Claims
- 1. An agent for controlling fungi and bacteria, based on an aqueous solution of a plant-tolerated copper amine salt of a polymer acid containing from 60 to 100% of acrylic acid or methacrylic acid and from 0 to 40% of an acrylate or methacrylate monomer, said polymer having a measurable K value said solution containing at least 12% by weight copper, which is formed by admixing CuO in an amount sufficient to yield at least 12% weight copper in the final product, with an aqueous solution of said polymer, subjecting said mixture to superatmospheric ammonia gas at a pressure of 1.5 to 3 bars, in the substantial absence of air, wherein said ammonia is present in at least a 10% to 100% excess based on the carboxylic acid equivalent amount of the polymer, for a period of time, and at a temperature sufficient to dissolve the CuO up to the equivalent amount of acid units in said polymer, wherein a solution containing at least 12% values of copper is produced having long term storage stability.
- 2. The agent of claim 1, wherein said copper content ranges up to 20%.
- 3. The agent of claim 2, wherein said copper content ranges from 12 to 18%.
- 4. The agent of claim 3, wherein said copper content ranges form 14 to 16%.
- 5. A process for producing an agent for controlling fungi and bacteria, based on an aqueous solution of a plant-tolerated copper amine salt of a polymer containing from 60 to 100% of acrylic acid or methacrylic acid and from 0 to 40% of an acrylate or methacrylate monomer, said polymer having a measurable K value, said solution containing at least 12% by weight copper, which is formed by admixing CuO in an amount sufficient to yield at least 12% weight copper in the final product, with an aqueous solution of said polymer, subjecting said mixture to superatmospheric ammonia gas at a pressure of 1.5 to 3 bars, in the absence of air, wherein said ammonia is present in at least a 10% to 100% excess based on the carboxylic acid equivalent amount of the polymer for a period of time, and at a temperature sufficient to dissolve the CuO up to the equivalent amount of acid units in said polymer, wherein a solution containing at least 12% values of copper is produced having long term storage stability.
- 6. The process of claim 4, wherein said copper content ranges from 11 to 20%.
- 7. The process of claim 6, wherein said copper content ranges up to 18%.
Priority Claims (1)
Number |
Date |
Country |
Kind |
3608681 |
Mar 1986 |
DEX |
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Parent Case Info
This application is a continuation of Ser. No. 07/273,727, filed on Nov. 18, 1988, now abandoned, which is a continuation of Ser. No. 07/026,436, filed Mar. 16, 1987, now abandoned.
US Referenced Citations (3)
Foreign Referenced Citations (3)
Number |
Date |
Country |
970321 |
Jan 1951 |
EPX |
0039538 |
Nov 1981 |
EPX |
0039788 |
Oct 1981 |
DEX |
Continuations (2)
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Number |
Date |
Country |
Parent |
273727 |
Nov 1988 |
|
Parent |
26436 |
Mar 1987 |
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