Claims
- 1. A high temperature superconducting cuprate material (HTSC) having a doping state or hole concentration higher than the doping state or hole concentration of the material for maximum superconducting transition temperature (Tc) and at about a value where the normal-state pseudogap for the material reduces to a minimum and which maximises the critical current density (Jc) of the material.
- 2. An HTSC according to claim 1 in which, the hole concentration p of the material is in the range 0.18≦p≦0.20.
- 3. An HTSC according to claim 2 wherein the hole concentration p is about 0.19.
- 4. An HTSC according to claim 2 wherein the hole concentration p=0.91±0.005.
- 5. An HTSC according to claim 2 having a Tc in the range 0.91Tc,max≦Tc≦0.96Tc,max where Tc,max is the maximum value taken by Tc in its variation with hole concentration.
- 6. An HTSC according to claim 5 wherein Tc is in the range 0.92Tc,max≦T≦0.95Tc,max.
- 7. An HTSC according to claim 5 wherein Tc,max=(0.93±0.005)Tc,max.
- 8. An HTSC according to claim 2 wherein the room-temperature thermoelectric power Q(TRT) for the HTSC is in the range of 4<Q(TRT)<−1 where the units of Q(TRT) are μV/K, where room temperature, TRT, lies in the range 280K<TRT<300K.
- 9. An HTSC according to claim 8 wherein the thermoelectric power Q(TRT) for the HTSC is in the range −3<Q(TRT)<−2.
- 10. An HTSC according to claim 2 wherein the temperature derivative of the normal-state resistivity of the HTSC remains constant within ±5% when the temperature is reduced from 250K down to less than 20K above Tc.
- 11. An HTSC according to claim 2 wherein the temperature derivative of the normal-state constant-volume resistivity of the HTSC remains constant within ±5% when the temperature is reduced from 500K down to less than 20K above Tc.
- 12. An HTSC according to claim 2 which is overdoped so that the doping state or hole concentration of the material in the grain boundary regions between individual grains in the HTSC is at about said value which maximises critical current density of the material.
- 13. Wires, tapes, thin films, coated conductors, bulk materials or any other conductor comprising or containing the materials of claims 1 to 12.
- 14. A method for preparing a high temperature superconducting cuprate material (HTSC) to maximise the critical current density (Jc) thereof, comprising the step of controlling the doping state or hole concentration of the material to be higher than the doping state or hole concentration of the material that provides a maximum superconducting transition temperature (Tc) and to be at a value where normal-state pseudogap reduces to a minimum, to increase the critical current density of the material.
- 15. A method according to claim 14 comprising the step of controlling the hole concentration p to be in the range 0.18≦p≦0.20.
- 16. A method according to claim 15 comprising the step of controlling the hole concentration p to be about 0.19.
- 17. A method according to claim 15 comprising the step of controlling the hole concentration p to p=0.19 ±0.005.
- 18. A method according to claim 15 comprising the step of controlling the hole concentration so that Tc for the HTSC is in the range of 0.91 Tc,max≦Tc≦0.96Tc,max where Tc,max is the maximum value taken by Tc in its variation with hole concentration.
- 19. A method according to claim 18 comprising the step of controlling the hole concentration so that T, is in the range 0.92Tc,max≦Tc≦0.95 Tc,max.
- 20. A method according to claim 18 comprising the step of controlling the hole concentration so that Tc=(0.93±0.005)Tc,max.
- 21. A method according to claim 15 comprising the step of controlling the hole concentration p so that the room-temperature thermoelectric power Q(TRT) for the HTSC is in the range −4<Q(TRT)<−1 where the units of Q(TRT) are μV/K, where room temperature, TRT, is in the range 280K<TRT<300K.
- 22. A method according to claim 21 comprising the step of controlling the hole concentration p so that the thermoelectric power Q(TRT) for the HTSC is in the range 3<Q(TRT)<−2.
- 23. A method according to claim 15 comprising the step of controlling the hole concentration so that the temperature derivative of the normal-state resistivity of the HTSC remains constant within ±5% when the temperature is reduced from 250K down to less than 20K above Tc.
- 24. A method according to claim 15 comprising the step of controlling the hole concentration so that the temperature derivative of the normal-state constant-volume resistivity remains constant within ±5% when the temperature is reduced from 500K down to less than 20K above Tc.
- 25. A method according to claim 15 comprising the step of overdoping the HTSC so that the grain boundary regions between individual grains in the HTSC are doped to maximise critical current density.
- 26. A high temperature superconducting cuprate material prepared by the method of claim 14.
Priority Claims (2)
Number |
Date |
Country |
Kind |
330728 |
Jun 1998 |
NZ |
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333971 |
Jan 1999 |
NZ |
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Parent Case Info
This application is a continuation of U.S. application Ser. No. 09/719,439, filed Mar. 27, 2001 abandoned as International Application No. PCT/NZ99/00095 filed Jun. 18, 1999.
US Referenced Citations (1)
Number |
Name |
Date |
Kind |
5776862 |
Usami et al. |
Jul 1998 |
A |
Non-Patent Literature Citations (3)
Entry |
Ihara et al “Cu1-xTlxBa2Ca3Cu4O12-y Superconductor with Tc of 126 K”, Physica C, M2S-HTSC 1997.* |
Shimoyama et al “Strong Flux Pinningup to liquid nitrogen temperature . . . ”, Physica C, 281(1), 69-75, 1997.* |
Shimoyama et al “Dramatically improved Flux Pinning Propertiesof heavily Pb-doped Bi2212 single crystals . . . ”, Adv. Supercond. X, Proc. Int. Symp. Supecond., 10th (1998), vol. 1, 279-284. Meeting date Oct. 1997. |
Continuations (1)
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Number |
Date |
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Parent |
09/719439 |
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US |
Child |
10/327408 |
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US |