Claims
- 1. A copper based alloy for use as a material for electrical and electronic parts, which is excellent in electric conductivity solder-exfoliation resistance when bent, high-temperature creep strength, and migration resistance, as well as in hot workability and blankability, consisting essentially, by weight percent, of 1.3 to 2.7% Ni, 0.2 to 0.79% Sn, 0.2 to 0.8% Si, 0.4 to 2.0% Zn 0.01 to 0.12% Fe, 0.002 to 0.10% P, 0.001 to 0.10% Mg, 0.0002 to 0.0008% C, and the balance being Cu and inevitable impurities.
- 2. A copper based alloy for use as a material for electrical and electronic parts, which is excellent in electric conductivity, solder-exfoliation resistance when bent, high-temperature creep strength, and migration resistance, as well as in hot workability and blankability, consisting essentially, by weight percent, of 1.3 to 2.7% Ni, 0.2 to 0.79% Sn, 0.2 to 0.8% Si, 0.4 to 2.0% Zn, 0.01 to 0.12% Fe, 0.002 to 0.10% P, 0.001 to 0.10% Mg, 0.0002 to 0.0008% C, more than 0.01% and up to 0.2% at least one element selected from the group consisting of Cr and Zr, and the balance being Cu and inevitable impurities.
Priority Claims (1)
Number |
Date |
Country |
Kind |
4-328806 |
Nov 1992 |
JPX |
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CROSS-REFERENCE TO RELATED CASES
The present application is a continuation-in-part application Ser. No. 08/151,516 filed Nov. 12, 1993, now abandoned, the entire text of which is incorporated herein by reference.
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Name |
Date |
Kind |
4750029 |
Futatsuka et al. |
Jun 1988 |
|
4971758 |
Suzuki et al. |
Nov 1990 |
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5002732 |
Yamasaki et al. |
Mar 1991 |
|
5024814 |
Futatasuka et al. |
Jun 1991 |
|
Foreign Referenced Citations (4)
Number |
Date |
Country |
60-245754 |
Dec 1985 |
JPX |
2-66131 |
Mar 1990 |
JPX |
2-194138 |
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JPX |
3-56636 |
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JPX |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
151516 |
Nov 1993 |
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