Copper nanostructures have increasingly been found to have significant utility in the microelectronics and catalysis fields. For example, copper nanowires (e.g., polycrystalline wires that are usually fabricated by lithographic techniques) are currently used as interconnects in computer chips. Copper nanostructures hold great promise for use in microelectronics including low-cost flexible displays, light-emitting diodes and thin film solar cells. Copper nanostructures have also been found to exhibit localized surface plasmon resonance (LSPR) peaks in the visible region. Copper nanoparticles have been widely used as catalysts for water-gas shift and gas detoxification reactions.
Metal nanostructures in the shape of nanowires are believed to find widespread use in applications such as the fabrication of transparent electrodes for flexible electronic and display devices. They are also useful in formulating conductive coatings for electrostatic discharging and electromagnetic shielding. Research has conventionally focused on use of silver nanowires for use in such applications. Compared to silver, copper is several orders of magnitude more abundant and is significantly less expensive. Copper nanowires with reduced sizes (i.e., reduced diameters) exhibit increased transmittance of visible light making them even more ideal for electronics use.
A continuing need exists for copper nanostructures that are suitable for use in various applications such as microelectronics and catalysis and for methods for producing them. A particular need exists for copper nanowires with relatively small diameters and methods for producing such nanowires.
One aspect of the present disclosure is directed to a method for producing a copper nanostructure. A reaction mixture is formed in a reaction vessel. The reaction mixture includes a copper-containing compound, a capping agent and a reducing agent. The copper-containing compound is reduced with the reducing agent to cause copper to form a copper nanostructure. The pressure in the reaction vessel is less than about 190 kPa and/or the temperature of the reaction mixture is less than about 115° C. during formation of the nanostructure.
A further aspect of the present disclosure is directed to a population of copper nanowire structures. Each structure has a length and a diameter. The average diameter of the copper nanowire structures is less than about 40 nm and the average ratio of length to diameter of the copper nanowire structures is at least about 10:1.
Another aspect of the present disclosure is directed to a copper nanowire structure. The structure includes at least about 60 wt % copper and is characterized by a penta-twinned shape.
Various refinements exist of the features noted in relation to the above-mentioned aspects of the present disclosure. Further features may also be incorporated in the above-mentioned aspects of the present disclosure as well. These refinements and additional features may exist individually or in any combination. For instance, various features discussed below in relation to any of the illustrated embodiments of the present disclosure may be incorporated into any of the above-described aspects of the present disclosure, alone or in any combination.
The field of the disclosure relates to copper nanostructures and, more particularly, to copper nanostructures with relatively small dimensions and methods for producing such structures. The ratios of the various reaction products may be adjusted to produce other structures such as tad-pole shaped nanowires, nanocubes or pentagonal bi-pyramids.
Provisions of the present disclosure are directed to copper nanostructures (e.g., nanowires) and methods for producing copper nanostructures. Without being held to any particular theory, it has been found that copper nanostructures formed at relatively low pressures (e.g., atmospheric pressure) and/or low temperatures (e.g., 100° C. or less) have a relatively small diameter. Further it has been found that by adjusting the concentration of the components of the reaction mixture and/or adjusting the respective ratios of the components, the shape of the resulting nanostructure may be changed.
Generally the copper nanostructures of the present disclosure are produced by forming a reaction mixture that contains a copper-containing compound, a capping agent and a reducing agent. The copper-containing compound is reduced by the reducing agent to produce elemental copper that forms the nanostructure. During reduction, the pressure and/or temperature of the reaction vessel may be maintained relatively low (e.g., a pressure of less than about 190 kPa and/or a temperature of less than about 115° C.) such that nanowires with a relatively small diameter may be produced.
Suitable copper-containing compounds that may be included in the reaction mixture include any compounds from which elemental copper)(Cu0 is formed upon contact with a reducing agent or during electrolysis or an electroless deposition method, or upon decomposition. Exemplary copper-containing compounds include copper (II) nitrate (Cu(NO3)2, anhydrous or hydrated), copper (II) sulfate (CuSO4, anhydrous or hydrated), copper (II) chloride (CuCl2, anhydrous or hydrated), copper (II) hydroxide (Cu(OH)2, anhydrous or hydrated), copper (II) acetate (Cu(CH3COO)2, anhydrous or hydrated), and copper (II) trifluoroacetate (Cu(CF3COO)2, anhydrous or hydrated). Suitable copper-containing compounds may also include various ligands and/or chelates that contain copper without limitation.
The reducing agent that is combined with the copper-containing compound is any compound (or ligand or chelate) that reduces copper ions into elemental copper to deposit as a nanostructure seed or as part of the growing copper nanostructure. Suitable reducing agents include glucose (a or (3 form) and ascorbic acid.
In addition to the copper-containing compound and the reducing agent, a capping agent is included in the reaction mixture. The capping agent stabilizes the resulting nanostructure (e.g., by changing the surface energies of different facets) and prevents aggregation between the structures. The capping agent becomes incorporated into the matrix during formation of the copper nanostructure-based composites. Suitable capping agents include alkylamines. Alkylamines have the general structure of Formula (I) shown below
wherein R1 is an alkyl group (or substituted alkyl group) and R2 and R3 are either hydrogen or an alkyl group (or substituted alkyl group). In some embodiments, the alkyl group of R1 has 25 carbon atoms or less. One particularly preferred alkylamine is hexadecylamine (“HDA”). HDA has been found to be an effective capping agent for copper and has a strong selectivity toward the {100} facets of the nanostructure. In some particular embodiments, HDA is used as a capping agent and glucose is used as a reducing agent. In such embodiments, copper nanostructures may be produced in relatively large quantities with high purity and good uniformity. Other alkylamines of Formula (I) that may be used include octadecylamine and oleylamine.
Generally, the components that form the reaction mixture are dissolved in water; however in some embodiments an organic solvent may be used or even a two-solvent system may be used. The copper-containing compound, the reducing agent and capping agent may be added to any suitable reaction vessel in any manner suitable to those of skill in the art (e.g., as solids or in solution form and in any order of addition). Suitable vessels may be lab scale (e.g., reaction vials) or may be commercial-scale (e.g., steel vessels which may be polymer-lined). Preferably the reaction vessel is agitated during formation of the copper nanostructures. The nanostructures may be produced batch-wise or in a continuous manner (e.g., a continuous-stirred tank reactor (CSTR)).
Upon formation of the reaction mixture, the reaction contents are heated. Generally, the reaction mixture is heated to a temperature less than about 115° C. In some embodiments, the reaction mixture is heated to a temperature less than about 110° C. or less than about 105° C. Preferably, the reaction mixture is heated to a temperature of 100° C. or less to prevent the reaction mixture from boiling causing the pressure of the reaction contents to increase as in pressurized vessel systems. It is preferred that the reaction mixture be maintained at about ambient pressure (101 kPa) or less. However in some embodiments, the pressure is maintained to be below about 190 kPa, less than about 150 kPa, less than about 125 kPa or less than about 105 kPa.
In this regard, it has been found that by utilizing a reduced temperature (e.g., less than about 115° C. and preferably less than about 100° C.) and/or a reduced pressure (e.g., less than about 190 kPa and preferably 101 kPa or less) copper nanostructures and, in particular, copper nanowires are produced with a relatively small diameter (e.g., less than about 40 nm, less than about 30 nm or even less than about 25 nm). Without being bound to any particular theory, it is believed the reduced temperature and/or pressure influences nucleation of the copper nanostructure. It is believed that the seeds that are produced at such reduced temperatures and pressures have a decahedral shape which allows nanowires having a penta-twinned structure to be produced. Such penta-twinned copper structures have a relatively small diameter compared to conventional copper nanostructures.
Generally the reaction is substantially complete after 6 hours or less. Other reaction times may be used depending on the concentration of components added, the desired structure of the nanomaterial and the desired conversion. Reaction times may be at least about 30 minutes, at least about 1 hour, at least about 3 hours, at least about 5 hours, from about 30 minutes to about 6 hours or from about 30 minutes to about 3 hours.
The nanostructure that forms as a result of the process of embodiments of the present disclosure depends on the relative reaction rates and, in particular, the amount of reducing agent and/or capping agent present in the reaction mixture. At relatively low reaction rates, decahedral seeds are nucleated and form penta-twinned nanowires with relatively uniform diameter due to anisotropic growth (
In some embodiments, the reaction conditions are controlled such that single crystal seeds are nucleated rather than decahedral seeds. This allows nanocubes (
In this regard, copper nanowires have been found to be produced without formation of bi-pyramids (
The relative molar concentrations between copper, reducing agent and capping agent that may result in formation of the various structures are shown in Table 1 below. Generally these ratios were used in Examples 1-4 described below.
In this regard, the relative amounts of the components may be adjusted to produce the desired structure as appreciated by those of skill in the art.
Copper nanowires produced in accordance with the present disclosure are characterized by a relatively small diameter and a high aspect ratio. Generally, the population of copper nanowire structures that are produced according to embodiments of the present disclosure have an average diameter of less than about 40 nm. In some embodiments the population has an average diameter of less than about 30 nm, less than about 25 nm, from about 10 nm to about 40 nm, from about 10 nm to about 30 nm from about 15 nm to about 40 nm, from about 15 nm to about 30 nm, from about 20 nm to about 40 nm or from about 20 nm to about 30 nm. The average length of the copper nanowire structures produced according to embodiments of the present disclosure may be at least about 10 nm, at least about 100 nm or even at least about 1 mm. In some embodiments, the average aspect ratio (i.e., the average ratio of length to diameter of the copper nanowire structures) is at least about 10:1. In other embodiments, the aspect ratio is at least about 50:1, at least about 100:1, at least about 1000:1, at least about 10,000:1 or even at least about 25,000:1.
The population of nanowires contains copper and amounts of organic material (e.g., the capping agent). In this regard, the amount of copper in the population of nanowires (and in each nanowire) by at least about 60 wt % copper or, as in other embodiments, at least about 70 wt % copper, at least about 80 wt % copper, from about 60 wt % to about 99 wt % copper or from about 70 wt % to about 95 wt % copper.
In this regard, the properties applied above may be an average of the population of copper nanowires that is produced or of individual nanowires. Populations of copper nanowires may include at least about 100 copper nanowires, at least about 1000 copper nanowires, at least about 10,000 copper nanowires, at least about 1×106 copper nanowires or even at least about 1×109 copper nanowires.
The copper nanowires of the present disclosure have been found to have a penta-twinned structure (i.e., five single crystallites bound together). It is believed the penta-twinned structure is bound by ten {111} facets at the two ends and five {100} side faces. It should be noted that the copper nanowires are not constructed on a template or membrane. In contrast, metallic copper atoms themselves give the nanowire its structural characteristics.
As discussed above, other structures may be produced by varying the reaction conditions. In some embodiments, a tadpole shaped nanostructure may be produced in which a bi-pyramid structure tapers from a base of about 200 nm (
The reaction conditions were varied in Examples 1-4 to produce various structures as shown in
To produce copper nanowires, CuCl2.2H2O (0.021 g), HDA (0.18 g) and glucose (0.05 g) were dissolved in water (10 ml) in a vial (22.2 ml, borosilicate glass vial, with a black phenolic molded screw cap and polyvinyl-faced pulp liner, VWR International (Radnor, Pa.)) at room temperature. After the vial had been capped, the solution was magnetically stirred at room temperature overnight. The capped vial was then transferred into an oil bath and heated at 100° C. for 6 hours under magnetic stirring. As the reaction proceeded, the solution changed its color from blue to brown and finally red-brown. All the chemicals were obtained from Sigma-Aldrich (St. Louis, Mo.) and used as received.
To prepare samples for electron microscopy characterizations, the as-prepared aqueous suspensions were directly dropped onto silicon substrates (for SEM) or carbon-coated copper grids (for TEM and high-resolution TEM) and then dried under the ambient conditions of a chemical laboratory. The silicon substrates or copper grids were then rinsed with hot water (about 60° C.) to remove the excess HDA and glucose, followed by another round of drying. The products could have alternatively been collected as powders by use of centrifugation processes.
Scanning electron microscope (SEM) images were captured of the copper nanowires dried on silicon substrates. All SEM images were captured with a field-emission microscope (Nova NanoSEM 230, FEI (Hilsboro, Oreg.)) operated at 15 kV. All transmission electron microscope (TEM) images were conducted with a microscope (Tecnai G2 Spirit, FEI (Hilsboro, Oreg.)) operated at 120 kV. High-resolution TEM imaging was performed using a microscope (2100F, JEOL (Tokyo, Japan)) operated at 200 kV. Powder x-ray diffraction (XRD) patterns were recorded using a diffractometer (DMAX/A, Rigaku (The Woodlands, Tex.)) operated at 35 kV and 35 mA. The concentrations of Cu (II)/Cu (I) left behind in the reaction solutions were determined using an inductively-coupled plasma mass spectrometer (ICP-MS, PerkinElmer (Waltham, Mass.)).
The scanning electron microscopy (SEM) image shown in
UV-vis spectra were taken with a diode array spectrophotometer (Cary 50, Varian (Palo Alto, Calif.)).
The preparation procedure of Example 1 was used to produce copper nanocrystals but the concentration of glucose (i.e., the reducing agent) was increased from 5 to 10 mg/ml. As can be seen from
After the reaction had proceeded to 1 hour (
The preparation procedure of Example 1 was used to produce copper nanocrystals but the concentration of HDA (i.e., the capping agent) was decreased from 18 mg/ml to 9 mg/ml. Copper nanocubes (
When introducing elements of the present disclosure or the preferred embodiments(s) thereof, the articles “a”, “an”, “the” and “said” are intended to mean that there are one or more of the elements. The terms “comprising”, “including” and “having” are intended to be inclusive and mean that there may be additional elements other than the listed elements.
As various changes could be made in the above apparatus and methods without departing from the scope of the disclosure, it is intended that all matter contained in the above description and shown in the accompanying figures shall be interpreted as illustrative and not in a limiting sense.
This application claims the benefit of U.S. Provisional Patent Application No. 61/530,734, filed Sep. 2, 2011, which is incorporated herein by reference in its entirety.
The claimed subject matter was developed with Government support under NSF Grant Nos. 0804088, 1104614 and ECS-0335765, awarded by the National Science Foundation. The Government has certain rights in the claimed subject matter.
Number | Date | Country | |
---|---|---|---|
61530734 | Sep 2011 | US |