The present invention relates to a coupling structure for crossing transmission lines in a signal conductor layer of a circuit substrate, in particular, to a coupling structure for crossing transmission lines for millimeter-wave or centimeter-wave signals.
To cross transmission lines for high frequency signals it is known to provide a circuit substrate having multiple metallization layers, on which transmission lines, developed in different metallization layers, can cross each other. For this purpose, a transmission line in a metallization layer can bridge a crossing area by a detour via a different metallization layer. A disadvantage in this instance is the additional effort for providing a second or more metallization layers.
It is also known to realize a crossing of two transmission lines of the same metallization layer via a bridge made up of a discrete component. Depending on the requirements, however, disadvantageous output losses can result.
In “Microstrip EHF Butler Matrix Design and Realization”, ETRI Journal, Volume 27, No. 6, December 2005, J.-S. Néron and G.-Y. Delisle describe a coupling structure for crossing two transmission lines for a 36 GHz signal. The coupling structure is made up of a planar cross-coupler, also known as a 0-dB coupler, that enables crossing two transmission lines having minimal coupling between them. The planar cross-coupler is embodied as a cascade of two 90 degree hybrid couplers. From an input signal at one of two input points, such a 90 degree hybrid coupler, known per se, generates two signals phase-shifted by 90 degrees, at its output points.
An object of the present invention is to create a coupling structure for crossing three transmission lines, in particular for signals in the frequency band of 76 to 77 GHz, in one signal conductor layer of a circuit substrate.
According to the present invention, a contribution toward achieving this object is made by a coupling structure for crossing three transmission lines for millimeter-wave or centimeter-wave signals in a signal conductor layer of a circuit substrate, which coupling structure has three planar cross-couplers, from each of which two successive input/output points of the cross-coupler are connected clockwise, in the plane of the cross-coupler, to respectively one input/output point of a respective other of the three cross-couplers. Preferably, the signal conductor layer is a metallization layer of the circuit substrate.
This coupling structure in particular allows for the mentioned clockwise-successive input/output points of each cross-coupler are connected to respectively one input/output point of a respective other of the three cross-couplers in the same signal conductor layer. A coupling structure for crossing three transmission lines may thus be realized within a single signal conductor layer, in which the coupling structure has no components situated outside of the signal conductor layer, in particular, no discrete components.
This kind of coupling structure may, for example, be used advantageously in analog and/or digital circuits for radar sensors where signals of a respective frequency range are to cross within one metallization layer.
Opposite the respective cross-couplers 30, 40, 50, adjacent second input/output points 33, 34 of the first cross-coupler are each directly connected in the same signal conductor layer, at circuit points B, A, with a second input/output point 44 or 53 of a respective other cross-coupler 40, 50 of the three cross-couplers; and an additional second input/output point 43 of the second cross-coupler is directly connected in the same signal conductor layer, at a circuit point C, with an additional second input/output point 54 of the third cross-coupler 50.
Thus, respectively two adjacent first input/output points 31,32; 41,42; and 51,52 of a respective cross-coupler 30, 40, 50 form input/output points 21 through 26 of the coupling structure; and on an opposite side of the respective cross-coupler 30, 40, 50, adjacent second input/output points 33,34; 43,44; and 53,54 of the cross-coupler are respectively connected, directly in the same signal conductor layer, to a second input/output point 44,53; 54,33; and 34,43 of a respective other of the three cross-couplers 30, 40, 50.
The resulting coupling structure 10 couples signals S1, S2, S3, supplied in this order on the first side via input/output points 21, 22, 23, with input/output points 26, 25, 24 in reversed order on the opposite side of coupling structure 10. A suitable layout of the individual parts or conductor sections of coupling structure 10 and of the individual parts or conductor sections of cross-couplers 30, 40, 50 may optimize the geometry of coupling structure 10 and of individual cross-couplers 30, 40, 50 in such a way that the components of the respectively desired signal S3, S2, or S1 are constructively superimposed on one another at input/output points 26, 25, 24, used as outputs, and that the components of the respective other signals are destructively superimposed. Especially the electrical lengths and transmission line wave impedances are suitably adjusted. This may be achieved by adapting the conductor lengths and widths for a given substrate. In this manner, a minimal mutual interference of the signals may be achieved when crossing the three signal transmission lines 11, 12, 13.
Via second cross-coupler 40, circuit point D is coupled with a diagonally opposite, second input/output point 43 of second cross-coupler 40 for signal S1, corresponding to input/output point 24 of coupling structure 10′. Accordingly, via second cross-coupler 40, signal S3, applied at the other first input/output point 42 of second cross-coupler 40, is directly connected in the same signal conductor layer, at diagonally opposite circuit point E, to a second input/output point 54 of the third cross-coupler 50.
The other second input/output point 53 of third cross-coupler 50 is connected, at a circuit point F, directly in the same signal conductor layer, by signal line 58 in the form of a conductor section, to the other second input/output point 34 of first cross-coupler 30. This connection thus runs parallel to the second cross-coupler 40. Via third cross-coupler 50, the two circuit points E, F are in turn coupled with respectively diagonally opposite first input/output points 52, 51 of third cross-coupler 50, which correspond to input/output points 26, 25 of coupling structure 10′, so that coupling structure 10′ altogether reverses the order in which signals S1, S2, S3 are arranged.
With reference to cross-coupler 30,
Cross-coupler 30 is designed as a cascade of two 90 degree hybrid couplers 60, 62; at a first end of the cascading structure, first input/output points 31, 32 of the cross-couplers being situated directly next to each other, and at a second end of the cascading structure, second input/output points 34, 33 being situated directly next to each other. In the plane of cross-coupler 30, the input/output points follow in sequence clockwise in the order of 31, 34, 33, 32, 31, . . . etc. Cross-coupler 30 includes two longitudinal connections 64, 66, which connect input/output points 31 and 34 and, respectively, 32 and 33 directly and in a straight line, and are connected to each other by three cross-connections 68 so as to form a structure in the shape of a ladder having three crossbars. The length of cross-connections 68 amounts to nearly one quarter of a signal wavelength in the signal transmission line. The length of the respective sections of the longitudinal connections 64, 66 between two cross-connections 68 also corresponds to nearly one quarter of a signal wavelength.
In the examples shown in
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Tadashi Kawai et al., A Branch-Line-Type Eight Port Comparator Circuit, 1991, IEEE MTT-S, 4 pages. |
“Microstrip EHF Butler Matrix Design and Realization”, ETRI Journal, vol. 27, No. 6, Dec. 2005, J.-S. Néron and G.-Y. Delisle. |
Bing, Zhao, et al. “The design of the X-band microstrip butler matrix”, School of electronic engineering, China, CN Academic Journal Electronic Publishin House (2009), pp. 983-986. [English abstract only]. |
Number | Date | Country | |
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20150035616 A1 | Feb 2015 | US |