Embodiments of the subject matter described herein relate generally to solar cell modules. More particularly, embodiments of the subject matter relate to solar cell module structures and manufacturing processes.
Solar cells are well known devices for converting solar radiation to electrical energy. A solar cell has a front side that faces the sun during normal operation to collect solar radiation and a backside opposite the front side. Solar radiation impinging on the solar cell creates electrical charges that may be harnessed to power an external electrical circuit, such as a load.
Solar cells may be serially connected and packaged together to form a solar cell module. The packaging provides environmental protection for the solar cells. Prior to operation in the field, such as in a residential home, commercial structure, or photovoltaic power plant, solar cell modules may be subjected to rough handling during shipping, installation, and maintenance. Embodiments of the present invention pertain to solar cell modules with features that prevent cracks from developing on solar cells.
In one embodiment, a crack resistant solar cell module includes a protective package mounted on a frame. The protective package includes a polyolefin encapsulant that protectively encapsulates solar cells. The polyolefin has less than five weight percent of oxygen and nitrogen in the backbone or side chain. In other words, the combined weight percent of oxygen and nitrogen in any location in the molecular structure of the polyolefin is less than five. The polyolefin also has a complex viscosity less than 10,000 Pa second at 90° C. as measured by dynamic mechanical analysis (DMA) before any thermal processing (e.g., lamination) of the polyolefin. The protective package includes a top cover, the encapsulant, and a backsheet. The solar cell module allows for shipping, installation, and maintenance with less risk of developing cracks on the surfaces of the solar cells.
These and other features of the present invention will be readily apparent to persons of ordinary skill in the art upon reading the entirety of this disclosure, which includes the accompanying drawings and claims.
A more complete understanding of the subject matter may be derived by referring to the detailed description and claims when considered in conjunction with the following figures, wherein like reference numbers refer to similar elements throughout the figures. The figures are not drawn to scale.
In the present disclosure, numerous specific details are provided, such as examples of components, materials, and methods, to provide a thorough understanding of embodiments of the invention. Persons of ordinary skill in the art will recognize, however, that the invention can be practiced without one or more of the specific details. In other instances, well-known details are not shown or described to avoid obscuring aspects of the invention.
In general, solar cell modules are shipped from their source, such as a warehouse or factory, to the job site where the solar cell modules will be installed and operated. The solar cell modules may be subjected to rough handling as they are loaded and unloaded during shipment. At the job site, the solar cell modules may be subjected to further rough handling before or during installation and during maintenance. For example, prior to installation, the solar cell modules may be left on the floor where they may be stepped on by installers and other workers. Some installers may also ignore proper handling instructions.
In the example of
Referring now to
Visible in
The transparent top cover 251 and the encapsulant 252 comprise optically transparent materials. The transparent top cover 251, which is the topmost layer on the front portion 103, protects the solar cells 101 from the environment. The solar cell module 100 is installed in the field such that the transparent top cover 251 faces the sun during normal operation. The front sides of the solar cells 101 face towards the sun by way of the transparent top cover 101. In the example of
The encapsulant 252 protectively encapsulates the solar cells 101. The inventors discovered that there is a correlation between fern cracks and the type of encapsulant employed. At the material level, the inventors also discovered that the viscosity of the encapsulant is critical to control the degree or severity of the fern crack. These discoveries are unexpected in that the characteristics of the encapsulant, instead of the solar cells themselves, need to be addressed to mitigate fern cracks on the solar cells. In embodiments of the present invention, the characteristics of the encapsulant 252 are optimized to reduce occurrence of fern cracks on the solar cells 101.
In one embodiment, the encapsulant 252 comprises polyolefin. Examples of suitable polyolefin include polyethylene, high density polyethylene, low density polyethylene, linear low density polyethylene, and polypropylene. In one embodiment, to guard against fern cracks, the encapsulant 252 comprises polyolefin that has less than 5 weight percent of oxygen and nitrogen in the backbone or side chain. In other words, the combined weight percent of oxygen and nitrogen in any location in the molecular structure of the polyolefin is less than five. In one embodiment, the polyolefin further has a complex viscosity less than 10,000 Pa-s (Pascal second) at 90° C. as measured by dynamic mechanical analysis (DMA) before lamination or any other thermal processing. The volume resistivity of the polyolefin of the encapsulant 252 is preferably at least 1015 Ohm-cm as measured by ASTM D257 test at 1 kV, 10 min electrification, and 60° C. As is well known, ASTM D257 is a standard by ASTM International, which is formerly known as the American Society for Testing and Materials.
The interconnects 254 may comprise a metal for electrically interconnecting the solar cells 101. In the example of
The backsides of the solar cells 101 face the backsheet 253. The backsheet 253 may be any single layer or multiple layers of materials that provide environmental protection to other components of the solar cell module 100. For example, flouropolymer, polyvinylidene fluoride, polytetrafluoroethylene, polypropylene, polyphenylene sulfide, polyester, polycarbonate, or polyphenylene oxide may be used as a single layer or as part of multiple layers of backsheet. The backsheet 253 is on the back portion 104.
In one embodiment, the transparent top cover 251, the encapsulant 252-1 on the front side, the solar cells 101 electrically connected by the interconnects 254, the encapsulant 252-2 on the backside, and the backsheet 253 are formed together to create a protective package. This is illustrated in
Tables 1, 2, and 3 discussed below show the effectiveness of the above disclosed encapsulants in preventing fern cracks.
Table 1 shows the complex viscosity of various polyolefin encapsulants (Sample 1, Sample 2, Sample 3, and Sample 4) at various temperatures measured at 1/s shear rate by dynamic mechanical analysis. Table 1 shows complex viscosity in Pascal second (Pa-s). The viscosities were measured before any thermal processing of the encapsulants, which in this example is before lamination.
As shown in Table 1, the polyolefin encapsulants referred to as “Sample 3” and “Sample 4” have a complex viscosity less than 10,000 Pa-s at 90° C. Samples 3 and 4 have the characteristics of encapsulants in accordance with embodiments of the present invention. The polyolefin encapsulants referred to as “Sample 1” and “Sample 2” have complex viscosities greater than 10,000 Pa-s at 90° C., and therefore do not have the characteristics for preventing fern cracks.
Table 2 shows the relative probability of developing fern cracks on the solar cells when using the above-noted samples of polyolefin encapsulants. More particularly, as noted in Table 2, studies performed by the inventors indicate that solar cells encapsulated by Sample 1 are four times more likely to develop cracks compared to solar cells encapsulated by Sample 3. Similarly, solar cells encapsulated by Sample 2 are three times more likely to develop cracks compared to solar cells encapsulated by Sample 3.
Table 3 shows relative power degradation of solar cells encapsulated by Sample 2, Sample 3, and Sample 4 in a stress test where a person stepped on the solar cell modules. The stress test simulates foot traffic during installation or cleaning process in the field. A person weighing 85 kg stepped on all of the solar cells of the module in the first test. In a second test, a person weighing 120 kg stepped on all of the solar cells of the module.
As shown in Table 3, solar cells encapsulated by Sample 2 exhibited much higher power degradation compared to solar cells encapsulated by either Sample 3 or Sample 4. The difference in relative power degradation of the solar cells increased when a heavier person walked on the solar cell modules.
Solar cells to be included in the solar cell module are protectively packaged in the encapsulant (step 302). In one embodiment, the solar cells are placed between sheets (e.g., a bottom sheet and a top sheet) of the encapsulant, a backsheet is placed under a bottom sheet of the encapsulant, and a transparent top cover is placed over a top sheet of the encapsulant. The transparent top cover, the solar cells sandwiched by the sheets of the encapsulant, and the backsheet are then pressed and heated together by vacuum lamination, for example. The resulting protective package is then mounted on a frame (step 303). The manufactured solar cell module is resistant to fern cracks, reducing the chance of damaging the solar cells contained therein during shipping, installation, and maintenance.
Crack resistant solar cell modules and method of manufacturing same have been disclosed. While specific embodiments of the present invention have been provided, it is to be understood that these embodiments are for illustration purposes and not limiting. Many additional embodiments will be apparent to persons of ordinary skill in the art reading this disclosure.
Number | Name | Date | Kind |
---|---|---|---|
3961997 | Chu | Jun 1976 | A |
4070097 | Gelber et al. | Jan 1978 | A |
4084099 | Harvey et al. | Apr 1978 | A |
4278831 | Riemer et al. | Jul 1981 | A |
4427839 | Hall | Jan 1984 | A |
4478879 | Baraona et al. | Oct 1984 | A |
4496788 | Hamakawa et al. | Jan 1985 | A |
4509248 | Spitzer et al. | Apr 1985 | A |
4665277 | Sah et al. | May 1987 | A |
4927770 | Swanson | May 1990 | A |
4939217 | Stricklen | Jul 1990 | A |
5030295 | Swanson et al. | Jul 1991 | A |
5043375 | Henning et al. | Aug 1991 | A |
5053083 | Sinton | Oct 1991 | A |
5057439 | Swanson et al. | Oct 1991 | A |
5066340 | Iwamoto et al. | Nov 1991 | A |
5164019 | Sinton | Nov 1992 | A |
5213628 | Noguchi et al. | May 1993 | A |
5217539 | Fraas et al. | Jun 1993 | A |
5266125 | Rand et al. | Nov 1993 | A |
5360990 | Swanson | Nov 1994 | A |
5369291 | Swanson | Nov 1994 | A |
5391235 | Inoue | Feb 1995 | A |
5447576 | Willis | Sep 1995 | A |
5468652 | Gee | Nov 1995 | A |
5512757 | Cederstrand et al. | Apr 1996 | A |
5641362 | Meier | Jun 1997 | A |
5660646 | Kataoka et al. | Aug 1997 | A |
5726391 | Iyer et al. | Mar 1998 | A |
5728230 | Komori et al. | Mar 1998 | A |
5918140 | Wickboldt et al. | Jun 1999 | A |
6013582 | Ionov et al. | Jan 2000 | A |
6096968 | Schlosser et al. | Aug 2000 | A |
6118258 | Farine et al. | Sep 2000 | A |
6130379 | Shiotsuka et al. | Oct 2000 | A |
6143976 | Endros | Nov 2000 | A |
6147297 | Wettling et al. | Nov 2000 | A |
6210991 | Wenham et al. | Apr 2001 | B1 |
6262359 | Meier et al. | Jul 2001 | B1 |
6274402 | Verlinden et al. | Aug 2001 | B1 |
6274404 | Hirasawa et al. | Aug 2001 | B1 |
6278054 | Ho et al. | Aug 2001 | B1 |
6311436 | Mimura et al. | Nov 2001 | B1 |
6313395 | Crane et al. | Nov 2001 | B1 |
6319596 | Kernander et al. | Nov 2001 | B1 |
6333457 | Mulligan et al. | Dec 2001 | B1 |
6337283 | Verlinden et al. | Jan 2002 | B1 |
6387726 | Verlinden et al. | May 2002 | B1 |
6423568 | Verlinden et al. | Jul 2002 | B1 |
6429037 | Wenham et al. | Aug 2002 | B1 |
6465724 | Garvison et al. | Oct 2002 | B1 |
6521825 | Miura et al. | Feb 2003 | B2 |
6524880 | Moon et al. | Feb 2003 | B2 |
6552414 | Horzel et al. | Apr 2003 | B1 |
6692985 | Huang et al. | Feb 2004 | B2 |
6777610 | Yamada et al. | Aug 2004 | B2 |
6872321 | Thavarajah et al. | Mar 2005 | B2 |
6998288 | Smith et al. | Feb 2006 | B1 |
7135350 | Smith et al. | Nov 2006 | B1 |
7217883 | Munzer | May 2007 | B2 |
7238594 | Fonash et al. | Jul 2007 | B2 |
7280235 | Lapstun et al. | Oct 2007 | B2 |
7281786 | Silverbrook | Oct 2007 | B2 |
7292368 | Rozzi | Nov 2007 | B2 |
7306307 | Lapstun et al. | Dec 2007 | B2 |
7306325 | Silverbrook et al. | Dec 2007 | B2 |
7309020 | Anderson et al. | Dec 2007 | B2 |
7322669 | Berry et al. | Jan 2008 | B2 |
7322673 | Silverbrook et al. | Jan 2008 | B2 |
7328966 | Silverbrook | Feb 2008 | B2 |
7335555 | Gee et al. | Feb 2008 | B2 |
7341328 | Berry et al. | Mar 2008 | B2 |
7357476 | Berry et al. | Apr 2008 | B2 |
7390961 | Aschenbrenner et al. | Jun 2008 | B2 |
7468485 | Swanson | Dec 2008 | B1 |
7517709 | Borden | Apr 2009 | B1 |
7554031 | Swanson et al. | Jun 2009 | B2 |
7633006 | Swanson | Dec 2009 | B1 |
7786375 | Swanson et al. | Aug 2010 | B2 |
8188363 | Xavier et al. | May 2012 | B2 |
20020020440 | Yoshimine et al. | Feb 2002 | A1 |
20030070707 | King et al. | Apr 2003 | A1 |
20030076649 | Speakman | Apr 2003 | A1 |
20030134469 | Horzel et al. | Jul 2003 | A1 |
20030178056 | Hikosaka et al. | Sep 2003 | A1 |
20040200520 | Mulligan et al. | Oct 2004 | A1 |
20040261840 | Schmit et al. | Dec 2004 | A1 |
20050178428 | Laaly et al. | Aug 2005 | A1 |
20050268963 | Jordan et al. | Dec 2005 | A1 |
20060130891 | Carlson | Jun 2006 | A1 |
20060157103 | Sheats et al. | Jul 2006 | A1 |
20060196535 | Swanson et al. | Sep 2006 | A1 |
20060201545 | Ovshinsky et al. | Sep 2006 | A1 |
20070082206 | Hartig | Apr 2007 | A1 |
20070151598 | De Ceuster et al. | Jul 2007 | A1 |
20070269750 | Irving et al. | Nov 2007 | A1 |
20080199690 | Hayes et al. | Aug 2008 | A1 |
20090205712 | Cousins | Aug 2009 | A1 |
20100047589 | Ochs et al. | Feb 2010 | A1 |
20100075234 | Cousins | Mar 2010 | A1 |
20100108128 | Chu et al. | May 2010 | A1 |
20100108143 | Hayes | May 2010 | A1 |
20100139740 | Xavier et al. | Jun 2010 | A1 |
20100139764 | Smith | Jun 2010 | A1 |
20100175743 | Gonzalez et al. | Jul 2010 | A1 |
20110183442 | Oi et al. | Jul 2011 | A1 |
20120184676 | Gahleitner et al. | Jul 2012 | A1 |
20120266943 | Li | Oct 2012 | A1 |
Number | Date | Country |
---|---|---|
102006048216 | Apr 2008 | DE |
Entry |
---|
P.J. Verlinden, et al. “One-Year Comparison of a Concentrator Module with Silicon Point-Contact Solar Cell to a Fixed Flat Plate Module in Northern California”, 2000, 4 sheet, Proceedings of the 16th EPSEC. |
Richard M. Swanson, “The Promise of Concentrators”, 2000, Prog. Photovolt. Res. Appl. 8, pp. 93-111 (2000), Sunpower Corporation, Sunnyvale, CA. |
Ronald A. Sinton, et al. “Simplified Backside-Contact Solar Cells”, Feb. 1990, pp. 348-352, IEEE Transactions on Electron Devices, vol. 37. No. 2. |
Ronald A. Sinton, “Device Physics and Characterization of Silicon Point-Contact Solar Cells”, Feb. 1997, pp. 1-154, Stanford Electronics Laboratories, Stanford University, CA. |
Richard Roland King, “Studies of Oxide-Passivated Emitters in Silicon and Applications to Solar Cells”, Aug. 1990, pp. 1-200, (Thesis) Electrical Engineering Department of Stanford University, CA. |
Eric Fogarassy, et al. “Long-Pulse Excimer Laser Crystallization and Doping for the Fabrication of High Performance Polysilicon TFTs”, Jan. 2006, pp. S40-S46, Journal of the Korean Physical Society, vol. 48. |
Ted Kamins, “Polycrystalline Silicon for Integrated Circuit Applications” third printing 1994, pp. 198-199, Kluwer Academic Publishers, Norwell, Massachusetts. |
J.Y. Lee, et al. “Boron-Back Surface Field With Spin-On Dopants by Rapid Thermal Processing”, Jun. 2004, pp. 998-1001, 19th European Photovoltaic Solar Energy Conference, Paris, France. |
B. Lee et al. “Thermally conductive and electrically insulating EVA composite encapsulants for solar photovoltaic (PV) cell”, 2008, pp. 357-363, exPRESS Polymer Letters vol. 2, No. 5. |
John Pern “Module Encapsulation Materials, Processing and Testing”, 2008, 33 pages, NREL National Renewable Energy Laboratory. |
Dynamic mechanical analysis—Wikipedia, the free encyclopedia, 7 sheets [retrieved on Oct. 23, 2012], retrieved from the internet: http://en.wikipedia.org/wiki/Dynamic—mechanical—analysis. |
Dynamic Mechanical Analysis Basics: Part 1 How DMA Works, 2007, pp. 1-4, Technical Note Thermal Analysis, Perkin Elmer Inc., Waltham, MA. |
SunPower Discovers the “Surface Polarization” Effect in High Efficiency Solar Cells, Aug. 2005, pp. 1-4, Source: SunTechnics SunReader. |
R. Swanson, et al., “The Surface Polarization Effect in High-Effiency Silicon Solar Cells”, submitted for publication to the 15th International Photovoltaic Science and Engineering Conference & Solar Energy Exhibition, Oct. 10-15, 2005 (4 sheets), Shanghai, China. |
Jianhua Zhao, et al., “Performance Instability in N-Type Pert Silicon Solar Cells”, The 3rd World Conference on Photovoltaic Energy Conversion, May 12-16, 2003 (4 sheets), Osaka, Japan. |
S.M. Sze “Physics of Semiconductor Devices”, 1981 Second Edition, pp. 362-369, Copyright by John Wiley & Sons, Inc., U.S. |
W.P. Mulligan, et al. “A Flat-Plate Concentrator: Micro-Concentrator Design Overview”, 2000, 3 sheets, Proceedings of the 28th IEEE PVSC. |
K. R. McIntosh, et al. “The Choice of Silicon Wafer for the Production of Low-Cost Rear-Contact Solar Cells”, May 2003, 4 sheets, Sunpower Corporation, Sunnyvale, CA. |
P.J. Verlinden, et al. “Will We have a 20%-Efficient(PTC) Photovoltaic System?”, 2001, 6 sheets, Proceedings of the 17th Europe Photovoltaic Solar Energy Conference. |
William P. Mulligan, et al. “Development of Chip-Size Silicon Solar Cells”, 2000, 6 sheets, Proceedings of the 28th IEEE PVSC. |
Akira Terao, et al. “A Mirror-Less Design for Micro-Concentrator Modules”, 2000, 4 sheets, Proceedings of the 28th IEEE PVSC. |
P.J. Verlinden, et al. “Backside-Contact Silicon Solar Cells with Improved Efficiency for the '96 World Solar Challenge”, 1997, 5 sheets, Proceedings of the 15th EPSEC. |
PCT International Search Report and Written Opinion of the International Searching Authority for Application No. PCT/US2013/071402, 7 sheets, Apr. 14, 2014. |
Number | Date | Country | |
---|---|---|---|
20140144487 A1 | May 2014 | US |