This application contains subject matter related to the following co-pending U.S. design patent applications:
Application Ser. No. 29/610,995, filed herewith and entitled “Electrode Cover for a Plasma Processing Apparatus”;
Application Ser. No. 29/610,996, filed herewith and entitled “Electrode Cover for a Plasma Processing Apparatus”;
Application Ser. No. 29/610,998, filed herewith and entitled “Ring for a Plasma Processing Apparatus”; and
Application Ser. No. 29/611,001, filed herewith and entitled “Discharge Chamber for a Plasma Processing Apparatus”.
FIG. 1 is a front, top and right side perspective view of a cover ring for a plasma processing apparatus showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right side elevational view thereof;
FIG. 5 is a left side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 2;
FIG. 9 is a cross-sectional view taken along line 9-9 of FIG. 4;
FIG. 10 is an enlarged view of the portion shown in BOX 10 in FIG. 8; and,
FIG. 11 is a front, top, and left side perspective view of FIG. 8.
The box labelled as 10 in FIG. 8 is shown in broken lines and forms no part of the claimed design.