One or more embodiments relates to solar cells, and more particularly to copper indium gallium di-selenide (CIGS) solar cells having staggered back contacts (SBC).
Solar cells which utilize top contacts on copper indium gallium di-selenide (CIGS) are known in the prior art. A prior art top contact CIGS cell 100 is shown in
Embodiments in accordance with the invention provide a solar cell design having a single copper indium gallium di-selenide (CIGS) cell with a staggered back contacts (SBC). Embodiments in accordance with the invention remove the shadowing effect seen with the prior art top contact CIGS cell design and provide increased power output.
Embodiments in accordance with the invention are best understood by reference to the following detailed description when read in conjunction with the accompanying drawings.
The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.
Embodiments in accordance with the invention are further described herein with reference to the drawings.
Embodiments in accordance with the invention provide a solar cell design having a single copper indium gallium di-selenide (CIGS) cell with a staggered back contacts (SBC).
Just below ZnO window layer 202 is an n-type cadmium sulfide (CdS) buffer layer 204. CdS has an EG of 2.3 eV, and the purpose of CdS buffer layer 204 is to tunnel photons to an CIGS absorber layer 206 underlying CdS buffer layer 204. Directly below CdS buffer layer 204 is a CIGS absorber layer 206 divided into n-type CIGS section 206A and p-type CIGS section 206B. CIGS absorber layer 206 produces the majority of the carriers based on the number of photons that enter cell 200. CIGS absorber layer 206 is composed of two materials, CuInSe2 (CIS) and CuGaSe2 (CGS), both of which are direct bandgap semiconductors. Depending on the ratio of CIS to CGS, the bandgap can shift between 1.07-1.76 eV. Directly below CIGS absorber layer 206 is a CIGS back surface field (BSF) layer 208 divided into an n-type CIGS BSF section 208A and a p-type CIGS BSF section 208B. Beneath CIGS BSF layer 208 is an aluminum (Al) cathode contact 210 and an aluminum (Al) anode contact 212 formed in a staggered arrangement and separated by an insulator gap 214.
SBC CIGS cell 200 is lightweight, flexible and low cost. In one embodiment, a thin layer of n-type zinc oxide (ZnO) window layer 202 is utilized to collect carriers that are generated by impinging sunlight Q and then sends the carriers to cathode contact 210. N-type cadmium sulfide (CdS) buffer layer 204 funnels photons to CIGS absorber layer 206 and acts as the N side to the PN junction of SBC CIGS cell 200. CIGS absorber layer 206 is divided into an n-type CIGS section 206A and a p-type CIGS section 206B, with n-type CIGS section 206A funneling all the electrons and p-type CIGS section 206B funneling all the holes. CIGS BSF layer 208, having both n-type CIGS BSF section 208A and p-type CIGS BSF section 208B, acts as a back surface field (BSF) to increase the efficiency of SBC CIGS cell 200. Embodiments in accordance with the invention maintain the back surface reflector (BSR) by using the metal contacts, Al cathode contact 210 and Al anode contact 212 on the back of SBC CIGS cell 200 to recirculate photons and lower temperature. Layer properties (thickness, length, back contact material, etc.) can be optimized to improve overall conversion efficiency to 23%.
In operation, when a sunlight photon with energy greater than or equal to EG of n-type ZnO window layer 202 enters cell 200, an electron hole pair (EHP) is generated. The EHP are primarily generated at the PN junction between n-type CdS buffer layer 204 and p-type CIGS layer 206B. With the help of the electric field within the depletion region of the PN junction, the EHP are separated. Due to n-type ZnO window layer 202 EG, electrons are repelled away from the surface to prevent recombination. Now n-type CIGS layer 206A is funneling the electrons towards the metal contact, Al cathode contact 210 while the p-type CIGS layer 206B is funneling holes to its respective metal contact, Al anode contact 212. By adding n-type CIGS BSF sublayer 208A and p-type CIGS BSF sublayer 208B, an additional electric field is established and helps reduce recombination of EHP. When the two metal contacts, cathode contact 210 and anode contact 212, are connected to an electrical load, such as an external circuit 216 comprising load RL, electrons travel from the cathode contact 210 to the anode contact 212, where the electrons recombine with holes. Air gap 214 is located between cathode contact 210 and anode contact 212 in order to prevent shorting the two terminals, cathode contact 210 and anode contact 212, of SBC CIGS cell 200.
To illustrate the increased efficiency of SBC CIGS cell 200, a simulation was successfully modeled of prior art top contact CIGS cell 100 made by the National Renewable Energy Laboratory (NREL). The actual NREL cell and simulated cell had approximately the same output parameters, supporting the assumption of an accurate model. The simulated cell characteristics are displayed in Table 1 below. Units are in microns (μm) for the length and thickness. The total area of the simulated prior art top contact CIGS cell is 0.994 cm2.
Unfortunately, the prior art top contact CIGS cell 100 top contact prevents photons from entering cell 100. In the simulated prior art top contact CIGS cell 100 model, 10% of the prior art top contact CIGS cell 100 was obscured by the top contact, i.e., shadowing.
In simulation of SBC CIGS cell 200, embodiments in accordance with the invention provide 18% more power output than a prior art CIGS cell 100 having a top contact. Table 2 shows the characteristics of one embodiment of a simulated of a SBC CIGS cell, such as SBC CIGS cell 200, in accordance with the invention. The units are in microns (μm). In the present embodiment, the total area of the SBC CIGS cell is 0.994 cm2. Advantageously, embodiments in accordance with invention, maintain the BSR on the metal contacts, Al cathode contact 210 and Al anode contact 212, which improves efficiency and lowers temperature of cell 200. By adding an n-type CIGS layer 206, and CIGS BSF layers 208, electrons are now funneled to Al cathode contact 210, while holes continue to go towards Al anode contact 212.
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This description provides exemplary embodiments of the present invention. The scope of the present invention is not limited by these exemplary embodiments. Numerous variations, whether explicitly provided for by the specification or implied by the specification or not, may be implemented by one of skill in the art in view of this disclosure.
It is to be understood that the above-described arrangements are only illustrative of the application of the principles of the present invention and it is not intended to be exhaustive or limit the invention to the precise form disclosed. Numerous modifications and alternative arrangements may be devised by those skilled in the art in light of the above teachings without departing from the spirit and scope of the present invention.
This patent application is a non-provisional of and claims the benefit of U.S. Provisional application 62/893,574, filed Aug. 29, 2019, which is hereby incorporated by reference in its entirety.
Number | Date | Country | |
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62893574 | Aug 2019 | US |