Patent Grant
9567988
Currently available cryogenic vacuum pumps (cryopumps) generally follow a common design concept. A low temperature array, usually operating in the range of 4 to 25 K, is the primary pumping surface. This surface is surrounded by a higher temperature radiation shield, usually operated in the temperature range of 60 to 130 K. The radiation shield protects the lower temperature array from radiated heat. The radiation shield generally includes a housing which is closed except at an opening where a frontal array is positioned between the primary pumping surface and a work chamber to be evacuated.
During operation, high boiling point gases such as water vapor are condensed on the frontal array. Lower boiling point gases pass through that array and into the volume within the radiation shield and condense on the lower temperature array. A surface coated with an adsorbent such as charcoal or a molecular sieve operating at or below the temperature of the colder array may also be provided in this volume to remove the very low boiling point gases such as hydrogen. With the gases thus condensed and/or adsorbed onto the pumping surfaces, a vacuum is created in the work chamber.
In systems cooled by closed-cycle cryocoolers, the cooler is typically a two-stage refrigerator having a cold finger which extends through the rear or side of the radiation shield. High pressure helium refrigerant is generally delivered to the refrigerator through high pressure lines from a compressor assembly. Electrical power to a displacer drive motor in the cooler is usually also delivered through the compressor or a controller assembly.
The radiation shield is connected to a heat sink, or cold station, at the coldest end of the first stage of the refrigerator. The shield surrounds the second stage cryopanel in such a way as to protect it from radiant heat. The frontal array is cooled by the first stage heat sink through its attachment to the radiation shield or, as disclosed in U.S. Pat. No. 4,356,701, through thermal struts.
The coldest end of the second, coldest stage of the cryocooler is at the tip of the cold finger. The primary pumping surface, or cryopanel, is connected to a heat sink at this coldest end of the second stage. This cryopanel may be a simple metal plate or cup, or it may be an array of metal baffles arranged around and connected to the second-stage heat sink. This second stage cryopanel also supports the low temperature adsorbent.
As part of the sophisticated technology employed to produce the utmost dependability and the highest efficiency of cryopumps, much effort has been devoted to the selection of materials for the regenerative heat exchangers in cryogenic refrigerators such as Gifford-McMahon, Stirling, and pulse tube cryogenic refrigerators. Regenerative heat exchangers which exhibit high volumetric heat capacities at low temperatures are normally preferred. As shown in
Lead, however, is a poisonous metal that can damage nervous systems, especially in young children, and cause blood and brain disorders. Long term exposure to lead or its salts (especially soluble salts or the strong oxidant PbO2) can cause nephropathy, and colic-like abdominal pains. Therefore, the use of lead in products is now either banned, restricted or undesirable.
Other regenerative materials, too, have disadvantages. For example, rare-earth containing intermetallic compounds are extremely expensive. In addition, intermetallic materials are harder and more brittle than metal compounds, and, therefore, are difficult to produce in the geometries needed for the regenerative heat exchangers in cryogenic refrigerators. These materials also have relatively poor performance because they can easily disintegrate into powder when exposed to repeated mechanical shocks during normal refrigerator operation. Bismuth is another metal with high volumetric heat capacity, but it is very expensive, brittle, and difficult to fabricate into the spherical shape needed for regenerator material. Bismuth can also disintegrate into powder like the intermetallic compounds, with the added disadvantage that bismuth powder is highly flammable and reactive with aluminum and air. Aluminum is a common material of construction in cryogenic refrigerators and thus the powder may react when the refrigerator is disassembled in air.
As such, there is a need for less hazardous and inexpensive regenerative heat exchanger materials with high volumetric heat capacity that don't have the potential to degrade over time during operation and are able to be formed into the required geometry.
In one embodiment, the invention includes a cryogenic refrigerator that comprises a regenerative heat exchanger material of a tin-antimony (Sn—Sb) alloy in thermal contact with a working gas in at least one cooling stage. In a specific embodiment, the cryogenic refrigerator is a Gifford-McMahon cryogenic refrigerator. In another specific embodiment, the cryogenic refrigerator is a pulse tube cryogenic refrigerator. In yet another specific embodiment, the cryogenic refrigerator is a Stirling cryogenic refrigerator. In yet another embodiment, the working gas is helium. In some embodiments, the cooling stage includes at least two layers of regenerative heat exchanger material. In certain embodiments, at least one layer includes a tin-antimony (Sn—Sb) alloy, and at least one layer includes at least one rare earth element. In certain other embodiments, at least one layer includes a tin-antimony (Sn—Sb) alloy, and at least one layer includes a rare earth intermetallic compound of one or more rare earth elements with a non-rare earth metal. In yet other embodiments, at least one layer includes a tin-antimony (Sn—Sb) alloy, and at least one layer includes a solid solution alloy of rare earth elements. In a specific embodiment, the Sn—Sb alloy comprises a maximum of about 43% antimony by weight, preferably about 9.6% antimony by weight, and more preferably about 6.7% antimony by weight. In another specific embodiment, the Sn—Sb alloy comprises a minimum of about 0.5% antimony by weight. In another embodiment, the Sn—Sb alloy includes substantially spherical tin-antimony alloy particulates, in a diameter range of between about 0.01 mm and about 3 mm.
In another embodiment of the cryogenic refrigerator, the cooling stage further includes a cold station in direct thermal contact with the working gas. In a specific embodiment, the cold station is substantially composed of copper.
In another embodiment of the cryogenic refrigerator, the regenerative heat exchanging material includes a Sn—Sb-M alloy. M can include at least one element selected from the group consisting of Bi, Ag, Ge, Cu, La, Mg, Mn, Nd, Ni, Pd, Pt, K, Rh, Sm, Se, S, Y, Fe, In, Cd, Ti, Al, Ce, Dy, Au, P, Pr, Yb, and Zn, from about 0.01% to about 40% of M by weight, from about 0.1% to about 43% of Sb by weight, and from about 50% to about 99.5% of Sn by weight. In some embodiments, the cooling stage includes at least two layers of regenerative heat exchanger material. In certain embodiments, at least one layer includes a Sn—Sb-M alloy, and at least one layer includes at least one rare earth element. In certain other embodiments, at least one layer includes a Sn—Sb-M alloy, and at least one layer includes a rare earth intermetallic compound of one or more rare earth elements with a non-rare earth metal. In yet other embodiments, at least one layer includes a Sn—Sb-M alloy, and at least one layer includes a solid solution alloy of rare earth elements. In a specific embodiment, the Sn—Sb-M alloy includes substantially spherical Sn—Sb-M particulates, in a diameter range of between about 0.01 mm and about 3 mm.
In another embodiment, the invention includes a cryopump that comprises a cryogenic refrigerator that includes at least one cooling stage containing a working gas adapted to be a cryogenic refrigerant, and containing at least one cold station in thermal contact with the at least one cooling stage, a regenerative heat exchanger material in thermal contact with the working gas, the regenerative heat exchanger material including a tin-antimony (Sn—Sb) alloy, and at least one cryopanel adapted to condense or adsorb gases, connected to the at least one cold station. In a specific embodiment, the Sn—Sb alloy comprises a maximum of about 43% antimony by weight, preferably about 9.6% antimony by weight, and more preferably about 6.7% antimony by weight. In another specific embodiment, the Sn—Sb alloy comprises a minimum of about 0.5% antimony by weight. In a specific embodiment, the cryogenic refrigerator is a Gifford-McMahon cryogenic refrigerator. In another specific embodiment, the cryogenic refrigerator is a pulse tube cryogenic refrigerator. In yet another specific embodiment, the cryogenic refrigerator is a Stirling cryogenic refrigerator. In some embodiments, the working gas is helium. In another embodiment, the cryopump comprises a regenerative heat exchanger material that includes an Sn—Sb-M alloy. M can include at least one element selected from the group consisting of Bi, Ag, Ge, Cu, La, Mg, Mn, Nd, Ni, Pd, Pt, K, Rh, Sm, Se, S, Y, Fe, In, Cd, Ti, Al, Ce, Dy, Au, P, Pr, Yb, and Zn, from about 0.01% to about 40% of M by weight, from about 0.1% to about 43% of Sb by weight, and from about 50% to about 99.5% of Sn by weight.
In another embodiment, the invention includes a cryopump that comprises a Gifford-McMahon cryogenic refrigerator that includes a reciprocating displacer within a cryogenic refrigerator with first and second coaxial stages, the displacer being driven in reciprocating motion alternately compressing and expanding a working gas adapted to be a cryogenic refrigerant, a regenerative heat exchanger material in the displacer in thermal contact with the working gas, the regenerative heat exchanger material including a tin-antimony (Sn—Sb) alloy, and at least one cryopanel adapted to condense or adsorb gases, connected to the second coaxial stage. In a specific embodiment, the Sn—Sb alloy comprises a maximum of about 43% antimony by weight, preferably about 9.6% antimony by weight, and more preferably about 6.7% antimony by weight. In another specific embodiment, the Sn—Sb alloy comprises a minimum of about 0.5% antimony by weight.
In another embodiment of the cryopump that comprises a Gifford-McMahon cryogenic refrigerator, the regenerative heat exchanger material includes an Sn—Sb-M alloy. M can include at least one element selected from the group consisting of Bi, Ag, Ge, Cu, La, Mg, Mn, Nd, Ni, Pd, Pt, K, Rh, Sm, Se, S, Y, Fe, In, Cd, Ti, Al, Ce, Dy, Au, P, Pr, Yb, and Zn, from about 0.01% to about 40% of M by weight, from about 0.1% to about 43% of Sb by weight, and from about 50% to about 99.5% of Sn by weight.
In still another embodiment, the invention includes a cryopump that comprises a pulse tube cryogenic refrigerator that includes a buffer tank configured to contain a volume of a working gas adapted to be a cryogenic refrigerant, a first heat exchange region in fluid communication with the buffer tank, a pulse tube in fluid communication with the first heat exchange region, configured to transmit a gas pressure wave along the pulse tube, a second heat exchange region in fluid communication with the pulse tube, a cavity in fluid communication with the second heat exchange region, the cavity containing a regenerative heat exchanger material in thermal contact with the working gas, the regenerative heat exchanger material including a tin-antimony (Sn—Sb) alloy, a source of gas pressure adapted to create a gas pressure wave, and at least one cryopanel adapted to condense or adsorb gases, connected to the second heat exchange region. In a specific embodiment, the cryopump further includes a flow restriction orifice in fluid communication with the buffer tank and with the first heat exchange region. In another specific embodiment, the flow restriction orifice further includes an adjustable opening. In yet another specific embodiment, the source of gas pressure is a reciprocating displacer, the displacer being driven in reciprocating motion, alternately compressing and expanding the working gas. In some embodiments, the working gas is helium. In another specific embodiment, the regenerative heat exchanger material includes at least two layers. In yet another specific embodiment, the cryopump includes a cold station in direct thermal contact with the working gas. In a specific embodiment, the cold station is substantially composed of copper. In yet another specific embodiment, the Sn—Sb alloy comprises a maximum of about 43% antimony by weight, preferably about 9.6% antimony by weight, and more preferably about 6.7% antimony by weight. In another specific embodiment, the Sn—Sb alloy comprises a minimum of about 0.5% antimony by weight. In another embodiment, the regenerative heat exchanger material includes an Sn—Sb-M alloy. M can include at least one element selected from the group consisting of Bi, Ag, Ge, Cu, La, Mg, Mn, Nd, Ni, Pd, Pt, K, Rh, Sm, Se, S, Y, Fe, In, Cd, Ti, Al, Ce, Dy, Au, P, Pr, Yb, and Zn, from about 0.01% to about 40% of M by weight, from about 0.1% to about 43% of Sb by weight, and from about 50% to about 99.5% of Sn by weight.
In yet another embodiment, the invention includes a cryogenic refrigerator that comprises a regenerative heat exchanger material of a tin-gallium (Sn—Ga) alloy in thermal contact with a working gas in at least one cooling stage. In a specific embodiment, the cryogenic refrigerator is a Gifford-McMahon cryogenic refrigerator. In another specific embodiment, the cryogenic refrigerator is a pulse tube cryogenic refrigerator. In yet another specific embodiment, the cryogenic refrigerator is a Stirling cryogenic refrigerator. In some embodiments, the working gas is helium. In some embodiments, the cooling stage includes at least two layers of regenerative heat exchanger material. In certain embodiments, at least one layer includes a tin-gallium (Sn—Ga) alloy, and at least one layer includes at least one rare earth element. In certain other embodiments, at least one layer includes a tin-gallium (Sn—Ga) alloy, and at least one layer includes a rare earth intermetallic compound of one or more rare earth elements with a non-rare earth metal. In yet other embodiments, at least one layer includes a tin-gallium (Sn—Ga) alloy, and at least one layer includes a solid solution alloy of rare earth elements. In a specific embodiment, the Sn—Ga alloy comprises a maximum of about 3.9% gallium by weight.
In still another embodiment, the invention includes a method of operating a cryopump at cryogenic temperature. The method comprises reciprocating a displacer within a cold-accumulating unit of the cryopump. The displacer houses a regenerative heat exchanger material that includes a tin-antimony alloy. A working gas is introduced into the cold-accumulating unit under pressure, and then expanded by the displacer, thereby cooling the gas, which, in turn, cools the regenerative heat exchanger material. In a specific embodiment, the working gas is helium.
In another embodiment, the invention includes a method of operating a cryopump at cryogenic temperature that comprises providing at least one cooling stage containing a working gas adapted to be a cryogenic refrigerant, and containing at least one cold station in thermal contact with the at least one cooling stage, and a regenerative heat exchanger material in thermal contact with the working gas, the regenerative heat exchanger material including a tin-antimony (Sn—Sb) alloy. The method further includes condensing or adsorbing gases on at least one cryopanel connected to the at least one cold station.
In still another embodiment, the regenerative heat exchanger material that includes a tin-antimony alloy is not contained in a moving displacer and instead is in a fixed bed with pressure pulses traversing the working gas across the regenerative heat exchanger material. In a specific embodiment, the working gas is helium.
The invention is advantageous in that it provides less hazardous and inexpensive regenerative heat exchanger materials including tin-antimony (Sn—Sb) alloys with high volumetric heat capacity that don't have the potential to degrade over time during operation and are able to be formed into the required geometry for cryogenic refrigerators. Cryogenic vacuum pumps that include regenerative heat exchanger materials of this invention as part of lead-free cryogenic refrigerators provide clean vacuum environments for semiconductor manufacturing and other electronics manufacturing processes.
The foregoing will be apparent from the following more particular description of example embodiments of the invention, as illustrated in the accompanying drawings in which like reference characters refer to the same parts throughout the different views. The drawings are not necessarily to scale, emphasis instead being placed upon illustrating embodiments of the present invention.
Metallic tin (Sn) is generally non-toxic to humans, even upon uptake of small concentrations for a long period of time, and elemental tin rarely affects human health. As such, tin is an environmentally sensible substitute for lead as a regenerative heat exchanger material applied to cryogenic refrigerators in cryopumps, without significantly compromising volumetric heat capacity as shown in
Tin has two allotropes at normal pressure and temperature: gray alpha (α)-tin and white beta (β)-tin. Below 13.2° C. at equilibrium, it exists as α-tin, which has a cubic crystal structure similar to silicon and germanium. Gray tin has poor metallic properties; it is a dull-gray brittle material. When warmed above 13.2° C. at equilibrium, tin changes into white or β-tin, which is a ductile metal with a tetragonal structure. Alpha tin can cause undesirable effects in applications where the ductile properties of tin are important and the transformation results in powdering of the transformed material because of the stresses that result from the volume change associated with the transformation. The transformation of β-tin to α-tin also occurs slowly when held for a long time below 13.2° C. Incubation times for the formation of α-tin can range from months to more than a year. The transformation involves an incubation time in which the alpha phase nucleates at the surface, and a growth phase in which the alpha phase grows into the beta phase over time. The result can be a metallic surface of white tin that becomes covered with a gray powder which is easily rubbed off. This process is known as tin disease or tin pest.
Regenerative heat exchanger materials made of gray or alpha tin are unsuited to be applied in cryogenic cycles, because the low temperature surfaces of cryopumps operate in the range of 4 to 70 K (−269° C. to −203° C.) and cycle between room temperature and the cold operating range for regular maintenance and regeneration. The transformation to gray tin is prevented by the addition of antimony (Sb), in sufficient quantity, forming an alloy of tin and antimony. Tin alloys containing one or more of lead and bismuth in sufficient quantities or in combination resulting in sufficient quantities will also eliminate the transformation to α-tin. The inclusion of additional elements to enhance properties such as volumetric heat capacity and ductility and minimize thermal conductivity may be included as long as the minimum amount of the inhibiting element is included in the alloy. These alloying elements include but are not limited to: In, Ag, Au, Cd, Ti, Ni, Bi, Ge, Cu, Mg, Mn, Pd, Pt, K, Rh, Se, S, Y, Fe, Al, P, Yb, Zn, and the rare-earth elements.
As such, in certain embodiments of the present invention, the regenerative heat exchanger material for operating a cryogenic refrigerator includes tin-antimony (Sn—Sb) alloy. The regenerative heat exchanger material can generally comprise a plurality of phases, each having a different composition ratio and impurity phases such as oxide and carbide.
In one embodiment, the Sn—Sb alloy can include up to the maximum solid solubility of about 9.6% Sb by weight with a minimum concentration of about 0.5% Sb by weight. Compositions can include up to about 43% Sb by weight.
In certain other embodiments, the regenerative heat exchanger material for operating a cryogenic refrigerator includes a tin-gallium (Sn—Ga) alloy. In one embodiment, the Sn—Ga alloy can include up to the maximum solid solubility of about 3.9% Ga by weight.
In certain embodiments, the regenerative heat exchanger material can be a ternary alloy following the general formula Sn—Sb-M, wherein M is an element selected from the group consisting of Bi, Ag, Ge, Cu, La, Mg, Mn, Nd, Ni, Pd, Pt, K, Rh, Sm, Se, S, Y, Fe, In, Al, Ce, Dy, Cd, Ti, Au, P, Pr, Yb, Er, Ho, Gd, and Zn. In certain embodiments, the Sn—Sb-M alloy material can include from about 0.01% to about 40% of M by weight, from about 0.1% to about 43% of Sb by weight, and from about 50% to about 99.5% of Sn by weight.
Preferably, the regenerative heat exchanger materials of the present invention are comprised of spheres having substantially uniform diameters, in order to provide for minimization of pressure drop along the flow direction of the operating medium (refrigerant), such as helium (He) gas, in a cold-accumulating unit packed with the regenerative heat exchanger material, and in order to increase the heat exchange efficiency between the operating medium and the regenerative heat exchanger material, and to maintain a constant rate of heat exchange within the cold-accumulating unit.
The size of the regenerative heat exchanger material is a factor that has a large influence upon the cooling functions and the heat transfer characteristics of the refrigerator. In one embodiment, the diameter range of the substantially spherical regenerative heat exchanger material is in a range of between about 0.01 mm and about 3 mm.
In an additional embodiment shown in
The cryogenic refrigerator of the present invention is constructed so as to comprise a plurality of cooling stages and alloy materials filled in at least part of a regenerative heat exchanger at a final cooling stage of the refrigerator. For example, in the case of a two-stage expansion type refrigerator, the regenerative heat exchanger material of this invention is filled in a low-temperature end of the regenerator disposed at a second cooling stage. In the case of a three-stage expansion type refrigerator, the regenerative heat exchanger material of this invention is filled in a low-temperature end of a cold-accumulating unit disposed at a third stage. On the other hand, the cold-accumulating units of the other two stages of the three-stage refrigerator, which operate at successively higher temperatures than the third stage, optimally can be filled with other regenerator materials having a high volumetric specific heat at the operating temperature of the particular cold-accumulating unit. The three-stage refrigerator may also contain the material of this invention in portions of the second and/or third stages depending on the operating temperatures of the stages and the heat capacity needed to provide the required cooling. The regenerative heat exchanger material of this invention may be used similarly in systems with more than three stages.
Cryogenic refrigerators of the invention include Gifford-McMahon type cryogenic refrigerators, pulse tube cryogenic refrigerators, and Stirling type cryogenic refrigerators. One embodiment of a Gifford-McMahon cryogenic refrigerator of the invention is shown in
First stage displacer 110 accommodates first stage regenerative heat exchanger material 150. In one embodiment, first stage regenerative heat exchanger material 150 can include copper or stainless steel mesh or an equivalent thereof.
In second stage displacer 115, the low temperature side contains second stage regenerative heat exchanger material 170 made of a regenerative heat exchanger material of this invention for extremely low temperature. In certain embodiments of the present invention, the regenerative heat exchanger material for operating a cryogenic refrigerator includes tin-antimony (Sn—Sb) alloy. In certain other embodiments of the present invention, the regenerative heat exchanger material can be a ternary alloy following the general formula Sn—Sb-M, wherein M is an element selected from the group consisting of Bi, Ag, Ge, Cu, La, Mg, Mn, Nd, Ni, Pd, Pt, K, Rh, Sm, Se, S, Y, Fe, In, Al, Ce, Dy, Au, Cd, Ti, P, Pr, Yb and Zn. Second stage regenerative heat exchanger material 170 is contained within second stage displacer 115 by screens or the like. In certain embodiments, first stage regenerative heat exchanger material 150 and second stage regenerative heat exchanger material 170 can include at least two layers of materials, with various volumetric heat capacities as appropriate to the temperature at the respective location in the regenerator.
First expansion chamber 180 is provided between first stage displacer 110 and second stage displacer 115. Second expansion chamber 185 is provided below second stage displacer 115. First stage cold station 160 is provided around first expansion chamber 180 and, further, second stage cold station 190 which is colder than first stage cold station 160 is provided around second expansion chamber 185. Optional heating sources 195 and 196 can be provided in contact with second stage cold station 190 and first stage cold station 160, respectively, to warm the second and first stages during operation and regular maintenance. Second stage cold station 190 has an operating temperature of about 10 K to about 25 K, and therefore it is a vacuum pumping surface for gases that condense at very low temperatures or are adsorbed by other materials at these cold temperatures. In one embodiment, there is no barrier between the helium gas and high thermal conductivity second stage cold station 190 so that there is direct thermal contact between the helium gas and second stage cold station 190. In another embodiment, either or both first stage cold station 160 and second stage cold station 190 include copper for a greater degree of thermal contact between the helium gas and the respective cold stations.
The flow of working gas refrigerant in the cryogenic refrigerator of a cryopump is cyclic. In the most basic form of a Gifford-McMahon cryogenic refrigerator, shown in
To produce the low temperatures required for cryopump uses, the incoming gas must be cooled before expansion. The regenerator extracts heat from the incoming gas, stores it, and then releases it to the exhaust stream. A regenerator is a reversing-flow heat exchanger through which the helium passes alternately in either direction. The regenerator comprises a material of high surface area, high specific heat, and low thermal conductivity. Thus, the regenerator will accept heat from the helium if the helium's temperature is higher. If the helium's temperature is lower, the regenerator will release heat to the helium.
Further, a second stage of refrigeration can be added, as shown in
One embodiment of a cryopump that includes a Gifford-McMahon cryogenic refrigerator is shown in
In certain embodiments of a Gifford-McMahon cryopump, the first stage regenerative heat exchanger material (not shown in
In certain embodiments of a Gifford-McMahon cryopump, there is no barrier between the working gas, for example, helium, and high thermal conductivity second stage cold station 190 so that there is direct thermal contact between the helium gas and second stage cold station 190. In another embodiment, either or both first stage cold station 160 and second stage cold station 190 include copper for a greater degree of thermal contact between the helium gas and the respective cold stations.
A cryopump can include a pulse tube refrigerator. Pulse tube refrigerators are regenerative refrigerators in which a pressure wave travels back and forth through a buffer tank, a pulse tube, and a section containing the regenerative heat exchanger material. The pressure wave creates an oscillating gas column, called a gas piston, that functions as a compressible displacer to move the working gas back and forth through the regenerative heat exchanger material. In this process, one end of the pulse tube is cooled, creating a cold station region, and the other end of the pulse tube is heated, creating a hot station region, where heat is dissipated away from the refrigerator. The pressure wave can be created by a compressor connected to the pulse tube refrigerator by high and low pressure gas lines, or by oscillators such as acoustic sources and pistons, and therefore a pulse tube refrigerator has no moving parts at the cold end. Some pulse tube refrigerators contain an orifice between the pulse tube and the buffer tank to act as a flow resistance to enable proper phasing of the gas motion and pressure wave. Pulse tube refrigerators can be single stage or can contain multiple stages. The basic operation of a pulse tube refrigerator is described in Development of the Pulse Tube Refrigerator as an Efficient and Reliable Cryocooler, R. Radebaugh, Proceedings of the Institute of Refrigeration, Vol. 96 (London, 1999/2000), the entire teachings of which are incorporated herein by reference.
One embodiment of a cryopump that includes a pulse tube cryogenic refrigerator is shown in
In one embodiment of the cryopump shown in
In certain embodiments of a pulse tube cryopump, there is no barrier between the working gas, for example, helium, and high thermal conductivity second stage cold station 560 so that there is direct thermal contact between the helium gas and second stage cold station 560. In another embodiment, either or both first stage cold station 460 and second stage cold station 560 include copper for a greater degree of thermal contact between the helium gas and the respective cold stations.
A cryopump can include a Stirling cryogenic refrigerator. One embodiment of a two-stage Stirling cryogenic refrigerator is shown in
In certain embodiments of a Stirling cryogenic refrigerator, first stage regenerative heat exchanger material 150 and second stage regenerative heat exchanger material 170 can include at least two layers as described above, with various volumetric heat capacities as appropriate to the temperature at the respective location in the regenerator. First stage displacer 630 accommodates first stage regenerative heat exchanger material 150. In one embodiment, first stage regenerative heat exchanger material 150 can include copper or stainless steel mesh or an equivalent thereof.
In second stage displacer 640, the low temperature side contains second stage regenerative heat exchanger material 170 made of a regenerative heat exchanger material of this invention for extremely low temperature that includes tin-antimony (Sn—Sb) alloy.
First stage cold station 160 is provided at the end of first stage displacer 630 distal from pressure wave source 610, and, further, second stage cold station 190 which is colder than first stage cold station 160 is provided at the end of second stage displacer 640 distal from first stage cold station 160. Second stage cold station 190 has an operating temperature of about 10 K to about 25 K, and therefore it is a vacuum pumping surface for gases that condense at very low temperature or are adsorbed by other materials at these cold temperatures. Heat is extracted from first stage thermal load 112 and second stage thermal load 117. In another embodiment of a Stirling cryogenic refrigerator, pressure wave source 610 can be a piston or an acoustic source. In yet another embodiment of a Stirling cryogenic refrigerator, shown in
One embodiment of a cryopump that includes a two-stage Stirling cryogenic refrigerator is shown in
Regenerative heat exchanger materials in the form of 0.28 mm diameter round shot with a composition of 95% Sn by weight and 5% Sb by weight were tested in a standard two stage Gifford-McMahon refrigerator. The Sn—Sb regenerative materials of uniform size and composition were contained in heat exchanger 170 of the second stage displacer 115 of Gifford-McMahon refrigerator 100, shown in
The teachings of all patents, published applications and references cited herein are incorporated by reference in their entirety.
While this invention has been particularly shown and described with references to example embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the scope of the invention encompassed by the appended claims.
This application is the U.S. National Stage of International Application No. PCT/US2009/039419, filed Apr. 3, 2009, which designates the U.S., published in English, and claims the benefit of U.S. Provisional Application No. 61/123,037, filed Apr. 4, 2008. The entire teachings of the above applications are incorporated herein by reference.
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/US2009/039419 | 4/3/2009 | WO | 00 | 1/24/2011 |
| Publishing Document | Publishing Date | Country | Kind |
|---|---|---|---|
| WO2009/146120 | 12/3/2009 | WO | A |
| Number | Name | Date | Kind |
|---|---|---|---|
| 4272290 | Lesgourgues | Jun 1981 | A |
| 4632885 | Tanabe et al. | Dec 1986 | A |
| 5985212 | Hwang | Nov 1999 | A |
| 6030468 | Yagi et al. | Feb 2000 | A |
| 6318090 | Gschneidner, Jr. | Nov 2001 | B1 |
| 6325138 | Garosshen et al. | Dec 2001 | B1 |
| 6334909 | Okamura et al. | Jan 2002 | B1 |
| 20050005736 | Ueshima | Jan 2005 | A1 |
| 20050163642 | Duron | Jul 2005 | A1 |
| 20070122646 | Liu | May 2007 | A1 |
| 20070227159 | Murayama et al. | Oct 2007 | A1 |
| 20070228109 | Smith | Oct 2007 | A1 |
| 20100255998 | Buta | Oct 2010 | A1 |
| 20120151938 | Przybylski et al. | Jun 2012 | A1 |
| Number | Date | Country |
|---|---|---|
| 1973357 | May 2007 | CN |
| 11-264618 | Sep 1999 | JP |
| 11264618 | Sep 1999 | JP |
| 2004-099822 | Apr 2004 | JP |
| 2005-075963 | Mar 2005 | JP |
| 08-166173 | Jul 2008 | JP |
| 10-2007-0022215 | Feb 2007 | KR |
| 200502034 | Jan 2005 | TW |
| 1490408 | Jul 2015 | TW |
| WO 0077398 | Dec 2000 | WO |
| WO 2006 022297 | Mar 2006 | WO |
| Entry |
|---|
| Kariya, Yoshiharu, et al. “Tin pest in Sn-0.5 wt.% Cu lead-free solder.” JOM 53.6 (2001): 39-41. |
| Translation of JP11264618. |
| Translation of WO2006022297. |
| Notification Concerning Transmittal of International Preliminary Report on Patentability for Int'l Application No. PCT/US2009/039419, Date of Mailing: Oct. 14, 2010. |
| Korean Office Action for Application No. 10-2010-7024831, Date of Mailing: May 13, 2015. |
| Kariya, Y., et al., “Tin Pest in Sn-0.5 wt.% Cu Lead-Free Solder,” JOM, pp. 39-41 (Jun. 2001). |
| Korean Office Action for Application No. 10-2010-7024831, Date of Mailing: Dec. 13, 2015. |
| Office Action for Japan Application No. 200980120523.7, dated Apr. 14, 2016. |
| Office Action for Taiwan Application No. 104111216, dated Jul. 15, 2016. |
| Notification of Transmittal of the International Search Report and the Written Opinion of the International Searching Authority, or the Declaration, International Application No. PCT/US2009/039419, date of mailing, Oct. 19, 2009. |
| Number | Date | Country | |
|---|---|---|---|
| 20110126553 A1 | Jun 2011 | US |
| Number | Date | Country | |
|---|---|---|---|
| 61123037 | Apr 2008 | US |
