FIG. 1 is a top plan view of a CPU heat sink packaging box showing our new design, in disassembled condition;
FIG. 2 is a top plan view thereof, in assembled condition;
FIG. 3 is a side elevational view thereof;
FIG. 4 is a side elevational view thereof from the side opposite that shown in FIG. 3;
FIG. 5 is an end elevational view thereof; and,
FIG. 6 is an end elevational view thereof from the end opposite that shown in FIG. 5.
The black shading in the drawing is intended to represent the color black in the claimed design.