In the semiconductor process, the conveyer is often used to move wafers to or from the wafer carrying device or various different tables, so as to perform different processes. As in the conventional art the mechanical arm is corrected by human eyes observing whether the location thereof is correct or not, it is likely to cause misjudgment. Therefore, the present invention provides a correcting apparatus for wafer transport equipment and a correcting method for wafer transport equipment to accurately correct the mechanical arm, thereby avoiding damage to the wafer when being transported. Here, the embodiments are used to illustrate the present invention instead of limiting the present invention. Some modifications can be made to the embodiments below by those skilled in the art according to the spirit of the present invention, which still belong to the scope of the present invention.
In view of the above, a correcting apparatus 290 for wafer transport equipment comprises a reflective component 250, an image capture module 260, an image processing module 270 and a screen 280. The reflective component 250 is disposed near the wafer carrying device 230. The image capture module 260 is disposed in the optical path of the reflected light of the reflective component 250. The image processing module 270 and the screen 280 are coupled to the image capture module 260. In addition, the reflective component 250 reflects an image in the wafer carrying device 230 to the image capture module 260. The image capture module 260 captures the image in the wafer carrying device 230. When the conveyer 210 stretches into the wafer carrying device 230, the image processing module 270 analyzes the image captured by the image capture module 260 to determine whether the location of the conveyer 210 is correct or not. The screen 280 displays the image captured by the image capture module 260.
In the present embodiment, the conveyer 210 comprises a plurality of mechanical arms, such as mechanical arms 211˜215. The wafer carrying device 230 is, for example, an FOUP. The wafer carrying device 230 has a top surface (not shown), an opposite bottom surface 236 and a plurality of side surfaces 237 connected to the top surface and the bottom surface 236. One of these side surfaces 237 has an opening 232, through which the mechanical arms 211˜215 of the conveyer 210 can stretch into the wafer carrying device 230, so as to remove the wafers 221225 from or place the wafers 221225 into the accommodating slots 231˜235 of the wafer carrying device 230. In addition, the accommodating slots 231˜235 of the wafer carrying device 230 are, for example, parallel to each other, and the distance between any two adjacent accommodating slots is the same. In the present embodiment, the reflective component 250 is, for example, a reflective mirror, which is disposed near one of the side surfaces 237 with no opening 232 of the wafer carrying device 230.
In view of the above, the wafer transport equipment 200 further comprises a carrying port 240. The wafer carrying device 230 is disposed on the carrying port 240. When the mechanical arm stretches into the wafer carrying device 230, the image capture module 260 transmits the captured image to the image processing module 270. The image processing module 270 then analyzes the image captured by the image capture module 260 to determine whether the locations of the mechanical arms 211˜215 are correct or not. In the present embodiment, the image capture module 260 is, for example, a CCD or a CMOS image sensor.
The screen 280 in the correcting apparatus 290 for wafer transport equipment in the present embodiment not only can be directly coupled to the image capture module 260, but also can be coupled to the image capture module 260 via the image processing module 270, such that the image capture module 260 outputs the captured image onto the screen 280. Thus, the operator obtains the locations of the mechanical arms 211˜215 via the image displayed by the screen 280.
In general, the wafer transport equipment is corrected before transporting a wafer, so as to avoid damage to the wafer due to the incorrect location of the wafer transport equipment. The above-mentioned correcting method for wafer transport equipment is introduced in detail below. Referring to
The correcting method for wafer transport equipment in the present embodiment comprises: first, as shown in Step S410, making the conveyer 210 of the wafer transport equipment 200 stretch into the wafer carrying device 230. In particular, in the present embodiment, the mechanical arms 211˜215 of the conveyer 210 stretch below the accommodating slots 231˜235 of the wafer carrying device 230 through the opening of the wafer carrying device 230.
Next, as shown in Step S420, an image in the wafer carrying device 230 is captured by the image capture module 260 of the correcting apparatus 290 for wafer transport equipment. The image captured by the image capture module 260 is as shown in
After that, as shown in Step S430, the image captured by the image capture module 260 is analyzed by the image processing module 270 of the correcting apparatus 290 for wafer transport equipment to determine whether the location of the conveyer 210 is correct or not. The method for determining whether the location of the conveyer 210 is correct or not is, for example, to determine whether the distances between the mechanical arms 211˜215 and the accommodating slots 231235 thereon are correct or not.
More particularly, as the locations of the accommodating slots 231˜235 of the wafer carrying device 230 are fixed, and the spaces between adjacent accommodating slots 231˜235 are also fixed, the image processing module 270 can be used to calculate the corresponding pixel location of each accommodating slot 231˜235 in the image capture module 260, and the corresponding actual distance of each pixel can be calculated as D/N according to the distance D between adjacent accommodating slots and the pixel number N occupied in the image capture module 260. For example, if D=0 mm and N=0, the corresponding actual distance of each pixel is 1 mm. When the mechanical arms 211˜215 stretch below the corresponding accommodating slots 231˜235, the image processing module 270 can calculate whether the distance between each mechanical arm 211˜215 and each accommodating slot 231˜235 thereon is too far or too close according to the pixel numbers N1˜N5 between the images 311˜315 of the mechanical arms and the images 331˜335 of the accommodating slots thereon, thereby determining whether the location of each mechanical arm 211˜215 is correct or not.
After that, as shown in Step S440, the location of the conveyer 210 is adjusted according to the result of the determination. For example, when the image processing module 270 determines that the distance between the image 313 of the mechanical arm 213 and the image 333 of the accommodating slot 223 is too small, the mechanical arm 213 is adjusted downward to a proper location. On the contrary, when the image processing module 270 determines that the distance between the image 313 of the mechanical arm 213 and the image 333 of the accommodating slot 223 is too far, the mechanical arm 213 is adjusted upward to a proper location.
As the correcting method for wafer transport equipment in the present invention uses the image processing module 270 to determine whether the location of each mechanical arm 211˜215 is correct or not and adjusts the mechanical arm with an incorrect location, misjudgment due to human factors can be effectively avoided when the wafer transport equipment is corrected. In addition, the correcting method for wafer transport equipment in the present invention can determine whether the locations of a plurality of mechanical arms are correct or not at the same time and correct the mechanical arm with an incorrect location, thereby improving the correction efficiency.
It should be noted that the correcting method for wafer transport equipment in the present invention not only can correct the mechanical arm of the conveyer before transporting a wafer, but also can monitor the location of the mechanical arm while the conveyer is transporting a wafer and immediately correct the mechanical arm with an incorrect location, thereby preventing the mechanical arm from damaging the wafer.
In view of the above, the wafer transport equipment and the correcting method thereof in the present invention at least have the following advantages:
1.The present invention captures the image when the transport equipment stretches into the wafer carrying device by the image capture module, and corrects the transport equipment according to the captured image by the image processing module. Therefore, misjudgment due to human factors can be effectively avoided, thereby preventing damage to the wafer in the transport process.
2. As the present invention can determine whether the locations of a plurality of mechanical arms are correct or not at the same time, and correct the mechanical arm with an incorrect location, the time required for correcting the wafer transport equipment is shortened.
Though the present invention has been disclosed above by the preferred embodiments, they are not intended to limit the present invention. Anybody skilled in the art can make some modifications and variations without departing from the spirit and scope of the present invention. Therefore, the protecting range of the present invention falls in the appended claims.
Number | Date | Country | Kind |
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95116006 | May 2006 | TW | national |