a and 2b: A bottom view and a side view of the first embodiment of the present invention.
a and 3b: Another angle of 3-D structure of the first embodiment of the present invention.
a, 5b and 5c: A bottom view and a side view of the second embodiment of the present invention.
a and 6b: A side view of front view of the conventional first type design of a coupling device.
a and 7b: A side view of front view of the conventional second type design of a coupling device.
a and 8b: An example of a tilting coupling device made by conventional techniques.
Products manufactured in accordance with the present invention are two types: surface mount design (SMD) and through-hole design. Both types of products comply with the standard of automatic processing procedure. To achieve the above-mentioned purpose, the present invention provides a house fastening approach or an adhesive injection fastening approach which are respectively explained as follows:
As illustrated in
As illustrated in
House (10), referring to the illustration of
In this embodiment, each coils (20, 21) is formed by bending a wire to form at least one winding and coils (20, 21) are disposed on two line troughs (11, 16). In addition, insert ends (22, 23, 24, 25) are respectively formed at the beginning and ending portions of the bending wire. The insert ends (22, 23, 24, 25) may insert into insert opens (13, 14, 17, 18) and protruding insert ends (24, 25, 22, 23) disposing on opposite sides of house (10). Each insert end (22, 23, 24, 25) may be preprocessed by varnish removal and anti-oxidation such that it can be easily soldered on a circuit board during a SMD soldering process in the following stage. In this embodiment, the number of winding is one.
Further, when coils (20, 21) and house (10) are integrated, an adhesive having a specific medium coefficient will be injected to house (10) through open (12) to fasten the coils (20, 21) to the inner portion of house (10).
When a coupling filter device having a specific coupling coefficient is integrated with a circuit board, a processing table may be used for disposing the coupling filter device onto the circuit board while insert ends (22, 23, 24, 25) protruding the opposite sides of the house (10) contact the surface of the circuit board. When soldering is performed to the circuit board having coupling devices thereon, insert ends (22, 23, 24, 25) are fastened on the circuit board with solder paste.
As stated above, the coupling filter device having a specific coupling coefficient may be manufactured by automatic equipment by grapping, sucking, positioning, and installing the coupling filter device to a circuit board such that certain manpower and labor can be saved. Besides, this provides convenience to manufacturers as well.
Products manufactured in accordance to the present invention may be customized having coils with single or multiple windings.
Although the present invention is described using the above embodiments, it does not mean that the scope of the present invention is limited to the above description. Therefore, persons skilled in the art can make all kinds of modifications, for example, changing the selected polymeric material, introducing different conductive particles, changing electroplating conditions, changing constituent weight ratio, to achieve the same effects. The protective scope of the present invention shall be limited to the description of the claims.
Number | Date | Country | Kind |
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095214948 | Aug 2006 | TW | national |