Claims
- 1. A high conductivity and high strength copper base alloy consisting essentially of 0.8 to 5% by weight titanium as a first component, 1.2 to 5% by weight of a second component selected from the group consisting of antimony, phosphorus, silicon, arsenic, germanium, tin and mixtures thereof, balance copper, wherein the first and second components are present at an atomic ratio of not more than 10% above 5 atoms of said first component per 3 atoms of said second component.
- 2. An alloy according to claim 1, wherein up to one-fifth of the titanium is replaced by an element selected from the group consisting of zirconium, hafnium, and mixtures thereof.
- 3. An alloy according to claim 1, wherein the first component and second component are present at an atomic ratio of 3 to 3.6 atoms of the second component per 5 atoms of the first component.
- 4. An alloy according to claim 1, wherein about 0.9 to 3% titanium and about 1.3 to 4.5% antimony are present in said alloy.
- 5. An alloy according to claim 1, wherein a small but effective amount of an element from the group consisting of aluminum, magnesium, boron, mischmetal, lead, selenium and tellurium is present in said alloy, provided that said effective amount does not exceed 0.5% by weight.
Parent Case Info
CROSS REFERENCE TO RELATED APPLICATION
This application is a Continuation-In-Part of co-pending application Ser. No. 559,307 by Stanley Shapiro et al. for "Improved Copper Base Alloys With High Strength and High Electrical Conductivity", filed Mar. 17, 1975, now U.S. Pat. No. 4,007,039.
US Referenced Citations (5)
Continuation in Parts (1)
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Number |
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559307 |
Mar 1975 |
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