4 to C30 hydrocarbon group or a C4 to C30 hydrocarbon group containing a heteroatom such as an oxygen atom and a sulfur atom, specifically a C4 to C18 linear, branched, or cyclic alkylene group, a C6 to C18 arylene group, a C4 to C18 linear, branched, or cyclic alkylene group containing a heteroatom, or a C6 to C18 arylene group containing a heteroatom.
In some embodiments, the dicarboxylic acid may include any typical dicarboxylic acid used in a polyamide resin without limitation. For example, the dicarboxylic acid may include an aromatic dicarboxylic acid.
In some embodiments, the aromatic dicarboxylic acid may be a compound including at least one C8 to C20 aromatic dicarboxylic acid, for example, terephthalic acid, isophthalic acid, 2,6-naphthalene dicarboxylic acid, 2,7-naphthalene dicarboxylic acid, 1,4-naphthalene dicarboxylic acid, 1,4-phenylene dioxyphenylene acid, 1,3-phenylene dioxydiacetic acid, diphenic acid, 4,4′-oxybis(benzoic acid), diphenylmethane-4,4′-dicarboxylic acid, diphenylsulfone-4,4′-dicarboxylic acid, 4,4′-diphenylcarboxylic acid, and a mixture thereof, without being limited thereto. Specifically, the aromatic dicarboxylic acid may be terephthalic acid, isophthalic acid, or a mixture thereof.
The aromatic dicarboxylic acid may be present in an amount of about 60 mol % to about 100 mol %, for example, about 60 mol % to about 90 mol %, specifically about 60 mol % to about 75 mol % in the dicarboxylic acid. Within this range, the copolymerized polyamide resin can exhibit excellent properties in terms of heat resistance and crystallinity.
In addition, the dicarboxylic acid according to the present invention may further include an aliphatic dicarboxylic acid so as to further improve processability of the copolymerized polyamide resin. The aliphatic dicarboxylic acid may include a C6 to C12 linear, branched, or cyclic aliphatic dicarboxylic acid, for example, adipic acid, 1,4-cyclohexane dicarboxylic acid, and 1,3-cyclohexane dicarboxylic acid, without being limited thereto. The aliphatic dicarboxylic acid may be optionally present in an amount of about 40 mol % or less, for example, about 10 mol % to about 40 mol %, specifically about 25 mol % to about 40 mol % in the dicarboxylic acid. Within this range, it is possible to reduce or prevent gas generation during high-temperature processing of a polyamide resin with the aliphatic dicarboxylic acid and to obtain a copolymerized polyamide resin having better processability.
(B) Repeat Unit Derived from Diamine
The repeat unit derived from a diamine according to one embodiment of the present invention is a residue remaining after removal of a hydrogen atom from an amine group of the diamine. For example, the repeat unit may be represented by Formula 5.
wherein R3 is the remainder of the diamine excluding an amine group. For example, R3 may be a C4 to C30 hydrocarbon group or a C4 to C30 hydrocarbon group containing a heteroatom such as an oxygen atom and a sulfur atom, specifically a C4 to C20 linear, branched, or cyclic alkylene group, a C6 to C30 arylene group, a C4 to C20 linear, branched, or cyclic alkylene group containing a heteroatom, or a C6 to C30 arylene group containing a heteroatom.
In some embodiments, the diamine may include any typical diamine used in a polyamide resin, without limitation. For example, the diamine may include an aliphatic diamine.
In some embodiments, the aliphatic diamine may include at least one C4 to C20 aliphatic diamine. For example, the aliphatic diamine may include a linear or branched aliphatic diamine such as 1,4-butane diamine, 1,6-hexane diamine(hexamethylene diamine(HMDA)), 1,7-heptane diamine, 1,8-octane diamine, 1,10-decane diamine(DDA), 1,12-dodecane diamine(DDDA), 3-methyl-1,5-pentane diamine, 2,2,4-trimethyl-1,6-hexane diamine, 2,4,4-trimethyl-1,6-hexane diamine, 5-methyl-1,9-nonane diamine, 2,2-oxybis(ethylamine), bis(3-aminopropyl)ether, ethylene glycol bis(3-aminopropyl)ether (EGBA), 1,7-diamino-3,5-dioxoheptane, and a mixture thereof, without being limited thereto.
In some embodiments, the aliphatic diamine may be a mixture of a C4 to C10 aliphatic diamine and a C11 to C20 aliphatic diamine, without being limited thereto. In this case, the C4 to C10 aliphatic diamine may be present in an amount of about 1 mol % to about 99 mol %, for example about 50 mol % to about 95 mol %, specifically about 85 mol % to about 95 mol % in the aliphatic diamine. The C11 to C20 aliphatic diamine may be present in an amount of about 1 mol % to about 99 mol %, for example, about 5 mol % to about 50 mol %, specifically about 5 mol % to about 15 mol % in the aliphatic diamine. Within this range, the copolymerized polyamide resin can exhibit excellent properties in terms of heat resistance and moisture absorption and have low gas generation during high-temperature processing.
The aliphatic diamine may be present in an amount of about 70 mol % to about 100 mol %, for example, about 85 mol % to about 99 mol % in the diamine. Within this range, the copolymerized polyamide resin can exhibit excellent properties in terms of melt processability, dimensional stability, and heat resistance such as glass transition temperature.
In addition, the diamine (B) of the present invention may further include an aromatic diamine and/or a cyclic aliphatic diamine so as to improve heat resistance and crystallinity of the copolymerized polyamide resin.
The aromatic diamine may include at least one C6 to C30 aromatic diamine. Examples of the aromatic diamine may include a phenylene diamine compound such as m-phenylene diamine, p-phenylene diamine, a xylene diamine compound such as m-xylene diamine and p-xylene diamine, and a naphthalene diamine compound, without being limited thereto.
The cyclic aliphatic diamine may include at least one of C6 to C3 ocyclic aliphatic diamines. Examples of the cyclic aliphatic diamine may include bis(p-amino-cyclohexyl)methane (PACM) and bis(p-amino-3-methyl-cyclohexyl)methane (MACM), without being limited thereto.
In some embodiments, when the aromatic diamine and/or the cyclic aliphatic diamine are used, the aromatic diamine and/or the cyclic aliphatic diamine may be present in an amount of about 30 mol % or less, for example, about 1 mol % to about 15 mol % in the diamine. Within this range, the copolymerized polyamide resin can exhibit excellent properties in terms of heat resistance and chemical resistance.
In the copolymerized polyamide resin according to the present invention, a mole ratio of the (B) repeat unit derived from the dicarboxylic acid to the (A) repeat unit derived from the dicarboxylic acid (diamine (B)/dicarboxylic acid (A)) may range, for example, from about 0.95 to about 1.15, for example, from about 1.00 to about 1.10. Within this range, it is possible to prepare a polymer having a degree of polymerization suitable for molding and to prevent property deterioration due to unreacted monomers.
(C) Repeat Unit Represented by Formula 1
The repeat unit represented by Formula 1 is a ring-opened cyclic amide compound moiety or a residue remaining after a hydrogen atom is removed from an amine group of an amino acid compound and a hydroxyl group or an alkoxy group is removed from a carboxylic acid group of the amino acid compound.
In some embodiments, the cyclic amide (lactam) compound and the amino acid compound can replace or be used together with the aliphatic dicarboxylic acid, which is used to improve melt processability, and serve to sharply reduce a melting point of the copolymerized polyamide resin, thereby increasing the content of an aromatic dicarboxylic acid moiety in a dicarboxylic acid moiety. Thus, the copolymerized polyamide according to the present invention including the ring-opened cyclic amide compound or the polycondensed amino acid compound has better heat resistance and crystallinity than a typical copolymerized polyamide resin having the same level of melt processability as the copolymerized polyamide resin according to the present invention and can reduce or prevent gas generation due to the aliphatic dicarboxylic acid moiety during high-temperature processing.
In some embodiments, the cyclic amide compound may include a typical C4 to C12 cyclic amide compound, for example, a cyclic amide compound represented by Formula 2.
wherein R1 is a C3 to C12 linear, branched, or cyclic alkylene group, for example a C4 to C12 linear alkylene group.
Examples of the cyclic amide compound may include ε-caprolactam, laurolactam, and a mixture thereof, without being limited thereto.
In some embodiments, the amino acid compound may include a typical C4 to C12 amino acid, for example, an amino acid compound represented by Formula 3.
wherein R1 is a C3 to C12 linear, branched, or cyclic alkylene group, for example, a C4 to C12 linear alkylene group.
Examples of the amino acid compound may include 5-aminopentanoic acid, 12-aminododecanoic acid, and a mixture thereof, without being limited thereto.
In the copolymerized polyamide resin according to the invention, the repeat unit represented by Formula 1 (cyclic amide compound or amino acid compound) may be present in an amount of about 5 parts by mole to about 40 parts by mole, for example, about 10 parts by mole to about 35 parts by mole, based on about 100 parts by mole of the dicarboxylic acid and the diamine. Within this range, the copolymerized polyamide resin can exhibit excellent properties in terms of melt processability, heat resistance, crystallinity, and balance therebetween.
The copolymerized polyamide resin may be end-capped with an end-capping agent including at least one of an aliphatic carboxylic acid and an aromatic carboxylic acid. Examples of the end-capping agent may include acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, caprylic acid, lauric acid, tridecylic acid, myristic acid, palmitic acid, stearic acid, pivalic acid, isobutyric acid, benzoic acid, toluic acid, α-naphthalene carboxylic acid, β-naphthalene carboxylic acid, methylnaphthalene carboxylic acid, and a mixture thereof, without being limited thereto.
The end-capping agent may be present in an amount of about 0.01 parts by mole to about 3 parts by mole, for example, about 0.1 parts by mole to about 2 parts by mole based on about 100 parts by mole of the dicarboxylic acid(A) and the diamine(B), without being limited thereto.
The copolymerized polyamide resin according to the present invention may be prepared by a typical polyamide preparation method and may be prepared, for example, by polymerization of a monomer mixture including the dicarboxylic acid, the diamine, and the cyclic amide compound or the amino acid compound.
Here, the polymerization may be performed by any typical polymerization method known in the art, for example, melt polymerization at a polymerization temperature of about 80° C. to about 300° C., for example, about 90° C. to about 280° C. at a polymerization pressure of about 10 kgf/cm2 to about 40 kgf/cm2, without being limited thereto.
In some embodiments, the copolymerized polyamide resin may be prepared by polymerizing the monomer mixture to prepare a prepolymer, followed by solid-state polymerization of the prepolymer. For example, the copolymerized polyamide resin may be prepared by a process in which a reactor is filled with the monomer mixture, a catalyst, and water, followed by stirring the mixed solution at about 80° C. to about 150° C. for about 0.5 to 2 hours, and the solution is maintained at about 200° C. to about 280° C. and at about 20 kgf/cm2 to about 40 kgf/cm2 for about 2 to 4 hours, followed by reaction (copolymerization) at a reduced pressure of about 10 kgf/cm2 to about 30 kgf/cm2 for about 1 to 3 hours to obtain a prepolymer and solid-state polymerization of the prepolymer under a vacuum at a temperature between the glass transition temperature (Tg) and the melting point (Tm) of the prepolymer for about 5 to 30 hours.
The prepolymer may have an intrinsic viscosity (η) of about 0.1 dL/g to about 0.3 dL/g, for example, about 0.15 dL/g to about 0.25 dL/g, as measured at 25° C. using an Ubbelohde viscometer after being dissolved in an about 98% sulfuric acid solution to a concentration of about 0.5 g/dl. Within this range, the copolymerized polyamide resin can have excellent melt processability.
In some embodiments, solid-state polymerization may be performed by heating the prepolymer to a temperature of about 150° C. to about 280° C., for example, about 180° C. to about 250° C., under a vacuum or in the presence of an inert gas such as nitrogen gas and argon gas. Within this range, it is possible to obtain a copolymerized polyamide resin having a weight average molecular weight of about 5,000 g/mol to about 50,000 g/mol.
In copolymerization, a catalyst may be used. The catalyst may be a phosphorous catalyst, for example, phosphoric acid, phosphorous acid, hypophosphorous acid, or a salt or derivative thereof Specifically, the catalyst may include phosphoric acid, phosphorous acid, hypophosphorous acid, sodium hypophosphite, sodium hypophosphate, and sodium hypophosphinate.
The catalyst may be present in an amount of about 3 parts by weight or less, for example about 0.001 parts by weight to about 1 part by weight, specifically about 0.01 parts by weight to about 0.5 parts by weight based on about 100 parts by weight of the monomer mixture, without being limited thereto.
In preparation of the polyamide resin, the end-capping agent may be used in an amount as set forth above, and viscosity of the copolymerized polyamide resin can be adjusted by regulating an amount of the end-capping agent.
The copolymerized polyamide resin according to the present invention may have a melting point (Tm) of about 280° C. or higher, for example, about 280° C. to about 330° C. Within this range, the copolymerized polyamide resin can be highly heat resistant and thus have excellent properties in terms of moldability and heat resistance.
The copolymerized polyamide resin may have a crystallization temperature (Tc) of about 240° C. to about 300° C., for example, about 245° C. to about 280° C. Within this range, it is possible to obtain a copolymerized polyamide resin having high crystallinity.
In addition, the copolymerized polyamide resin may have a glass transition temperature (Tg) of about 70° C. to about 120° C., for example, about 75° C. to about 115° C. Within this range, the copolymerized polyamide resin can exhibit excellent properties in terms of heat resistance and processability and thus can be appropriately used as a material for electric/electronic components.
The copolymerized polyamide resin may have a gas generation amount (weight loss) of about 8 wt % or less, for example, about 1 wt % to about 7.5 wt %, as measured by thermogravimetric analysis (TGA) after being heated at about 120° C. to about 350° C. for about 30 minutes. Within this range, it is possible to reduce or prevent blistering during molding of the copolymerized polyamide resin.
The copolymerized polyamide resin may have a moisture absorption rate of about 3% or less, for example, about 2% or less, specifically about 0.5% to about 1.5%, as measured on a specimen treated at about 85° C./85% RH for about 24 hours. The moisture absorption rate may be calculated according to Equation 1 after a specimen having a size of about 90 mm×about 50 mm×about 2 mm (length×width×thickness) is subjected to vacuum drying at about 120° C. for about 4 hours, followed by measurement of an initial weight (W0) of the specimen, and the specimen is treated in a thermo-hygrostat at about 85° C./85% RH for 24 hours, followed by measurement of a weight (W1) of the specimen. Within this range, it is possible to reduce or prevent blistering during molding of the copolymerized polyamide resin.
Moisture absorption rate (%)=(|W1−W0|/W0)×100 [Equation 1]
wherein W0 is an initial weight of a specimen, and W1 is a weight of the specimen after the specimen is treated at about 85° C./85% RH for 24 hours.
The copolymerized polyamide resin may have an intrinsic viscosity (η) of about 0.5 dL/g about 2.5 dL/g, for example, about 0.5 dL/g to about 2.0 dL/g, as measured at 25° C. using an Ubbelohde viscometer after being dissolved in an about 98% sulfuric acid solution to a concentration of about 0.5 g/dl.
The copolymerized polyamide resin may have a yellow index (YI) of about 5 to about 10, for example about 6 to about 9.5, as measured on a specimen having a size of about 90 mm×about 50 mm×about 2 mm (length×width×thickness) after the specimen is heat-treated in a gear oven at about 250° C. for about 10 minutes in accordance with ASTM E313-73.
In addition, the copolymerized polyamide resin may have a weight average molecular weight of about 5,000 g/mol to about 50,000 g/mol, as measured by GPC.
A molded product according to the present invention may be formed of the copolymerized polyamide resin. For example, the polyamide resin may be produced into a material for electric/electronic components requiring high processability and low gas generation (for example, connectors, LED diffuser plates, and the like), without being limited thereto. The molded product can be easily formed by those skilled in the art to which the present invention pertains.
Next, the present invention will be described in more detail with reference to some examples. It should be understood that these examples are provided for illustration only and are not to be construed in any way as limiting the invention.
In amounts as listed in Table 1, a monomer mixture including terephthalic acid (TPA) and adipic acid (AA) as a dicarboxylic acid (diacid), hexamethylene diamine (HMDA) as a diamine, and ε-caprolactam as a cyclic amide; 1.49 parts by mole of benzoic acid as an end-capping agent (based on 100 parts by mole of the dicarboxylic acid and the diamine); and 0.1 parts by weight of sodium hypophosphinate as a catalyst, and 74 parts by weight of water (based on 100 parts by weight of the monomer mixture)were placed in a 1 L auto Clave reactor, followed by purging with nitrogen. After stirring the raw materials at 100° C. for 60 minutes, the temperature of the reactor was increased to 250° C. for 2 hours, followed by reaction for 3 hours while maintaining the pressure of the reactor at 25 kgf/cm2, and the reactor was decompressed to a pressure of 15 kgf/cm2, followed by reaction for 1 hour and flashing the mixed solution, thereby separating a polyamide pre-copolymer from water. The separated polyamide pre-copolymer (intrinsic viscosity (η): 0.2 dL/g) was introduced into a tumbler-type reactor, followed by solid-state polymerization at 230° C. for 24 hours. Then, the reactor was slowly cooled to room temperature, thereby obtaining a copolymerized polyamide resin.
Polyamide resins prepared in Examples and Comparative Examples were evaluated as to melting point, crystallization temperature, glass transition temperature, intrinsic viscosity, moisture absorption rate, and gas generation amount according to the following methods. Results are shown in Table 2.
(1) Melting point (Tm), crystallization temperature (Tc), and glass transition temperature (Tg)(unit: ° C.): Melting point, crystallization temperature, and glass transition temperature of each of the polyamide resins obtained through solid-state polymerization in Examples and Comparative Examples were measured using a differential scanning calorimeter (DSC). As the DSC, a DSC-Q20 available from TA Instruments was used. 5 to 10 mg of a sample was subjected to vacuum drying at 80° C. for 4 hours (at a moisture concentration of 3,000 ppm or less), heated from 30° C. to 400° C. at a heating rate of 10° C./min under a nitrogen atmosphere, and then left at 400° C. for 1 minute, followed by measuring crystallization temperature at the exothermic peak while cooling the sample at a cooling rate of 10° C./min. Then, the sample was left at 30° C. for 1 minute, followed by measuring glass transition temperature and melting point at the transition temperature peak and the endothermic peak, respectively, while heating the sample to 400° C. at a heating rate of 10° C./min (2nd scan).
(2) Intrinsic viscosity (unit: dL/g): Intrinsic viscosity was measured on a polyamide resin specimen at 25° C. using an Ubbelohde viscometer after dissolving the specimen in a 98% sulfuric acid solution to a concentration of 0.5 dL/g.
(3) Moisture absorption rate (unit: %): Moisture absorption rate was calculated according to Equation 1 after a specimen having a size of about 90 mm×about 50 mm×about 2 mm (length×width×thickness) was subjected to vacuum drying at about 120° C. for about 4 hours, followed by measurement of an initial weight (W0) of the specimen, and the specimen was treated in a thermo-hygrostat at about 85° C./85% RH for 24 hours, followed by measurement of a weight (W1) of the specimen. Within this range, it is possible to reduce or prevent blistering during molding of the copolymerized polyamide resin.
Moisture absorption rate (%)=(|W1−W0|/W0)×100 [Equation 1]
wherein W0 is an initial weight of a specimen, and W1 is a weight of the specimen after the specimen is treated at about 85° C./85% RH for 24 hours.
(4) Gas generation amount (unit: wt %): Isothermal TGA was performed using a TGA Q500 available from TA Instruments to measure gas generation amount. Specifically, 20 mg of a polyamide resin specimen was placed in a sample pan, which in turn was heated to 120° C. at a heating rate of 10° C./min, followed by drying the specimen while maintaining the temperature of the pan at 120° C. for 30 minutes, and the pan was then heated to 350° C. at a heating rate of 10° C./min, followed by measuring the amount of generated pyrolytic gas (weight loss of the resin specimen) while maintaining the temperature of the pan at 350° C. for 30 minutes.
(5) Yellow Index (YI): Yellow index was measured on a specimen having a size of 90 mm×50 mm×2 mm (length×width×thickness) using a colorimeter (CM-2600d, Konica Minolta) after the specimen was heat-treated in a gear oven at 250° C. for 10 minutes in accordance with ASTM E313-73.
From the results shown in Table 2, it can be seen that the copolymerized polyamide resins according to the present invention (Examples 1 to 5) were crystalline copolymerized polyamide resins having a melting point (Tm) of about 280° C. to about 330° C. and had excellent properties in terms of heat resistance and melt processability. In addition, it can be seen that the copolymerized polyamide resins according to the present invention had a low moisture absorption rate of 1.4% or less, had a gas generation amount of 7.1 wt % or less and thus could reduce gas generation during high-temperature processing, and had a yellow index of 9.4 or less after heat-treatment and thus had excellent discoloration resistance.
It should be understood that various modifications, changes, alterations, and equivalent embodiments can be made by those skilled in the art without departing from the spirit and scope of the present invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2014-0062521 | May 2014 | KR | national |
| 10-2014-0170879 | Dec 2014 | KR | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/KR2014/011779 | 12/3/2014 | WO | 00 |
