Claims
- 1. A copper wire having a substantially uniform unoriented grain structure that is essentially columnar grain free, said wire being made from electrodeposited copper foil and having an ultimate tensile strength at 23.degree. C. in the range of about 60,000 psi to about 95,000 psi.
- 2. The wire of claim 1 wherein said wire has a grain structure that is essentially twin boundary free and substantially porosity free.
- 3. The wire of claim 1 wherein said wire has grain structure with an average grain size of up to about 8 microns.
- 4. The wire of claim 1 wherein said wire has an elongation at 23.degree. C. in the range of about 8% to about 18%.
- 5. The wire of claim 1 wherein said wire has an ultimate tensile at 180.degree. C. in the range of about 22,000 to about 32,000 psi and an elongation at 180.degree. C. in the range of about 24% to about 45%.
- 6. The wire of claim 1 wherein said wire has a round cross-sectional shape.
- 7. The wire of claim 1 wherein said wire has a square or rectangular cross-sectional shape.
- 8. The wire of claim 1 wherein said wire has a cross-sectional shape in the form of a cross, star, semi-circle, polygon, race track, oval, flat or ribbed-flat.
Parent Case Info
This application is a division of U.S. application Ser. No. 08/647,707, filed May 24, 1996, and a continuation-in-part of U.S. application Ser. No. 08/634,271, filed Apr. 18, 1996 (now U.S. Pat. No. 5,679,232) which was a continuation-in-part of U.S. application Ser. No. 329,235, filed Oct. 26, 1994 (now U.S. Pat. No. 5,516,408); which was a continuation-in-part of Ser. No. 49,176, filed Apr. 19, 1993 (now U.S. Pat. No. 5,366,612), and a continuation-in-part of Ser. No. 287,703, filed Aug. 9, 1994 (now U.S. Pat. No. 5,458,746) which was a continuation of Ser. No. 49,160, filed Apr. 19, 1993 (now abandoned). The disclosures in these prior applications are incorporated herein by reference in their entirety.
US Referenced Citations (29)
Foreign Referenced Citations (3)
Number |
Date |
Country |
207244 |
Jan 1987 |
EPX |
4927244 |
Jul 1974 |
JPX |
WO 9119024 |
Dec 1991 |
WOX |
Non-Patent Literature Citations (6)
Entry |
"A New Ductility and Flexural Fatigue Test Method for Copper Foil and Flexible Printed Wiring" W. Engelmaier, 21st Proceedings of the Annual IPC Meeting, Washington, D.C. (Apr. 1978). |
"Copper Foil for Flexibile Circuits", D. Avery, Circuit World, 14(2) 16 (1988) (No Month). |
"Results of the IPC Copper Foil Ducitility Round-Robin Study", W. Engelmaier, Testing of Metallic and Inorganic Coatings, 66(1987), No Month. |
Bucci et al., "Copper Foil Technology", PC Fab, Jul. 1986, pp. 22-33. |
Search Report mailed Nov. 29, 1996 for PCT International Application PCT/US96/08032. |
V. I. Lakshamanan et al; "The Effect of Chloride Ion In The Electrowinning of Copper", Journal of Electrochemistry 7(1977) No Month 81-90, pp, 81, 83, 85, 87, 89. |
Related Publications (1)
|
Number |
Date |
Country |
|
287703 |
Aug 1994 |
|
Divisions (1)
|
Number |
Date |
Country |
Parent |
647707 |
May 1996 |
|
Continuation in Parts (3)
|
Number |
Date |
Country |
Parent |
329235 |
Oct 1994 |
|
Parent |
49176 |
Apr 1993 |
|
Parent |
49160 |
Apr 1993 |
|