Claims
- 1. A method of expanding electronics associated with a cryopump comprising:providing a cryopump having a first electronic module integrally mounted thereto; and removably mounting a second electronic module to an exterior side surface of a housing of the first electronic module.
- 2. A method as claimed in claim 1 wherein the second electronic module is connectable to each of three sides of the first electronic module.
- 3. A method as claimed in claim 1 wherein plural second electronic modules are connected to plural side surfaces of the first electronic module.
- 4. A method as claimed in claim 1 further comprising stacking an additional electronic module onto the second electronic module.
- 5. A method as claimed in claim 1 further comprising providing a module cap coupled to an end of the second electronic module to shield electrical connections between the first and second electronic modules.
- 6. A method as claimed in claim 5 further comprising covering a base portion of the cryopump with a base cover, the module cap being coupled to the base cover and connections between the first and second electronic modules extending through the module cap and base cover.
- 7. A method as claimed in claim 1 further comprising mounting the second electronic module to the first electronic module with clips at each end thereof.
- 8. A method as claimed in claim 7 wherein the clips are mounted to complementary slots on each of the electronic modules.
- 9. A method as claimed in claim 1 further comprising providing heat transfer ribs on the surface of the first electronic module.
- 10. A method as claimed in claim 1 further comprising supporting printed circuit boards within slots in the second electronic module.
RELATED APPLICATIONS
This application is a Divisional of U.S. application Ser. No. 09/438,736 filed Nov. 11, 1999 now U.S. Pat. No. 6,318,091, which claims the benefit of U.S. Provisional Application No. 60/161,982 filed Oct. 28, 1999, the entire teachings of which are incorporated herein by reference.
US Referenced Citations (6)
Foreign Referenced Citations (3)
Number |
Date |
Country |
0 592 212 |
Apr 1994 |
EP |
0 809 164 |
Nov 1997 |
EP |
2 139 006 |
Oct 1984 |
GB |
Non-Patent Literature Citations (1)
Entry |
2 photographs of On-Board GLE product shown at Semicon West show, Jul. 1998. |
Provisional Applications (1)
|
Number |
Date |
Country |
|
60/161982 |
Oct 1999 |
US |