Claims
- 1. A copper-tin alloy having a lubricating type, discontinuous film on at least one surface to improve wear performance, said alloy consisting essentially of about 2% to about 11% tin, about 0.03% to about 0.75% phosphorous and the balance essentially copper; and said film being formed by subjecting said alloy to a heat treatment at a temperature in the range of about 400.degree. C. to about 650.degree. C. in an atmosphere having a dew point in the range of about -75.degree. C. to about +95.degree. C. and an oxygen level less than about 300 ppm.
- 2. The copper tin alloy of claim 1 wherein:
- said film being formed by subjecting said alloy to a heat treatment at a temperature in the range of about 500.degree. C. to about 600.degree. C. in an atmosphere having a dew point in the range of about -57.degree. C. to about +21.degree. C. and an oxygen level in the range of about 0.001 ppm to about 225 ppm.
- 3. The copper-tin alloy of claim 1 wherein:
- said alloy consists essentially of about 3.5% to about 9% tin, about 0.08% to about 0.5% phosphorous and the balance essentially copper.
- 4. The alloy of claim 1 wherein said film comprises:
- a plurality of discrete tin sweat nodules on said at least one surface.
- 5. The alloy of claim 1 wherein said film comprises:
- a tin-containing amorphous film on said at least one surface.
Parent Case Info
This application is a division of application Ser. No. 595,763, filed Apr. 2, 1984, now, U.S. Pat. No. 4,511,410.
US Referenced Citations (9)
Foreign Referenced Citations (2)
Number |
Date |
Country |
1051517 |
Feb 1959 |
DEX |
148112 |
Nov 1979 |
JPX |
Non-Patent Literature Citations (2)
Entry |
Metals Abstracts, "On the Heat Diffusion Treatment of a Cu-Sn Coated with Sn Plating", Abstr. No. 56-0512, May 1982. |
Copper Development Association, Inc. Standards Handbook, "Wrought Copper and Copper Alloy Mill Products, Part 2-Alloy Data", 1973, pp. 141 and 142. |
Divisions (1)
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Number |
Date |
Country |
Parent |
595763 |
Apr 1984 |
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