Patent Application
20220364683
The present disclosure generally relates to a transportation apparatus, system, and method, and more particularly to an apparatus, system, and method for transporting material.
Shipping cryogenically frozen materials by air transportation typically involves the use of dry vapor shippers. A typical type of these shippers are vacuum dewars that utilize a fluid cooling, such as liquid nitrogen, disposed inside the dewars to maintain desired cryogenic temperatures. An absorbent material can be disposed inside the dewars to absorb and hold fluid coolant in liquid form.
A dry vapor shipper (DVS) typically allows access to its interior via an opening or access port, which can be closed by an insulated vapor plug. The vapor plug seals an otherwise large path for heat to enter the DVS, while also providing a defined pathway for the release of gas, which causes pressure buildup as liquid coolant phase changes to gas. Liquid nitrogen, for example, expands 698 times from its liquid volume when that liquid phase changes to a gas. The vapor plug seals at a neck of the DVS between the interior of the DVS and the exterior of the DVS. The sealed connection, however, if imperfect, creates a path for heat to enter the DVS, and for coolant to escape.
There are several challenges to the design of an efficient vapor plug for a DVS. A principal challenge is providing a thermal barrier between the outside environment and a payload area of the interior. The difference in temperature typically exceeds of 200 degrees Celsius. This temperature is often called the “boundary temperature,” which typically ranges from about 77 degrees Kelvin (liquid nitrogen) to about 293 degrees Kelvin (room temperature).
To measure a temperature of a payload in a DVS, the DVS is typically fitted with a thermal sensor or probe. Running a thermal sensor and corresponding wiring into a cryogenic temperature region of a DVS without incurring additional heat loss is technically challenging. Positioning a tip of the thermal sensor at a known location within the DVS and avoiding damage to the sensor tip and wire are further challenges in utilizing a thermal sensor within the DVS. When the sensor is in a cryogenic region and the sensor tip and the sensor element are at cryogenic temperatures, sensor elements can be rendered inflexible and can break.
The sensor wire represents a significant pathway for the introduction of heat into the DVS interior payload area, with this heat path including two principal forms or paths of heat transfer. The first pathway involves conduction of heat through the wire itself. The second pathway involves spatial gaps related to how the wire is introduced into the DVS from the exterior. One conventional technique of running this wire includes positioning the wire between the plug exterior and the neck wall of the DVS unit. Another conventional technique is to drill a hole through the vapor plug transiting the exterior to the interior to allow the sensor and/or sensor wire to be inserted into the hole. This method typically leads to a pathway for gas to easily pass from inside the DVS to the exterior. This spatial gap occurs when the hole is sized larger than the space occupied by the sensor wire. Such a circumstance can occur, for example, when the thermal sensor tip is of a larger diameter than the wire, and the hole is sized sufficiently large to accommodate the passage of the tip through the hole. After the tip has passed through the hole, the wire remaining in the hole is of a diameter that is smaller than the hole size, which results in a free path for gas to flow through the hole and causes undesired heat transfer.
Another challenge with DVS plug design involves providing a sufficient free flowing pathway for gas to vent to eliminate the potential for dangerous pressure accumulation in the interior of the DVS. Particularly, designing a pathway for sufficient coolant gas to vent from the interior of the DVS with minimal heat exchange creates a challenge for vapor plug design. A gas vent that allows a free flow of gas from the inside of the DVS to the exterior of the DVS also allows a free flow of heat from the exterior of the unit to the interior of the DVS. Any increase in venting capacity further increases the flow of heat from the exterior to the interior of the DVS, thereby resulting in a cascading decrease in thermal stability of the payload within a desired temperature range (thermal performance).
Another challenge with the DVS plug design involves inconsistent size due to both temperature variation and structural weakness. As the vapor plug is exposed to temperatures ranging between, for example, 77 degrees K to about 293 degrees K, at different times or simultaneously, the vapor plug expands and contracts, bending the vapor plug out of shape such that the plug fits less snugly into the access port than desired. This size inconsistency of the vapor plug creates further pathways for heat convection and/or conduction.
A further challenge involves the orientation of the DVS and the weight of the coolant gas. When a DVS is in an upright orientation, the coolant gas sinks to the bottom of the DVS, while relatively warmer gas occupies the space immediately surrounding the vapor plug. Accordingly, when the DVS is oriented upright, the temperature differential between the area immediately outside the DVS at the vapor plug and immediately inside the DVS at the vapor plug is relatively low, and positioning the DVS in an upright orientation yields a relatively low heat flow through the vapor plug. The temperature differential increases, however, when the orientation of the DVS changes. For example, when the DVS is turned on its side or turned upside down, the coolant gas presses up against the vapor plug, which results in a larger temperature differential between the outside of the vapor plug and the inside. This greater temperature differential results in a greater heat flow through the vapor plug, which reduces the thermal performance of the DVS. Further, as the heat flow increases in the DVS, vaporization of the nitrogen gas also increases, thereby decreasing longevity and efficiency of the coolant. As a result of the dramatic difference in thermal performance due to orientation of the DVS, shippers either go to great efforts to ensure the DVS units are shipped upright, which can be burdensome, or the shippers will avoid long use of the units. This issue, coupled with lack of visibility in actual DVS orientation during shipments, leads to poor ability to reliably calculate estimated thermal performance of a DVS used in an actual shipment. The disclosed apparatus, system, and method of the present disclosure are directed to overcoming one or more of the shortcomings set forth above and/or other deficiencies in existing technology.
In an embodiment, a closing element for selectively blocking an opening of a cryogenic storage container includes a head assembly, a bottom member, at least one layer of insulating material disposed between the head assembly and the bottom member, at least one hole extending through the at least one layer of insulating material, and at least one member disposed in the at least one hole and extending through the insulating material, wherein a diameter of the at least one hole is substantially equal to a diameter of the at least one member.
In another embodiment, a method of manufacturing a closing element to block an opening of a cryogenic storage container includes providing at least one layer of insulating material, providing at least one hole extending through at least one layer of the insulating material, providing at least one member in the at least one hole, inserting an end portion of the at least one member in a fastening component, and compressing the at least one layer of insulating material by moving the fastening component relative to the at least one member.
In another embodiment, a cryogenic storage container includes a housing and a closing element. The housing includes a cavity and a neck opening. The closing element is configured to be selectively inserted in the neck opening. The closing element includes a head assembly and a bottom member, at least one layer of insulating material disposed between the head assembly and the bottom member, at least one hole extending through the at least one layer of insulating material, and at least one member disposed in the at least one hole and extending through the at least one layer of insulating material. A diameter of the at least one hole is substantially equal to a diameter of the at least one member.
In the following description, reference is made to the accompanying drawings that form a part thereof, and in which is shown by way of illustration specific example embodiments in which the present teachings may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the present teachings and it is to be understood that other embodiments may be utilized and that changes may be made without departing from the scope of the present teachings. The following description is, therefore, merely exemplary.
The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms “a”, “an”, and “the” may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms “comprises,” “comprising,” “including,” and “having,” are inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed or illustrated, unless specifically identified as an order of performance. It is also to be understood that additional or alternative steps may be employed.
When an element or layer is referred to as being “on”, “engaged to”, “connected to” or “coupled to” another element or layer, it may be directly on, engaged, connected or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on,” “directly engaged to”, “directly connected to” or “directly coupled to” another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
Spatially relative terms, such as “inner,” “outer,” “beneath”, “below”, “lower”, “above”, “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the example term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Unless specified otherwise, the terms “substantially”, “about”, or “approximately” can mean any value within a range from the specified value, wherein the range can be any range with a first inclusive end value of 0% and a second inclusive end value between 0% and +/−10%, inclusively.
Closing element 310 can be configured to selectively block an access port, opening or aperture, such as access port 329 at neck 330 of container 305. The access port 329 is formed by one or more wall portions 332 of container 305. Closing element 310 can be disposed in an uninstalled position relative to container 305 as illustrated in
As illustrated in
Still referring to
First layer 350 can be any suitable structural material for application around insulating material 348. First layer 350 can be a substantially linear polymer material (e.g., polyethylene). First layer 350 can be any suitable low-density polyethylene (LDPE) material. For example, first layer 350 can be a linear low-density polyethylene film (LLDP) or any other suitable similar material.
Second layer 355 can be disposed between first layer 350 and third layer 360. Second layer 355 can be any suitable structural material for surrounding and/or being disposed around first layer 350. Second layer 355 can be a high-density polyethylene material. Second layer 355 can be in rolled form, such as a non-woven high-density polyethylene fiber material (e.g., in rolled form). Second layer 355 can be wrapped multiple times around first layer 350. Second layer 355 can be adhered to layer 350 after being wrapped around first layer 350 by using adhesive (e.g., liquid adhesive, spray adhesive, and/or adhesive back tape). Second layer 355 can be a nonwoven material including spun bond olefin fiber. Second layer 355 can be a flash spun high-density polyethylene fiber material. In at least some embodiments, second layer 355 can be Tyvek® material available from DuPont. Second layer 355 can be conformable, facilitating conformation of closing element 310 inside neck 330 of container 305, and can provide structural rigidity to first layer 350 and insulating material 348. Layers 350 and/or 355 can seal insulating material 348 to substantially prevent debris or dust from escaping or separating from insulating material 348.
Third layer 360 can be any suitable structural material for surrounding and/or being disposed around second layer 355. Third layer 360 can be disposed between second layer 355 and one or more wall portions 332 of container 305 when closing element 310 is in the installed position, or between second layer 355 and an environment external to closing element 310 when the closing element 310 is uninstalled to close the access port 329 of container 305. Third layer 360 can be a foam material. For example, third layer 360 can be a microcellular foam material. Third layer 360 can be a urethane foam material (e.g., polyurethane foam material). In at least some embodiments, third layer 360 can be Poron® material available from the Rogers corporation. The qualities of Poron® facilitate providing a relatively sanitary and durable exterior surface. Third layer 360 can be formed from any suitable material having suitable thermal and sealing properties to provide a seal (e.g., act as a sealing surface) against wall portions 332. Third layer 360 can be any suitable compressible material for filling an irregular shape of neck 330 (e.g., of wall portions 332). Poron®, for example, is conformable at ambient temperatures, but becomes nonconformable and structurally rigid as it gets cold. When closing element 310 is inserted into neck 330 of a container 305 containing cryogen, Poron initially conforms to the shape of neck 330, but quickly gets cold and stiffens. In at least some embodiments, layer 360 can have a thickness between about 0.5 mm and about 5 mm. Third layer 360 can be applied to second layer 355 using any suitable adhesive. For example, third layer 360 can be applied on second layer 355 as a singular layer of material with a beginning edge and an ending edge of material of third layer 360 butting together to define a closure of an outside perimeter of closing element 310. An exterior surface of third layer 360 can form an outside perimeter (e.g., outside perimeter dimension) of closing element 310 that can be configured (e.g., manufactured or constructed) within suitable dimensional tolerances to fit a given neck 330 of a given container 305 with which closing element 310 is to be used.
In some embodiments, the outer layer of housing assembly 345 can include a fourth layer 361 including fleece material (e.g., polyester fleece material) or any other material having suitable thermal properties and malleability at low temperatures that can be disposed on second layer 355 as the very outermost layer of the closing element 310, or disposed between third layer 360 and second layer 355. Also, for example, the fleece material can provide a non-absorbent surface, which can provide a sanitary benefit to closing element 310. Fleece retains a high degree of its conformability and softness over a wide range of temperatures, facilitating good conformation of the closing element 310 in the neck 330 of the container 330 at ambient or cryogenic temperatures.
In at least some embodiments, the layers 350, 355, and/or 360 can be layers of pliable insulation, which can allow closing element 310 to conform to non-uniform or out-of-round DVS necks (e.g., neck 330) when placed in the installed position. The laminated materials (e.g., layers 350, 355, and/or 355) can remain pliable over a working range of temperatures that closing element 310 experiences during an operation of apparatus 300.
Member 365 can be formed from any materials having suitably low thermal conductivity and suitable structural characteristics for forming a bottom cap of closing element 310. Member 365 can be formed from material similar to layers 350, 355, and/or 360. In at least some embodiments, member 365 can include a thermoplastic material. For example, member 365 can be a multi-layer thermoplastic having foam material disposed between layers of thermoplastic foam (e.g., non-foam thermoplastic material). Member 365 can include polyester-based copolymer material, thermoplastic elastomer material, and/or thermoplastic olefin material.
Still referring to
Closing element 310 can also include a head assembly 385. Head assembly 385 can form for example a cap (e.g., an outer cap) or head assembly of closing element 310. Head assembly 385 can be for example formed from materials similar to other components of assembly 335 and/or any other suitable structural material (e.g., structural materials having relatively low thermal conductivity). Head assembly 385 can be attached (e.g., fixedly or removably attached for example by fasteners, adhesive, welding, and/or any other suitable method) to other components of closing element 310 for example as illustrated in
Closing element 310 can further include a vent assembly 400 as illustrated in
A sizing of vent member 410 and fluid passage 405 can be based on determining a desired gas flow or gas flow range through vent member 410 based on an NVR (Nitrogen Vaporization Rate) of apparatus 300. For example, an effective insulation performance of apparatus 300 can be determined by measuring the NVR of apparatus 300 when the container 305 is fully charged, closing element 310 is in the installed position, and container 305 is placed on its side (e.g., whereby fluid coolant 320 such as nitrogen gas presses against closing element 310 to attempt to “spill out” of container 305). Closing element 310 can be configured to allow for desired insulation (e.g., maximal insulation) from heat transfer due to conduction, convection, and/or radiant heat transfer. The apparatus 300 when container 305 is disposed on its side can be considered to be at a “dynamic” position. The flow rate of fluid coolant 320 (e.g., a gas) through vent member 410 can be calculated based on a maximum internal pressure (e.g., 25 PSI, up to 25 PSI, or about 7.25 PSI) and an external pressure outside of container 305 equal to about standard sea level pressure (e.g., 14.7 PSI). Vent member 410 can be configured or sized (e.g., an inner diameter or cross-section can be sized) to allow for a suitable flow of a portion of fluid coolant 320 (e.g., a sufficient gas volume to flow) that is equal or greater than the NVR rate of apparatus 300 determined when container 305 is in the dynamic position. In at least some embodiments, an overall thermal performance (e.g., NVR) of container 305 when in the dynamic position can be less than 60 g/hr.
Closing element 310 can also include a fastening assembly 415 for example as illustrated in
Member 420 can be an elongated structural member (e.g., a rod). Member 420 can be formed from thermosetting resin or plastic material. For example, member 420 can be formed from phenolic material. Member 420 can be a rod formed from phenolic material. As illustrated in
Each member 420 can be affixed to an underside of head assembly 385 by third fastener 435 and also to an inside of member 365 by fourth fastener 430. Fasteners 430, 435 can be any suitable mechanical fasteners that can fasten components by any suitable technique such as, for example, threading, adhering, welding, and/or any other suitable fastening technique. Each member 420 can be disposed in a given hole 440 and fastened between head assembly 385 and member 365 via fasteners 435, 430, respectively, for example as illustrated in
Returning to
Sensor system 340 can include a sensor 455, a sensor housing 460, and a communication path element 465. For example, as illustrated in
Sensor 455 can be any suitable sensor for monitoring a temperature of cavity 325 (e.g., of fluid coolant 320 disposed in cavity 325). Sensor 455 can be for example a probe such as a thermal probe. Sensor 455 can continuously sense temperature and provide data to data system 315 in real-time or near real-time or at any desired time intervals (e.g., intermittent sensing). Sensor 455 can be any suitable temperature sensor for use in sensing cryogenic temperatures. For example, sensor 455 can be a thermocouple sensor, a thermistor such as a negative temperature coefficient thermistor, a semiconductor-based integrated circuit, or a resistance temperature detector. Communication path element 465 can include any suitable electrical component(s) for electrically connecting sensor 455 to components of data system 315. For example, communication path element 465 can include an electrical wire or cable.
Sensor 455 can be inserted through insulating material 348 during an assembly of closing element 310. Sensor 455 can be inserted through a hole 470 of insulating material 348. For example, hole 470 can include aligned holes of each of a plurality of layers of insulating material 348. Hole 470 can be, for example, provided (e.g., cut) in insulating material 348. A diameter of hole 470 provided in insulating material 348 (e.g., or a diameter of aligned holes provided in a plurality of layers of insulating material 348) can be sized to correspond to a smallest diameter to accommodate passing or inserting sensor 455 through hole 470 (e.g., from an upper portion of insulating material 348 to a lower portion of insulating material 348 at which for example sensor housing 460 is disposed as illustrated in
Sensor 455 can be disposed in sensor housing 460. Sensor housing 460 can be formed from any suitable structural material such as, for example, material similar to structural material of components of closure 310 (e.g., member 365) for example as described herein. Sensor housing 460 can for example form a cavity or pocket in member 365 for receiving sensor 455. Sensor housing 460 can for example be a housing disposed in member 365 and/or an integral portion of member 365 configured to receive sensor 455. Sensor 455 can be positioned in such a way as to reliably read internal temperature of container 305 and transmit data of this reading, for example, as described herein. Sensor housing 460 can be configured to receive or hold sensor 455 in a substantially fixed position at a bottom portion of closing element 310. For example, sensor housing 460 can substantially prevent sensor 455 from moving into (e.g., dangling in) cavity 325. Sensor housing 460 can be configured to expose a tip portion 475 at a bottom surface of closing element 310, for example, as illustrated in
Returning to
One or more network components 490 may include a WAN such as, for example, described below regarding
System 300 may include one or more modules that may be partially or substantially entirely integrated with one or more components of system 300 such as, for example, controller 480, one or more network components 490, and/or any other suitable component of system 300. The one or more modules may be software modules as described for example below regarding
Controller 480 may control an operation of system 300. Some or substantially all components of controller 480 may be disposed in cavity 390. Also, for example, components of controller 480 may be disposed in cavity 390, disposed at other location of closure 310, and/or integrated into one or more network components 490. Controller 480 may be any suitable computing device for controlling an operation of components of system 300. Controller 480 may, for example, include components similar to the components described below regarding
Controller 480 may include an orientation device 495. Orientation device 495 may be an integral component of controller 480, a separate component disposed in cavity 390, or disposed at any other suitable location of closing element 310 or container 305. For example, orientation device 495 may be disposed at or in any suitable surface or wall member of closing element 310 or container 305. Orientation device 495 may communicate with controller 480 and/or one or more network components 490 by any suitable technique such as, for example, the communication techniques described herein. Orientation device 495 may be any suitable device for detecting a physical orientation of container 305. In at least some embodiments, orientation device 495 may be an accelerometer or a gyroscope. Orientation device 495 may sense, record, and transmit data of an actual orientation of container 305, including data of an amount of time that container 305 is subjected to each recorded orientation (e.g., when and an amount of time that container 305 is in an upright position and a dynamic position such as tipped over, at an angle, or upside down).
Controller 480, one or more network components 490, and/or the disclosed module may process and make calculations regarding a thermal performance based on sensed data collected and transferred from sensor 455 and/or orientation device 495. In at least some embodiments, the sensed data may be used to calculate (e.g., reliably calculate) an estimated performance of container 305 based on comparing disclosed orientation data to predetermined thresholds (e.g., qualification data of a given type of container 305 under various orientations and time durations). In at least some embodiments, orientation device 495 may be built into container 305 and/or closing element 310 and may record and report an orientation and duration of orientation of container 305 in real-time or near real-time to the disclosed module (e.g., a cloud-based application). Orientation device 495, controller 480, one or more network components 490, sensor 455, and/or the disclosed module may provide an alert to a user (e.g., to a user device) of system 300 when an orientation (e.g., or a temperature) of container 305 exceeds a predetermined threshold (e.g., exceeds a threshold). Orientation device 495 (e.g., and/or sensor 455), in conjunction with the disclosed cloud-based application, may similarly provide a user with data or information relating to the thermal performance of container 305. Also, based on predetermined (e.g., and/or sensed) data of the NVR of container 305 having closing element 310 in the installed position may allow a user to determine an expected performance of container 305 based on the sensed orientation and time duration data determined based on collection and/or processing of data of sensor 455 and/or orientation device 495.
Power source 485 may be any suitable power source for providing power to components of system 300 such as, for example, sensor 455 and orientation device 495. Power source 485 may be any suitable electrical power source, and/or any suitable rechargeable or non-rechargeable power source. For example, power source 485 may be a nickel-metal hydride battery, a lithium-ion battery, an ultracapacitor battery, a lead-acid battery, and/or a nickel cadmium battery.
The disclosed apparatus, system, and method may be used in any suitable application involving transporting materials having relatively low or relatively extremely low boiling points. For example, the disclosed apparatus, system, and method may be used in any suitable application for storing and/or transporting cryogenic materials such as cryogenic fluids. The disclosed apparatus, system, and method may also be used in any suitable application for transporting materials in which little or substantially no heat transfer to or from the transported material is desired.
An operation of the disclosed apparatus, system, and method will now be described. For example,
At step 515, sensor 455 and orientation device 495 may transmit data in real-time or near real-time for example by any suitable disclosed technique to the disclosed module (e.g., to controller 480 and/or network component 490).Data transmission can occur automatically as one or more networks over which to transmit data are available. During transmission of data, sensor 455 and orientation device 495 can continue to operate to sense data. Data can also be retained with the closing element 310 after transmission.
At step 520, the disclosed module (e.g., controller 480 and/or network component 490) may process and make calculations regarding a thermal performance based on sensed data collected and transferred from sensor 455 and/or orientation device 495. Continuous (e.g., or desired intervals of) data of the temperature of cavity 325 (e.g., of material 320) over time and the varying orientation of container 305 over time may be transferred, processed, and used in the disclosed calculations. In at least some embodiments, the sensed data may be used to calculate an estimated thermal performance of container 305 based on comparing disclosed orientation data to predetermined thresholds for example as described above. The disclosed module (e.g., controller 480 and/or network component 490), based on the sensed data and predetermined (e.g., and/or sensed) data of the NVR of container 305 having closure 310 in the installed position, may determine an expected performance of container 305. Any desired calculations may be made using the collected data.
At step 525, the disclosed module (e.g., controller 480 and/or network component 490) may determine whether or not to continue to sense data based on any suitable criteria such as, for example, a predetermined time, temperature, or other threshold, an algorithm, user input or commands (e.g., from an disclosed user device of one or more network components 490), an operation of controller 480 and/or network component 490, and/or any other suitable criteria. In an embodiment, data is sensed and collected periodically as determined by a user. If sensing is to continue, process 500 proceeds to step 510, and steps 510 through 525 may be repeated for as long as desired and for as many iterations as desired. If sensing is not to continue, process 500 may end at step 530.
Blanket layers of insulating material 348 can be beneficial to dispose communication path element 465 through insulating material 348. In some embodiments, communication path element 465 can be moved through hole 470 in layers of insulating material 348 by attaching communication path element 465 to sensor 455, if communication path element 465 is not already attached to sensor 455, and then pushing/pulling sensor 455 through one layer, or one set of layers, of insulating material 348 at a time, until communication path element 465 extends through all the layers of insulating material 348. As discussed above, insulating material 348, such as aerogel material, can be elastically deformable, such that hole 470 can be sized smaller than communication path element 465, hole 470 can expand around sensor 455 as sensor 455 moved through hole 470, and hole 470 can contract around communication path element 465 after sensor 455 exits hole 470.
Referring again to
An illustrative representation of a computing device appropriate for use with embodiments of the system of the present disclosure is shown in
Various examples of such general-purpose multi-unit computer networks suitable for embodiments of the disclosure, their typical configuration and many standardized communication links are well known to one skilled in the art, as explained in more detail and illustrated by
According to an embodiment of the present disclosure, data may be transferred to the system, stored by the system and/or transferred by the system to users of the system across local area networks (LANs) (e.g., office networks, home networks) or wide area networks (WANs) (e.g., the Internet). In accordance with the previous embodiment, the system may be comprised of numerous servers communicatively connected across one or more LANs and/or WANs. One of ordinary skill in the art would appreciate that there are numerous manners in which the system could be configured and embodiments of the present disclosure are contemplated for use with any configuration.
In general, the system and methods provided herein may be employed by a user of a computing device whether connected to a network or not. Similarly, some steps of the methods provided herein may be performed by components and modules of the system whether connected or not. While such components/modules are offline, and the data they generated will then be transmitted to the relevant other parts of the system once the offline component/module comes again online with the rest of the network (or a relevant part thereof). According to an embodiment of the present disclosure, some of the applications of the present disclosure may not be accessible when not connected to a network, however a user or a module/component of the system itself may be able to compose data offline from the remainder of the system that will be consumed by the system or its other components when the user/offline system component or module is later connected to the system network.
Referring to
Applications in the server 203 may retrieve and manipulate information in storage devices and exchange information through a WAN 201 (e.g., the Internet). Applications in server 203 may also be used to manipulate information stored remotely and process and analyze data stored remotely across a WAN 201 (e.g., the Internet).
According to an embodiment, as shown in
Components or modules of the system may connect to server 203 via WAN 201 or other network in numerous ways. For instance, a component or module may connect to the system i) through a computing device 212 directly connected to the WAN 201, ii) through a computing device 205, 206 connected to the WAN 201 through a routing device 204, iii) through a computing device 208, 209, 210 connected to a wireless access point 207 or iv) through a computing device 211 via a wireless connection (e.g., CDMA, GSM, 3G, 4G) to the WAN 201. One of ordinary skill in the art will appreciate that there are numerous ways that a component or module may connect to server 203 via WAN 201 or other network, and embodiments of the present disclosure are contemplated for use with any method for connecting to server 203 via WAN 201 or other network. Furthermore, server 203 could be comprised of a personal computing device, such as a smartphone, acting as a host for other computing devices to connect to.
The communications means of the system may be any means for communicating data, including text, binary data, image and video, over one or more networks or to one or more peripheral devices attached to the system, or to a system module or component.
Appropriate communications means may include, but are not limited to, wireless connections, wired connections, cellular connections, data port connections, Bluetooth® connections, near field communications (NFC) connections, or any combination thereof. One of ordinary skill in the art will appreciate that there are numerous communications means that may be utilized with embodiments of the present disclosure, and embodiments of the present disclosure are contemplated for use with any communications means.
The disclosed system may for example utilize collected to prepare and submit datasets and variables to cloud computing clusters and/or other analytical tools (e.g., predictive analytical tools) which may analyze such data using artificial intelligence neural networks. The disclosed system may for example include cloud computing clusters performing predictive analysis. For example, the disclosed system may utilize neural network-based artificial intelligence to predictively assess risk. For example, the neural network may include a plurality of input nodes that may be interconnected and/or networked with a plurality of additional and/or other processing nodes to determine a predicted result (e.g., a location as described for example herein).
For example, artificial intelligence processes may include filtering and processing datasets, processing to simplify datasets by statistically eliminating irrelevant, invariant or superfluous variables or creating new variables which are an amalgamation of a set of underlying variables, and/or processing for splitting datasets into train, test and validate datasets using at least a stratified sampling technique. For example, the prediction algorithms and approach may include regression models, tree-based approaches, logistic regression, Bayesian methods, deep-learning and neural networks both as a stand-alone and on an ensemble basis, and final prediction may be based on the model/structure which delivers the highest degree of accuracy and stability as judged by implementation against the test and validate datasets. Also, for example, artificial intelligence processes may include processing for training a machine learning model to make predictions based on data collected by the disclosed sensors.
Traditionally, a computer program includes a finite sequence of computational instructions or program instructions. It will be appreciated that a programmable apparatus or computing device can receive such a computer program and, by processing the computational instructions thereof, produce a technical effect.
A programmable apparatus or computing device includes one or more microprocessors, microcontrollers, embedded microcontrollers, programmable digital signal processors, programmable devices, programmable gate arrays, programmable array logic, memory devices, application specific integrated circuits, or the like, which can be suitably employed or configured to process computer program instructions, execute computer logic, store computer data, and so on. Throughout this disclosure and elsewhere a computing device can include any and all suitable combinations of at least one general purpose computer, special-purpose computer, programmable data processing apparatus, processor, processor architecture, and so on. It will be understood that a computing device can include a computer-readable storage medium and that this medium may be internal or external, removable and replaceable, or fixed. It will also be understood that a computing device can include a Basic Input/Output System (BIOS), firmware, an operating system, a database, or the like that can include, interface with, or support the software and hardware described herein.
Embodiments of the system as described herein are not limited to applications involving conventional computer programs or programmable apparatuses that run them. It is contemplated, for example, that embodiments of the disclosure as claimed herein could include an optical computer, quantum computer, analog computer, or the like.
Regardless of the type of computer program or computing device involved, a computer program can be loaded onto a computing device to produce a particular machine that can perform any and all of the depicted functions. This particular machine (or networked configuration thereof) provides a technique for carrying out any and all of the depicted functions.
Any combination of one or more computer readable medium(s) may be utilized. The computer readable medium may be a computer readable signal medium or a computer readable storage medium. A computer readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing. Illustrative examples of the computer readable storage medium may include the following: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or Flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing. In the context of this document, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device.
A data store may be comprised of one or more of a database, file storage system, relational data storage system or any other data system or structure configured to store data. The data store may be a relational database, working in conjunction with a relational database management system (RDBMS) for receiving, processing and storing data. A data store may comprise one or more databases for storing information related to the processing of moving information and estimate information as well one or more databases configured for storage and retrieval of moving information and estimate information.
Computer program instructions can be stored in a computer-readable memory capable of directing a computer or other programmable data processing apparatus to function in a particular manner The instructions stored in the computer-readable memory constitute an article of manufacture including computer-readable instructions for implementing any and all of the depicted functions.
A computer readable signal medium may include a propagated data signal with computer readable program code embodied therein, for example, in baseband or as part of a carrier wave. Such a propagated signal may take any of a variety of forms, including, but not limited to, electro-magnetic, optical, or any suitable combination thereof. A computer readable signal medium may be any computer readable medium that is not a computer readable storage medium and that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device.
Program code embodied on a computer readable medium may be transmitted using any appropriate medium, including but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.
The elements depicted in flowchart illustrations and block diagrams throughout the figures imply logical boundaries between the elements. However, according to software or hardware engineering practices, the depicted elements and the functions thereof may be implemented as parts of a monolithic software structure, as standalone software components or modules, or as components or modules that employ external routines, code, services, and so forth, or any combination of these. All such implementations are within the scope of the present disclosure. In view of the foregoing, it will be appreciated that elements of the block diagrams and flowchart illustrations support combinations of means for performing the specified functions, combinations of steps for performing the specified functions, program instruction technique for performing the specified functions, and so on.
It will be appreciated that computer program instructions may include computer executable code. A variety of languages for expressing computer program instructions are possible, including without limitation Kotlin, Swift, C#, PHP, C, C++, Assembler, Java, HTML, JavaScript, CSS, and so on. Such languages may include assembly languages, hardware description languages, database programming languages, functional programming languages, imperative programming languages, and so on. In some embodiments, computer program instructions can be stored, compiled, or interpreted to run on a computing device, a programmable data processing apparatus, a heterogeneous combination of processors or processor architectures, and so on. Without limitation, embodiments of the system as described herein can take the form of mobile applications, firmware for monitoring devices, web-based computer software, and so on, which includes client/server software, software-as-a-service, peer-to-peer software, or the like.
In some embodiments, a computing device enables execution of computer program instructions including multiple programs or threads. The multiple programs or threads may be processed more or less simultaneously to enhance utilization of the processor and to facilitate substantially simultaneous functions. By way of implementation, any and all methods, program codes, program instructions, and the like described herein may be implemented in one or more thread. The thread can spawn other threads, which can themselves have assigned priorities associated with them. In some embodiments, a computing device can process these threads based on priority or any other order based on instructions provided in the program code.
Unless explicitly stated or otherwise clear from the context, the verbs “process” and “execute” are used interchangeably to indicate execute, process, interpret, compile, assemble, link, load, any and all combinations of the foregoing, or the like. Therefore, embodiments that process computer program instructions, computer-executable code, or the like can suitably act upon the instructions or code in any and all of the ways just described.
The functions and operations presented herein are not inherently related to any particular computing device or other apparatus. Various general-purpose systems may also be used with programs in accordance with the teachings herein, or it may prove convenient to construct more specialized apparatus to perform the required method steps. The required structure for a variety of these systems will be apparent to those of ordinary skill in the art, along with equivalent variations. In addition, embodiments of the disclosure are not described with reference to any particular programming language. It is appreciated that a variety of programming languages may be used to implement the present teachings as described herein, and any references to specific languages are provided for disclosure of enablement and best mode of embodiments of the disclosure. Embodiments of the disclosure are well suited to a wide variety of computer network systems over numerous topologies. Within this field, the configuration and management of large networks include storage devices and computing devices that are communicatively coupled to dissimilar computing and storage devices over a network, such as the Internet, also referred to as “web” or “world wide web”.
Throughout this disclosure and elsewhere, block diagrams and flowchart illustrations depict methods, apparatuses (e.g., systems), and computer program products. Each element of the block diagrams and flowchart illustrations, as well as each respective combination of elements in the block diagrams and flowchart illustrations, illustrates a function of the methods, apparatuses, and computer program products. Any and all such functions (“depicted functions”) can be implemented by computer program instructions; by special-purpose, hardware-based computer systems; by combinations of special purpose hardware and computer instructions; by combinations of general purpose hardware and computer instructions; and so on—any and all of which may be generally referred to herein as a “component”, “module,” or “system.”
While the foregoing drawings and description set forth functional aspects of the disclosed systems, no particular arrangement of software for implementing these functional aspects should be inferred from these descriptions unless explicitly stated or otherwise clear from the context.
Each element in flowchart illustrations may depict a step, or group of steps, of a computer-implemented method. Further, each step may contain one or more sub-steps. For the purpose of illustration, these steps (as well as any and all other steps identified and described above) are presented in order. It will be understood that an embodiment can contain an alternate order of the steps adapted to a particular application of a technique disclosed herein. All such variations and modifications are intended to fall within the scope of this disclosure. The depiction and description of steps in any particular order is not intended to exclude embodiments having the steps in a different order, unless required by a particular application, explicitly stated, or otherwise clear from the context.
The functions, systems and methods herein described could be utilized and presented in a multitude of languages. Individual systems may be presented in one or more languages and the language may be changed with ease at any point in the process or methods described above. One of ordinary skill in the art would appreciate that there are numerous languages the system could be provided in, and embodiments of the present disclosure are contemplated for use with any language.
