Patent Application
20070296518
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the general and detailed descriptions of the invention appearing herein, serve to explain the principles of the invention.
A transceiver with a cross-polar, co-polar receiver according to the invention is integrated into a single enclosure 10. An OMT and diplexer module 12 may be mounted within the transceiver enclosure 10 without requiring specialized alignment procedures in multiple planes.
As shown in
The OMT and diplexer module 12, as best shown in
As shown in
The OMT and diplexer module 12 cross-polar reception port 40 and co-polar reception port 42 may be arranged to exit the OMT and diplexer module 12 on a common side, while the co-polar transmission port 44 exits on an opposite side to couple with the receiver printed circuit board 46 and transmitter printed circuit board(s) 48, respectively. The receiver printed circuit board 46 and the transmitter printed circuit board(s) 48 may be enclosed within the receiver cavity 22 and the transmitter cavity 20 by the receiver cavity cover 24 and the transmitter cavity cover 26 or other form of radio frequency and environmental screen. Positioning of the receiver printed circuit board 46 and the transmitter printed circuit board(s) 48 within separate reception and transmission cavities 22, 20 of the enclosure 10 isolates the electrical circuitry for transmission and reception from each other. This helps to reduce cross coupling between different circuits on the receiver and transmitter printed circuit boards 46, 48.
The planar two piece design of the OMT and diplexer module 12 enables use of cost efficient manufacturing methods such as die casting or injection molding. The X-TRF 32, C-TRF 34 and C-RRF 36 are seamlessly incorporated into the OMT and diplexer module 12, eliminating additional interconnections and potential signal degradation. The filters enable reception of signals in both orthogonal polarities while transmitting in one polarity. The OMT and diplexer module 12 may be fully tested prior to mounting in the enclosure 10; improving yield at transceiver final assembly and simplifying quality control procedures. Similarly, the enclosure 10 may be cost effectively manufactured with a high level of precision via die casting or injection molding. Cavities, ports, fastener points, alignment posts and any heat sinks may be configured for die/mold separation without interfering overhanging edges. Where injection molding is performed, a plastic material with enhanced thermal conductivity properties may be used and or the surfaces of the resulting components may be coated with a conductive material to prevent radio frequency interference or leakage. Further, to enhance heat dissipation characteristics, metal inserts may be placed within the molds before injection of the plastic material to form integral heat sinks within the molded OMT and diplexer module 12 portion(s).
One skilled in the art will appreciate that the present invention significantly improves both electrical functionality and cost efficiency. Further, the modular design enables rapid application of further mechanical and or electrical circuit improvements that may arise. Because the number of required interconnections has been reduced, a transceiver according to the invention may be smaller and lighter than previous assemblies of similar function.
Where in the foregoing description reference has been made to ratios, integers, components or modules having known equivalents then such equivalents are herein incorporated as if individually set forth.
While the present invention has been illustrated by the description of the embodiments thereof, and while the embodiments have been described in considerable detail, it is not the intention of the applicant to restrict or in any way limit the scope of the appended claims to such detail. Additional advantages and modifications will readily appear to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details, representative apparatus, methods, and illustrative examples shown and described. Accordingly, departures may be made from such details without departure from the spirit or scope of applicant's general inventive concept. Further, it is to be appreciated that improvements and/or modifications may be made thereto without departing from the scope or spirit of the present invention as defined by the following claims.
