Patent Application
20170045273
The present invention disclosed herein relates to a cryogenic refrigeration system, and more particularly, to a cryogenic refrigeration system capable of improving a coefficient of performance thereof.
In general, a cryogenic refrigerator may be used to cool a superconductor or a small-sized electronic component. For example, the cryogenic refrigerator may include a stifling refrigerator, a GM refrigerator, and a Joule-Thomson refrigerator. The above-described cryogenic refrigerator may generate refrigeration output through an expansion process of working fluid such as helium or hydrogen. The expansion process may accompany heat generation of a compression process. Accordingly, the cryogenic refrigerator may be cooled by a heat dissipater. The typical cryogenic refrigerator may be cooled by a dual heat dissipater. The dual heat dissipater may include a water-cooling type heat dissipater and a vapor compression refrigerator. The water-cooling type radiator may cool the cryogenic refrigerator. The water-cooling type heat dissipater may be cooled by the vapor compression refrigerator However, since the water-cooling type heat dissipater uses water that has a low cooling efficiency of performance, a coefficient of performance of the cryogenic refrigerator may be reduced. In addition, the water-cooling type heat dissipater and the vapor compression refrigerator may increase costs for operating the cryogenic refrigerator to reduce productivity.
The present invention provides a cryogenic refrigeration system capable of increasing a radiant efficiency due to a coefficient of performance of refrigerant.
The present invention also provides a cryogenic refrigeration system capable of minimizing costs for operating a cryogenic refrigerator.
Embodiments of the present invention provide a cryogenic refrigeration system including: a cryogenic refrigerator; and a heat dissipation module configured to cool the cryogenic refrigerator. Here, the heat dissipation module includes: a condenser spaced apart from the cryogenic refrigerator to condense a refrigerant that cools the cryogenic refrigerator; and a heat exchanger connected to the cryogenic refrigerator to circulate the refrigerant between the cryogenic refrigerator and the condenser, thereby cooling the cryogenic refrigerator.
In other embodiments of the present invention, cryogenic refrigeration systems include: a cryogenic refrigerator comprising a power generation part, a power conversion part configured to convert power generated in the power generation part, and a gas cooling part configured to cool a gas by using the power converted in the power conversion part; and a heat dissipation module configured to circulate a refrigerant that cools the cryogenic refrigerator into the power generation part, the power conversion part, and the gas cooling part.
As described above, the cryogenic refrigeration system according to the embodiments of the present invention may use refrigerant having a coefficient of performance and/or a heat absorption efficiency greater than that of the water to increase a radiant efficiency of the cryogenic refrigerator. The cryogenic refrigerator may be directly cooled by the heat dissipation module to minimize the operational costs.
Exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Advantages and features of the present invention, and implementation methods thereof will be clarified through following embodiments described with reference to the accompanying drawings. The present invention may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this invention will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art. Further, the present invention is only defined by scopes of claims. Like reference numerals refer to like elements throughout.
In the specification, the technical terms are used only for explaining a specific exemplary embodiment while not limiting the present invention. In the specification, the terms of a singular form may include plural forms unless referred to the contrary. The meaning of ‘comprises’ and/or ‘comprising’ specifies a component, a step, an operation and/or an element does not exclude other components, steps, operations and/or elements. Also, it will be understood that the terms such as chambers, units, arms, links, blades, motors, pulleys, rotational shafts, and belts are used as general mechanical terms in the specification. Since preferred embodiments are provided below, the order of the reference numerals given in the description is not limited thereto.
Referring to
The cryogenic refrigerator 100 may include a sterling cryogenic refrigerator. According to an embodiment, the cryogenic refrigerator 100 may include a power generation part 110, a power conversion part 120, and a gas cooling part 130.
The power generation part 110 may generate rotational power by external power. For example, the power generation part 110 may include a motor. The power generation part 110 may be connected to the power conversion part 120. The power generation part 110 may be heated to a temperature greater than a room temperature. The power generation part 110 may be heated to a temperature equal to or greater than about 30° C.
The power conversion part 120 may convert the rotational power to reciprocating linear power. The power conversion part 120 may include a shaft 1 cam 125, a plurality of connecting rods 126, and a housing 128. The shaft 122 may be connected to the power generation part 110. The cam 124 may be connected between the shaft 122 and the connecting rods 126. The connecting rods 126 may extend to the gas cooling part 130. The housing 128 may surround the cam 124. The housing 128 may be connected to the gas cooling part 130.
The housing 121 may be provided in the housing 128. Oil 121 may be heated by operation of the shaft 122, the cam 124, and the connecting rods 126.
The gas cooling part 130 may be disposed on the power conversion part 120. The gas cooling part 130 may cool gas 131 at the cryogenic temperature. The gas 131 may include helium gas. According to an example, the gas cooling part 130 may include a cylinder 132, a displacer 140, and a piston 150. The cylinder 132 may be connected onto the power conversion part 120. The gas 131 may be provided into the cylinder 132. The displacer 140 and the piston 150 may be connected to the connecting rods 126 to move up and down in the cylinder 132. The displacer 140 may be disposed above the pistol 150. One of the connecting rods 126 may pass through the piston 150.
The cylinder 132 may include a gas expansion region 134, a gas compression region 136, and a piston movement region 138. The gas expansion region 134 may be disposed above the gas compression region 136. The displacer 140 may be connected to one of the connecting rods 126 to move up and down in the gas expansion region 134 and the gas compression region 136. The displacer 140 may expand and cool the gas 131 in the gas expansion region 134. Accordingly, the gas expansion region 134 may be a cooling region. The gas compression region 136 may be connected to the rest of the connecting rods 126 and disposed between the gas expansion region 134 and the piston movement region 138. The piston 150 may move up and down in the piston movement region 138. Alternatively, the piston movement region 138 may be a region through which one of the connecting rods 126 passes. The displacer 140 and the piston 150 may compress the gas 131 in the gas compression region 136. The compressed gas 131 may heat the cylinder 132 in the gas compression region 136. Thus, the gas compression region 136 may be a heating region.
The heat dissipation module 200 may circulate to supply refrigerant to the power generation part 110, the power conversion part 120, and the gas cooling part 130 to directly cool the cryogenic refrigerator 100. The direct cooling method may have a size smaller than that of the typical dual heat dissipater and reduce maintenance costs. Accordingly, the cryogenic refrigeration system 10 according to the present invention may reduce the operational costs.
According to an example, the heat dissipation module 200 may include a condenser 210, a compressor 220, heat exchangers 230, a refrigerant expander 240, a refrigerant supply line 250, and a refrigerant collecting line 260. The condenser 210 may condense the refrigerant. The compressor 220 may be connected to the condenser 210. The condenser 220 may compress the refrigerant. According to an example, the refrigerant may include R22, R123, R134a, HFC-407C, HFC-407A, or R-123yf. The refrigerant may have a freezing point and an evaporation point, which are lower than those of water. For example, when water at a temperature of about 15° C. is heat-exchanged to about 30° C. with respect to the cryogenic refrigerator 100 at a temperature of about 63K, the water may have a coefficient of performance (COP) of about 0.2625. Meanwhile, the refrigerant of the R22 may have the coefficient of performance greater than that of the water. When the R22 at a temperature of about −30° C. is heat-exchanged to about −15° C., the R22 may have the coefficient of performance of about 0.323. The heat exchangers 230 may be connected to the power generation part 110, the power conversion part 120, and the gas cooling part 130. The refrigerant supply line 250 may be connected between the condenser 210 and the heat exchangers 230. A radiant efficiency of the cryogenic refrigerator 100 may be increased. The refrigerant expander 240 may be connected to the refrigerant supply line 250. The refrigerant collecting line 260 may be connected between the compressor 220 and the heat exchangers 230.
The condenser 210 may liquefy the refrigerant. The condenser 210 may include a water-cooling type condenser and an air-cooling type condenser.
The refrigerant expander 240 may be disposed between the condenser 210 and the heat exchangers 230. The refrigerant expander 240 may vaporize and cool the refrigerant. The cooled refrigerant may be supplied to the heat exchangers 230 through the refrigerant supply line 250, The refrigerant may be heated in the heat exchangers 230.
The compressor 220 may supply the heated refrigerant to the condenser 210 with a predetermined pressure. The refrigerant in a gas state may be supplied to the condenser 210. The refrigerant may be circulated between the heat exchangers 230 and the condenser 210.
The heat exchangers 230 may cool the power generation part 110, the power conversion part 120, and the gas cooling part 130. According to an example, the heat exchangers 230 may include a gas heat exchanger 232, an oil heat exchanger 234, and a motor heat exchanger 236.
The gas heat exchanger 232 may be disposed in the compression region 136. The gas heat exchanger 232 may cool the cylinder 132 in the compression region 136. The heat exchange supply line 233 may connect the gas heat exchanger 232 to the oil heat exchanger 234. The heat exchange collecting line 235 may connect the gas heat exchanger 232 to the motor heat exchanger 236. The refrigerant may be sequentially supplied to the oil heat exchanger 234, the gas heat exchanger 232, and the motor heat exchanger 236. A first protection cover 312 may be disposed to surround the gas heat exchanger 232. The first protection cover 312 may protect the gas heat exchanger 232. On the other hand, the first protection cover 312 may prevent dew formation caused by cooling of the gas heat exchanger 231.
The power generation part 234 may be disposed on the power conversion part 120. The oil heat exchanger 234 may cool the oil in the power conversion part 120. The oil heat exchanger 234 may be connected to the refrigerant supply tine 250. A second protection cover 314 may be disposed to surround the heat exchanger 234. The second protection cover 314 may protect the oil heat exchanger 234.
The motor heat exchanger 236 may be disposed on the power generation part 110. The motor heat exchanger 236 may cool the power generation part 110. The motor heat exchanger 236 may be connected to the refrigerant collecting line 260.
Referring to
The first pressure transducer 272 may be disposed in the refrigerant collecting line 260 between the heat exchangers 230 and the compressor 220. The first pressure transducer 272 may detect a pressure of the refrigerant.
The first temperature sensor 274 may be disposed in the refrigerant collecting line 260 disposed adjacent to the first pressure transducer 272. The first temperature sensor 274 may detect a temperature of the refrigerant.
The circulation flow rate controller 276 may be connected to the first pressure transducer 272, the first temperature sensor 274, and the refrigerant expander 240. Also, the circulation flow rate controller 276 may receive a detection signal of the temperature and the pressure of the first pressure transducer 272 and the first temperature sensor 274. The circulation flow rate of the refrigerant may be controlled on the basis of the temperature and the pressure. The refrigerant expander 240 may control the circulation flow rate of the refrigerant according to the control signal of the circulation flow rate controller 276.
The cryogenic refrigerator 100 and the condenser 210, the compressor 220, the heat exchangers 230, the refrigerant expander 240, the refrigerant supply line 250, and the refrigerant collecting line 260 of the heat dissipation module 200 may be the same as those in
Referring to
The second temperature sensor 282 may be disposed in the refrigerant collecting line 260. The second temperature sensor 282 may detect the temperature of the refrigerant.
The second pressure transducer 284 may be disposed in the refrigerant collecting line 260. The second pressure transducer 284 may detect the pressure of the refrigerant.
The bypass valve 286 may be disposed in the refrigerant collecting line 260 between the condenser 210 and the compressor 220. The bypass valve 286 may be connected to the bypass line 290. The bypass valve 286 may include a three-way valve.
The bypass controller 288 may control the bypass valve 286. The bypass controller 288 may receive temperature and pressure signals of the second temperature sensor 282 and the second pressure transducer 284.
The bypass line 290 may detour the condenser 210 to connect the refrigerant collecting line 260 to the refrigerant supply line 250. According to an example, the bypass line 290 may be branched from the bypass valve 286. The bypass line 290 may be connected to the refrigerant supply line 250 between the heat exchangers 230 and the refrigerant expander 240. For example, when the temperature of the refrigerant of the refrigerant collecting line 260 is low, the bypass controller 288 may allow the refrigerant to detour from the refrigerant collecting line 260 to the refrigerant supply line 250 through the bypass line 290. Also, when the pressure of the refrigerant of the refrigerant collecting line 260 is high, the bypass controller 288 may allow the refrigerant to detour from the refrigerant collecting line 260 to the refrigerant supply line 250
The sensitive heat tube 292 may be disposed in the refrigerant collecting line 260, The sensitive heat tube 292 may be connected to the refrigerant expander 240. The sensitive heat tube 292 may detect the temperature of the refrigerant in the refrigerant collecting line 260. The sensitive heat tube 292 regulates the refrigerant expander 240 on the basis of the temperature of the refrigerant. The sensitive heat tube 292 may output a turn-on signal and a turn-off signal of the refrigerant expander 240. When the temperature of the refrigerant is high, the sensitive heat tube 292 may output the turn-on signal. When the temperature of the refrigerant is low, the sensitive heat tube 292 may output the turn-off signal.
The cryogenic refrigerator 100 and the condenser 210, the compressor 220, the heat exchangers 230, the refrigerant expander 240, the refrigerant supply line 250, and the refrigerant collecting line 260 of the heat dissipation module 200 may be the same as those in
Although the exemplary embodiments of the present invention have been described, it is understood that the present invention should not be limited to these exemplary embodiments but various changes and modifications can be made by one ordinary skilled in the art within the spirit and scope of the present invention as hereinafter claimed. Thus, the above-disclosed embodiments are to be considered illustrative and not restrictive.
According to the embodiment of the present invention, the cryogenic refrigerator may increase the radiant efficiency thereof to minimize the operational costs. In addition, the cryogenic refrigerator may effectively cool the low temperature superconductor or high temperature superconductor. The superconductor may be used as a source material for a power plant, a substation, a magnetic resonance device, a magnetic levitation train, a superconductor research center. The cryogenic refrigerator may be widely used in the field of superconductor technology. Furthermore, the cryogenic refrigerator may be mounted on a tensile tester for cryogenic metal.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2014-0050248 | Apr 2014 | KR | national |
| 10-2015-0052640 | Apr 2015 | KR | national |
This U.S. non-provisional patent application claims priority under 35 U.S.C. §119 of Korean Patent Application No. PCT/KR2015/004044, filed Apr. 23, 2015, the entire contents of which are hereby incorporated by reference.
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/KR2015/004044 | 4/23/2015 | WO | 00 |
