Claims
- 1. A process for producing molded parts, comprising:
- forming a polyester-based curable molding composition into a desired shape in a mold under pressure; and
- heating said formed composition in the mold, at a temperature in the range of greater than 140.degree. C. to about 200.degree. C.;
- said polyester-based curable molding composition being an improved curable molding composition containing a resin system of the type which includes as resin system components:
- i) a thermosetting unsaturated polyester resin which is the reaction product of an olefinically unsaturated dicarboxylic acid or anhydride with a polyol;
- ii) an ethylenically unsaturated monomer which is copolymerizable with said unsaturated polyester resin to provide crosslinking; and
- iii) a thermoplastic low profile additive material for shrinkage control;
- wherein the improvement comprises the combination of said resin system components and:
- iv) from 1% to 10% by weight, based on the total weight of the resin system, of at least one highly reactive olefinically unsaturated material which is different from said ethylenically unsaturated monomer, and is present in the molding composition in an amount which is less than the amount of said ethylenically unsaturated monomer and which is sufficient to improve the cracking or blistering resistance of the cured molding composition without adversely affecting its surface smoothness, said highly reactive olefinically unsaturated material being selected from the group consisting of:
- a) the di- acrylate or methacrylate of a diol selected from the group consisting of hexane diols, neopentyl glycol, butylene glycol, diethylene glycol, tetraethylene glycol, and tripropylene glycol;
- b) the tri- acrylate or methacrylate of trimethylol propane;
- c) the tetra- acrylate or methacrylate of pentaerythritol;
- d) the di- acrylate or methacrylate of an ethoxylated Bis Phenol A;
- e) the acrylate or methacrylate of isobornyl alcohol; and
- f) divinyl benzene;
- whereby the surfaces of molded parts so produced are superior, in terms of cracking and blistering, to surfaces of parts produced in an otherwise similar process in which highly reactive olefinically unsaturated material of paragraph iv is not employed.
- 2. The process of claim 1, wherein said molding composition further comprises a filler selected from the group consisting of (a) reinforcing fiber, (b) inert filler, and (c) a combination of both (a) and (b) dispersed therein, said resin system being in intimate contact with said filler;
- said reinforcing fiber (a) being selected from the group consisting of fibers or fabrics of glass; and
- said inert filler (b) being selected from the group consisting of clay, alumina trihydrate, silica, and calcium carbonate.
- 3. The process of claim 1 wherein in said molding composition the thermosetting unsaturated polyester resin further includes at least one of the following:
- a) carboxylic acid functionalities; and
- b) esterified moieties of a saturated or aromatic dicarboxylic acid or anhydride.
- 4. The process of claim 1 wherein said molding composition further comprises at least one of the following:
- a) a thickening agent selected from the group consisting of magnesium oxide, calcium oxide, calcium hydroxide, zinc oxide, barium oxide, and magnesium hydroxide; and
- b) a polyisocyanate resin.
- 5. The process of claim 1 wherein in said molding composition the ethylenically unsaturated monomer is selected from the group consisting of styrene and styrene derivatives bearing lower alkyl or halo- substituents.
- 6. The process of claim 1 wherein in said molding composition the thermoplastic low profile additive material is selected from the group consisting of poly(vinyl acetate), polyalkylmethacrylate, and polyurethane polymers.
- 7. The process of claim 1 wherein said molding composition further comprises at least one of the following:
- a) an epoxy monomer essentially free of reactive unsaturation; and
- b) a secondary crosslinking monomer with an r.sub.1 value greater than 1 relative to styrene.
- 8. A molded article formed using the process and the molding composition of claim 1.
RELATED APPLICATION
This application is a continuation of U.S. application: Ser. No. 07/332,587, filed Apr. 3, 1989, now abandoned, which is a continuation-in-part of application Ser. No. 07/221,651, filed Jul. 20, 1988, which is now abandoned.
US Referenced Citations (25)
Foreign Referenced Citations (7)
Number |
Date |
Country |
849135 |
Jul 1977 |
BEX |
0028841 |
May 1981 |
EPX |
0031434 |
Jul 1981 |
EPX |
0058740 |
Sep 1982 |
EPX |
74746 |
Mar 1983 |
EPX |
0234692 |
Feb 1987 |
EPX |
1361841 |
Jul 1974 |
GBX |
Non-Patent Literature Citations (1)
Entry |
R. M. Griffith & H. Shanoski, "Reducing Blistering In SMC Molding", Plastics Design and Processing, pp. 10-12 (Feb. 1977). |
Continuations (1)
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Number |
Date |
Country |
Parent |
332587 |
Apr 1989 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
221651 |
Jul 1988 |
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