The present disclosure relates to a magnetic element, and more particularly to a coupled magnetic element having high voltage resistance and high power density.
Indispensable for electronic devices, power supply products always pursue an objective of size reduction to achieve high power density. If the power supply products employ an inductor with a relatively large size, the inductor is likely to occupy a relatively large space. Therefore, many designers focus their research on how to miniaturize the inductive element, and also spend a great deal of effort and time to get a more optimized solution.
The conventional inductive elements are basically discrete and are mainly single-piece structures, with the exception of a very small part enabling integration of multiple inductors in one piece. Some of the existing double-inductive elements are all formed by coupled double inductors simply with multiple coils in the same magnetic circuit. Moreover, in order to achieve high voltage resistance, the existing inductive elements are necessarily designed to be large or subjected to a complicated manufacturing process. That is to say, the inductive elements having high voltage resistance currently on the market have a problem of an excessively large size or a complicated manufacturing process.
The technical problem to be solved by the present disclosure is to provide a coupled magnetic element having high voltage resistance and high power density, so as to overcome the shortcomings in the prior art. To solve the foregoing technical problem, one technical solution adopted by the present disclosure is to provide a coupled magnetic element having high voltage resistance and high power density, which includes a first magnetic core, a first coil, a second coil, and at least one second magnetic core. The first magnetic core has an accommodation space passing through a main body; the first coil is detachably disposed in the accommodation space and has a second accommodation space; the second coil is detachably disposed in the second accommodation space and has a third accommodation space; and the at least one second magnetic core is detachably disposed in the third accommodation space.
There is a plurality of gaps between the first magnetic core and the at least one second magnetic core, the first coil is located between the first magnetic core and the second coil, and the second coil is located between the first coil and the at least one second magnetic core. The assembly of the first magnetic core, the first coil, and the at least one second magnetic core forms a first inductor; the assembly of the first magnetic core, the second coil, and the at least one second magnetic core forms a second inductor; and the first inductor and the second inductor reach required inductance magnitude by virtue of an air gap formed by each gap.
One of the advantageous effects of the present disclosure lies in that the coupled magnetic element having high voltage resistance and high power density provided by the present disclosure can achieve a coupled magnetic effect with high voltage resistance and high power density by means of the foregoing technical solution.
To further understand the features and technical content of the present disclosure, reference is made to the following detailed description and drawings related to the present disclosure. However, the provided drawings are merely used for reference and description, and not intended to limit the present disclosure.
The present disclosure is more particularly described in the following examples that are intended as illustrative only since numerous modifications and variations therein will be apparent to those skilled in the art. Like numbers in the drawings indicate like components throughout the views. As used in the description herein and throughout the claims that follow, unless the context clearly dictates otherwise, the meaning of “a”, “an”, and “the” includes plural reference, and the meaning of “in” includes “in” and “on”. Titles or subtitles can be used herein for the convenience of a reader, which shall have no influence on the scope of the present disclosure.
The terms used herein generally have their ordinary meanings in the art. In the case of conflict, the present document, including any definitions given herein, will prevail. The same thing can be expressed in more than one way. Alternative language and synonyms can be used for any term(s) discussed herein, and no special significance is to be placed upon whether a term is elaborated or discussed herein. A recital of one or more synonyms does not exclude the use of other synonyms. The use of examples anywhere in this specification including examples of any terms is illustrative only, and in no way limits the scope and meaning of the present disclosure or of any exemplified term. Likewise, the present disclosure is not limited to various embodiments given herein. Numbering terms such as “first”, “second” or “third” can be used to describe various components, signals or the like, which are for distinguishing one component/signal from another one only, and are not intended to, nor should be construed to impose any substantive limitations on the components, signals or the like.
The following describes implementations of the present disclosure relating to a “coupled magnetic element having high voltage resistance and high power density” through specific embodiments. Those skilled in the art can easily understand the advantages and effects of the present disclosure from the content disclosed in the specification. The present invention can be embodied or applied through other different embodiments. Based on different opinions and applications, the details in the present specification can also be modified and changed without departing from the concept of the present disclosure.
It should be understood that, although the terms “first”, “second”, “third”, and the like are probably used herein to describe elements, these elements should not be limited by these terms. The use of these terms only aims to distinguish one element from another. In addition, the term “or” as used herein shall, according to the actual situation, include any one or a combination of more of the associated listed items.
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It should be noted that, in other preferred embodiments of the present disclosure, the first coil 2 may be in insulated connection or contact with the second coil 3. Alternatively, the coupled magnetic element Z having high voltage resistance and high power density in the present disclosure may also be formed by mutually insulated connection or contact of the first magnetic core 1, the first coil 2, the second coil 3, and the second magnetic core 4, thus realizing a magnetic element structure having ultra-high voltage resistance.
Therefore, the coupled magnetic element Z having high voltage resistance and high power density in the present disclosure is a whole device formed by assembling the first inductor composed of the first magnetic core 1, the first coil 2, and the second magnetic core 4 and the second inductor composed of the first magnetic core 1, the second coil 3, and the second magnetic core 4; and further enables the first inductor and the second inductor to have identical or different inductance magnitude by virtue of the air gaps formed by the plurality of first gaps G1. That is to say, in the coupled magnetic element Z having high voltage resistance and high power density in the present disclosure, the first magnetic core 1 and the second magnetic core 4 are spaced out and the spacing is used as the air gap, and a required inductance value is obtained based on different spacing distances. Thus, the first inductor and the second inductor may reach the required inductance magnitude via the air gaps formed by the plurality of first gaps G1.
It should be noted that, the size of each first gap G1 may be flexibly adjusted by the manufacturer or user according to actual requirements. That is to say, the air gaps between the first magnetic core 1 and the second magnetic core 4 may be controlled by changing the size of the first gaps G1, thus controlling the inductance magnitude of the first inductor and the second inductor.
To sum up, by means of the foregoing technical solution, the coupled magnetic element Z having high voltage resistance and high power density in the present disclosure can realize integration of two inductive elements, thus effectively reducing the number of elements or devices on a printed circuit board assembly (PCBA) used by the user; and further can minimize the whole size and save the space to the greatest extent, thus improving the power density of a power supply product, facilitating product miniaturization, and overcoming the shortcomings in the prior art.
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However, the examples given in the foregoing embodiments are only for describing one of feasible embodiments, and are not intended to limit the present disclosure.
One of the advantageous effects of the present disclosure lies in that the coupled magnetic element Z having high voltage resistance and high power density provided by the present disclosure can achieve a coupled magnetic effect with high voltage resistance and high power density by means of the foregoing technical solution.
Further, by means of the foregoing technical solution, the present disclosure realizes a coupled magnetic element Z having high voltage resistance and high power density. By means of a reasonable design of a magnetic circuit, the coupled magnetic element Z having high voltage resistance and high power density in the present disclosure enables two inductors to have a high coupling coefficient and have mutual impact on each other. In addition, by using a first coil 2 and a second coil 3 coated with insulating paint or an insulating film, in combination with the design of a plurality of air gaps between the first magnetic core 1 and the second magnetic core 4, the coupled magnetic element Z having high voltage resistance and high power density in the present disclosure achieves a high voltage resistance effect. Moreover, the second inductor can be accommodated inside the first magnetic core 1, thus minimizing the size and saving the space of the whole element, and further improving the power density. That is to say, by the structural design of the coupled magnetic element having high voltage resistance and high power density, the present disclosure can overcome the technical bottleneck of high voltage resistance and high power density magnetic elements in the existing market, and further effectively reduce the whole manufacturing cost while simplifying the structure and composition of the coupled magnetic element, thus being highly competitive in both technology and cost.
Further, by arrangement of the first gaps G1 and by using the air gaps formed by accommodating air in the first gaps G1 or disposing spacer units 5 therein, the first inductor composed of the first magnetic core 1, the first coil 2, and at least one second magnetic core 4 and the second inductor composed of the first magnetic core 1, the second coil 3, and the second magnetic core 4 can control the air gaps between the first magnetic core 1 and the second magnetic core 4, so as to reach the required inductance magnitude and further to realize the non-coupled double inductors. Therefore, the coupled magnetic element Z having high voltage resistance and high power density in the present disclosure can realize integration of two inductive elements, thus effectively reducing the number of elements or devices on a PCBA used by the user; and further can minimize the whole size and save the space to the greatest extent, thus improving the power density of a power supply product, facilitating product miniaturization, and overcoming the shortcomings in the prior art.
The above disclosed content merely describes preferred and feasible embodiments of the present disclosure, and is not intended to limit the scope of patent application of the present disclosure. Therefore, any equivalent technical changes made according to the description and content of the drawings of the present disclosure all fall within the scope of the patent application of the present disclosure.
The foregoing description of the exemplary embodiments of the disclosure has been presented only for the purposes of illustration and description and is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching.
The embodiments were chosen and described in order to explain the principles of the disclosure and their practical application so as to enable others skilled in the art to utilize the disclosure and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will become apparent to those skilled in the art to which the present disclosure pertains without departing from its spirit and scope.
Number | Name | Date | Kind |
---|---|---|---|
20040113741 | Li | Jun 2004 | A1 |
20050012586 | Sutardja | Jan 2005 | A1 |
20100176909 | Yasuda | Jul 2010 | A1 |
20130099886 | Yan | Apr 2013 | A1 |
20150155092 | Murtagian | Jun 2015 | A1 |
20160012955 | Kuo | Jan 2016 | A1 |
20170011836 | Ma | Jan 2017 | A1 |
20180102210 | Knoll | Apr 2018 | A1 |
20180122562 | Ji | May 2018 | A1 |
20180301276 | Yeh | Oct 2018 | A1 |
20190180910 | Kuo | Jun 2019 | A1 |
20190214181 | Wang | Jul 2019 | A1 |
20190287708 | Yeh | Sep 2019 | A1 |
20190295765 | Yan | Sep 2019 | A1 |
20200118740 | Banba | Apr 2020 | A1 |
20200388431 | Oki | Dec 2020 | A1 |
20210020352 | Okano | Jan 2021 | A1 |
20210125775 | Yan | Apr 2021 | A1 |
20210257145 | Wang | Aug 2021 | A1 |
20210304956 | Wang | Sep 2021 | A1 |
20210358676 | Wang | Nov 2021 | A1 |
20210358678 | Wang | Nov 2021 | A1 |
20220051846 | Wang | Feb 2022 | A1 |
20220199312 | Kuo | Jun 2022 | A1 |
20220285073 | Yan | Sep 2022 | A1 |
20220293336 | Mikoshiba | Sep 2022 | A1 |
20220322539 | Kuo | Oct 2022 | A1 |
20220367107 | Kuo | Nov 2022 | A1 |
20230100831 | Yan | Mar 2023 | A1 |
20230128201 | Zhao | Apr 2023 | A1 |
Number | Date | Country | |
---|---|---|---|
20220199312 A1 | Jun 2022 | US |