Patent Application
20240427032
The present application claims priority under 35 U.S.C. § 119 to European Patent Application No. 23180925.2, filed Jun. 22, 2023, the entire contents of which is incorporated herein by reference.
One or more embodiments of the present invention relates to a CT detector module and/or to a CT device.
Modern computed tomography (CT) devices have a gantry with a rotatable frame on which, inter alia, the X-ray source and a detector module for capturing the X-ray radiation are arranged. As a rule, a CT detector module of this kind comprises an X-ray converter element, which has an X-ray sensor layer and optionally a layer arranged underneath with A/D (analog-to-digital) converters. In recent times, electronic integration was an important trend in X-ray converter elements. The aim here was to reduce the length of the analog path between the analog X-ray sensor layer and the A/D converters which are conventionally realized as ASICs (Application-Specific Integrated Circuit). In the case of integrating X-ray converters, the analog X-ray sensor layer is formed by a suitable sensor layer, for example a scintillator, in combination with a photodiode, while in the case of (counting) X-ray converters, a direct-converting semiconductor sensor is used. An A/D converter embodied as an ASIC then generates the digital output signal. In both cases, integration of the ASICs in a compact construction, in particular stack formation, together with the analog X-ray sensor layer, brings a significant heat source closer to the X-ray sensor elements of the X-ray sensor layer itself.
Since the X-ray sensor elements react very sensitively to fluctuations in heat, heat management is a critical task in the development of a modern CT detector module. Particular challenges of heat management are keeping the operating temperature of the CT detector module stable, avoiding temperature gradients between the adjacent X-ray converter elements and also reducing the temperature gradients inside each X-ray converter elements. These challenges are even more important in the case of counting X-ray converters since the direct-converting semiconductor sensors are additional heat sources and their sensor performance simultaneously reacts very sensitively to thermal changes.
Heat management is currently guaranteed in that a thermal interface between the X-ray converter element and the metal frame of the CT detector module is produced by a heat-conducting adhesive or a heat-conducting paste. Consequently, however, it is not possible to transport a defined quantity of heat since the quality of the thermal interface depends on different factors which cannot be effectively influenced, in particular the thickness of the gap between the X-ray converter and the metal frame, as well as the accurate distribution of the heat-conducting paste.
It is an object of one or more embodiments of the present invention to provide a CT detector module in which the heat energy can be dissipated as effectively as possible from the X-ray converter element, in particular into a module carrier. It is a further object of one or more embodiments of the present invention to provide a CT detector module in which the temperature gradients inside an X-ray converter element as well as between adjacent X-ray converter elements is reduced compared to the prior art.
One or more embodiments of the present invention achieve at least this object with a CT detector module and a CT device as claimed.
One or more embodiments of the present invention provide a CT detector module which comprises at least one X-ray converter element which has an upper side and a lower side, wherein at its upper side the X-ray converter element has an X-ray detector layer and at its lower side is secured to a heat-conducting module carrier. The X-ray converter element is in heat-conducting contact with at least one metal element, and the at least one metal element is in heat-conducting contact with the module carrier.
In the inventive CT detector module the thermal contact between the X-ray converter element and the module carrier is therefore produced by metal-to-metal contacts which therefore have high heat conductivity. The metal-to-metal contact is produced between the X-ray converter element and an intermediate element made of metal, the metal element, and, further, between this metal element and the module carrier. The module carrier can be, in particular, a metal frame with convection cooler elements, such as cooling ribs. Use of the at least one metal element makes it possible to accurately define the thermal interface between the X-ray converter element and the module carrier since the metallic contact points can accurately fixed. The metal-to-metal heat-conducting contacts are preferably embodied without gaps in order to achieve optimally high heat conduction. The metal-to-metal contacts can be produced after the CT detector module has been secured, for example glued, in particular with UV adhesive, to the module carrier with the required accuracy. In many cases it is possible to improve the thermal contact further by, for example, heat-conducting pastes or pads or adhesives or solder materials in order to increase the thermal contact.
According to one embodiment, the metal element is not a solder. In particular, the metal element is a dimensionally stable element which can assume the form, for example, of a spring, a sheet, a pin, a screw, a spring element or the like.
In advantageous embodiments of the present invention the heat from each X-ray converter element is dissipated not just at one location but at a plurality of locations of the lower side and/or in a planar manner. Here, “planar” is intended to mean that the contact does not just take place point-wise but over a larger area of the lower side of the X-ray converter element, for example over an area of 10%-90%, preferably 20%-80%, more preferably 30%-60% of the lower side of the X-ray converter element.
On its upper side the X-ray converter element has an X-ray detector layer. This faces the X-ray source and is configured to detect the X-rays. The X-ray detector layer can comprise a direct-converting (semiconductor) X-ray sensor layer, for example having CdTe, CdZnTe, CdTeSe, CdZnTeSe, CdMnTe, GaAs, Si or Ge as the semiconductor material. The X-ray detector layer can also comprise a suitable sensor layer which converts X-ray radiation into light, and optically coupled photodiodes, in particular one or more photodiode array(s). Scintillator material, for example GOS (Gd2O2S), CsJ, YGO or LuTAG, is frequently used as the material. The X-ray detector layer can also comprise a layer with analog-to-digital converters to which the X-ray sensor layer is applied, it being possible for the A/D converter layer to be realized in one or more ASIC(s). The X-ray detector layer can be applied to a base plate, also called a substrate, for example a printed circuit board or a ceramic or glass substrate, which then forms the lower side of the X-ray converter element. The X-ray converter element is secured at its lower side to a heat-conducting module carrier.
The module carrier is made, in particular, of metal, for example diecast aluminum. The module carrier can be embodied for mechanical fixing of a respective detector module in a CT device comprising the detector module. For this, appropriate fixing mechanism, device and/or means and aligning mechanism, device and/or means can be provided on the module carrier. The module carrier is preferably embodied as a metallic heat sink which is embodied for the temperature stabilization of the detector module and the removal of heat from the X-ray converter element. For example, the module carrier can be fitted with suitable cooling ribs. The CT detector module is typically part of a rotating gantry of a CT device.
The X-ray converter element can be secured to the module carrier by way of an adhesive, for example a UV adhesive, with other securing means, such as screws, also being possible. A plurality of X-ray converter elements can also be secured to the module carrier so it is thereby “tiled” by the side-by-side mounting of the X-ray converter elements.
One or more embodiments of the present are also wherein heat generated in the X-ray converter element and, in particular, in the X-ray detector layer is efficiently dissipated into the module carrier via a new metal element.
According to a preferred embodiment, the lower side of the X-ray converter element, which is in heat-conducting contact with the at least one metal element, is at least partially provided with a metallic covering. It is consequently possible to improve the heat conduction onto the module carrier and optionally produce large-area contact with the metal element, whereby the heat conduction onto the module carrier is improved still further. The metallic covering can be formed, for example, by a coating with a metal with good heat conduction, for example gold, silver or copper. The metallic covering can be what is known as a “metallized thermal pad”, a metallized heat-conducting pad. The heat-conducting covering can cover some or also all of the lower side of the X-ray converter element, in particular it is provided at the location at which the metal element abuts the X-ray converter element. The metallic covering can be connected by metallized through-holes in a base plate and/or the A/D converter layer of the X-ray detector layer to the A/D converter layer and/or the X-ray sensor layer so the heat can be dissipated from there the into the metallic covering. This is also referred to as thermal via technology. The metallized through-holes can be, for example, contact holes in the base plate.
According to one embodiment, the at least one metal element has a planar metal element, in particular metal sheet, which in a first region abuts the lower side of the X-ray converter element and in a second region abuts the module carrier. The embodiment as a planar metal element is favorable during production and guarantees excellent heat conduction, in particular if at planar regions on its upper and/or lower side(s) the metal sheet abuts elements to be connected. The planar metal element can have, for example, two legs, of which the one leg abuts the lower side of the X-ray converter element and the other leg abuts the module carrier, it being possible for the two legs to form, for example, an angle of about 90°. The metal sheet can therefore be L-shaped or T-shaped in cross-section. The metal element can also have a profile element which can likewise have two legs. The second leg can be arranged in a recess of the module carrier and optionally be secured there, for example by a securing element such as a screw. The recess can be, for example, a gap into which the second leg of the metal element is inserted. In another embodiment the metal element, in particular metal sheet, forms a disc which is inserted between the lower side of the X-ray converter element and the upper side of the module carrier and thus contact with its upper side is in heat-conducting contact with the X-ray converter element and with its lower side, with the module carrier. A securing mechanism, device and/or means or spring elements can be provided in this embodiment too, and these ensure that contact is established. A metal sheet of this kind can also be just one of a plurality of heat-conducting metal elements, in particular the securing device can also be made of metal and thus form part of the heat bridge.
According to one embodiment, the at least one metal element has a spring element which is pressed on the lower side of the X-ray converter element by a restoring force. The spring element can be formed from a metal sheet and have the properties which were described above. For example, an L-shaped, pre-bent metal sheet with prestress can be arranged between the X-ray converter element and the module carrier such that it presses against the lower side of the X-ray converter element. The embodiment in which the metal element has a metal sheet or a spring element are particularly advantageously combined with the embodiment in which the lower side of the X-ray converter element is provided at least partially with a metallic covering. The part provided with the covering can constitute, for example, 20%-80%, preferably 40%-60%, of the lower side of the X-ray converter element.
The spring element can be used as an insert in the module carrier, in particular in a recess of the carrier. When assembling the CT detector module, the X-ray converter element can be glued to the module carrier in a first step, preferably with optimum positional accuracy. A fast-curing adhesive, such as UV adhesive, can be used in this case. Preferably, the spring element or metal sheet is already inserted in the module carrier on gluing, although in certain embodiments it can also be inserted from the side after the gluing process.
The metal-to-metal surface contact can be increased in that the respectively abutting regions are pressed against each other, in particular by a securing element or an element with a restoring force, for example a spring. For example, a screw, for example a grub screw, can be screwed into a hole in a module carrier, which screw extends up to the second region of the metal sheet or the spring element. This region can consequently be pressed onto the module carrier. Furthermore, heat conduction also takes place through the screw itself. Similarly, a further hole can also extend up to the first region of the metal element. A grub screw inserted through this hole can press against the first region of the metal element at the lower side of the X-ray converter element.
Alternatively, at its planar contact regions, at which it should have contact with the lower side of the X-ray converter elements and the module carrier, it is also possible to thermally connect the metal element by way of any desired securing device to these contact regions. The securing device can be, for example, screws, rivets, plunger springs, a solder or also reactive solder. Reactive solder is taken to mean a method in which on the surfaces to be connected, a multi-layer system which, as a rule, is composed of two different metals which are alternately coated one above the other, for example nickel/aluminum, Al/Ti, or Cu/Ag. The heat required for melting the solder is released by a self-propagating exothermic reaction of the multi-layer system. As a rule, the reaction is ignited by an energy pulse, for example by high temperature, mechanical pressure, an electrical spark or laser pulse. In one or more embodiments of the present invention it is therefore possible to apply appropriate reactive solder layers to the regions of the metal element at which it abuts the X-ray converter element and the module carrier. If the CT detector module is put together such that the X-ray converter elements are glued to the module carrier at the provided position, the reaction can be ignited and thus a close metallic connection produced between the metal element and the X-ray converter element as well as the module carrier. The metallic covering on the lower side of the X-ray converter element proves to be advantageous in this embodiment too. Alternatively, the reactive solder can also be ignited as early as before assembly of the X-ray converter elements.
According to one embodiment, the at least one metal element is secured to the module carrier by a securing means. Preferably, the securing device is made of metal and thus likewise forms part of the heat bridge or the metal element. The securing device can be, in particular, a screw, rivet, clamp, a pin or a plunger spring, a solder or also a reactive solder. Preferably, the securing device is a screw which is inserted in a hole in the module carrier and presses against the metal element or the metal element presses against part of the module carrier in order to secure it. In particular, the securing device can be metal screws, for example grub screws.
According to one embodiment, the at least one metal element comprises at least one securing element which is fixed to the module carrier and is prestressed against a metallic covering on the lower side of the X-ray converter elements or against a planar metal element arranged at the lower side of the X-ray converter elements. In this embodiment it is possible for the securing elements to constitute the main heat conductors. The securing elements can be embodied as described above, i.e. as a screw, rivet, clamp, pin or plunger spring. In one embodiment, the securing elements are screws which are screwed into corresponding threaded holes in the module carrier. In particular, these can be holes which extend from below and through the module carrier up to the lower side of the X-ray converter element. The holes can be, for example, perpendicular to the lower side of the X-ray converter element. When metal screws are screwed into these holes, they can extend to the lower side of the X-ray converter element and thus produce thermal contact. When producing the CT detector module, the X-ray converter element can be glued to the module carrier in a first step. Preferably, a metallic covering, which is connected to the heat sources, in particular the X-ray detector layer, preferably by thermal via technology, is located on the lower side of the X-ray converter element. The inserted metal screws or also screws with metallic plunger springs then act as heat-conducting components between the lower side of the X-ray converter element and the module carrier. Metal-to-metal surface contacts can be achieved in that the screws are prestressed against the lower side of the X-ray converter element, in particular against the metallic covering.
According to one embodiment, the at least one metal element is inserted in a recess in the module carrier or is secured to a side wall of the module carrier. The side wall is, in particular, a wall which is at least substantially perpendicular to the upper and lower sides of the X-ray converter element. The recess can accommodate, in particular, a planar metal element, such as a metal sheet. For example, a metal element in the form of a metal block can be secured at one side wall of the module carrier, for example by way of a securing device such as a screw, and this metal block, likewise from below, can rest against the lower side of the X-ray converter element or press against it. The X-ray converter element can in turn be glued to the module carrier in a first step in this connection. The lower side of the X-ray converter element can have a metallic covering which can be connected to the heat sources by thermal via technology. A metal element, which is embodied, for example, as a metal insert or a metal block, can thermally connect the lower side of the X-ray converter element to the module carrier. The metal-to-metal contact is produced in that the metal insert is pressed against the lower side of the X-ray converter element and the metal element is then clamped in this position in the module carrier, for example by a securing device such as a screw. Alternatively, other connecting technologies can also be used in order to keep the metal block in its final position.
According to one embodiment, the at least one metal element is inserted in a recess in the module carrier or secured to a side wall of the module carrier. Particularly high heat conduction is possible because the metal element is inserted in a recess or abuts the side wall. The side wall of the module carrier can be a wall which runs perpendicular to the lower side of the X-ray converter element. The metal element can be presented, for example, as a cuboid so with two adjacent sides it has contact both with the lower side of the X-ray converter element and the module carrier. The recess can be a slit in which a planar metal element is inserted, for example a leg of a metal sheet.
According to one embodiment, the at least one metal element has a reactive solder which heat-conductively connects the lower side of the X-ray converter element to the module carrier. It is possible for the reactive solder to form the metal element. It is also possible, however, for the reactive solder to be used in addition to a planar metal element, for example a metal sheet, which is inserted between the X-ray converter element and the module carrier. In the first-mentioned embodiment the heat-conducting paste is replaced by the soldering technology. Alternatively, a normal solder can be used instead of the reactive solder, and this heat-conductively connects the lower side of the X-ray converter element to the module carrier.
In this embodiment the metallic interface can be realized in that a localized, selective soldering process is carried out which connects the lower side of the X-ray converter element and, if present, a metallic covering arranged there, to the metal surface of the module carrier. In this embodiment the entire X-ray converter element can be glued in a first step, again with high positional accuracy, to the module carrier. Preferably one or more location(s) is/are provided with a metallic covering on the lower side of the X-ray converter element, and these locations can preferably be connected to the heat sources by way of thermal via technology. A selective soldering process can be implemented by device of a reactive solder. When the reactive solder is ignited, a solder joint is directly implemented as a heat-conducting element between the lower side of the X-ray converter element and the module carrier. The igniting of the reactive solder can be triggered by the known ignition technologies, such as laser or heating (for example by way of sparks or flames). Alternatively, a normal solder can be used instead of the reactive solder, and this is introduced either after gluing into the gap between the lower side of the X-ray converter element or the metallic covering arranged there and the upper side of the module carrier. Alternatively, the normal solder can also be inserted into this gap as early as before the gluing step and then merely be heated by way of conventional heating technology, such as lasers or (less preferred) flames in order to produce the metallic connection.
According to one embodiment, at its lower side the X-ray converter element has a base plate which has a recess through which the at least one metal element is in direct heat-conducting contact with the X-ray detector layer. In this embodiment the base plate of the X-ray converter element has a continuous recess, in particular in the center. It can be, for example, a rectangular, round or oval recess which allows the edge elements to be upright. In particular, the recess is embodied as a through-hole so the metal element can be led directly through the recess up to the lower side of the X-ray detector layer. The heat can be removed even more efficiently in this way. The metal element can be embodied as described herein, i.e. for example as a spring element, a metal sheet, metal block, screw, etc. The lower side of the X-ray detector layer is preferably at least partially provided with a metallic covering, for example in the form of a coating or a metallized thermal pad, which can in turn be connected to the X-ray detector layer or the X-ray sensor layer by way of metallized through-holes. The metal element thereby acts as a heat bridge between the X-ray detector layer and the module carrier. The connection between the metal element and the lower side of the X-ray detector layer can be produced, in particular, in the manner described here in respect of the other embodiments. For example, screws can press the metal surfaces against each other. Alternatively, connecting technologies such as reactive soldering can be used in advance or as a final step.
According to one embodiment, at its lower side the X-ray converter element has a base plate, wherein the base plate has, at least in the region in which it is in heat-conducting contact with the at least one metal element, heat bridges between the lower side of the base plate and the X-ray detector layer. The heat bridges can be, for example, metallized through-holes which ensure that the heat flow between the X-ray detector layer and the module carrier is improved. The heat bridges can also be formed by additional metal layers.
One or more embodiments of the present provide a robust and highly efficient heat management concept for the integration of X-ray converter elements in CT detector modules in that consistently gap-free metal-to-metal contacts are used. The heat conductivity is therefore significantly improved with respect to the known solutions with thermal cases or thermal adhesives. The thermal resistance is reduced because gaps are avoided between the individual elements of the CT detector module or these gaps are bridged by the metal element. Improved temperature homogeneity over the entire CT detector module can consequently be achieved with a simultaneously reduced temperature. The signal power and stability is thus improved.
According to one embodiment, at its lower side the X-ray converter element has a base plate which has plated through-holes which form heat bridges between the lower side of the base plate and the X-ray detector layer. The heat conduction is consequently further improved.
According to one embodiment, the module carrier has cooling ribs. This is expedient in order to dissipate the heat introduced into the module carrier to the surrounding air. The temperature of the CT detector module is thus further reduced.
One or more embodiments of the present are also directed toward a CT device which has at least one of the inventive CT detector modules, in particular a plurality of CT detector modules 1 mounted side-by-side along a direction of rotation. All embodiments and advantages cited in respect of the CT detector module are also applicable to the CT device, and vice versa. The CT detector module is, in particular, part of a rotating gantry of the CT device. The CT device can have further conventional components, such as an X-ray source, a patient couch, etc.
The present invention will now be explained in more detail on the basis of exemplary embodiments with reference to the accompanying drawings.
In the drawings:
Identical parts are indicated by identical reference numerals in the figures.
The following images each show a schematic cross-section through a CT detector module 2, and, more precisely, on the left side a section in the longitudinal direction and on the right side a section in the transverse direction. The upper side of the detector module designated by O in the following figures is the side which faces the examination space 5, the lower side designated by U faces away from it. On the left side
The aim of one or more embodiments of the present invention is to improve the heat bond between the X-ray converter elements 6 and the module carrier 4. This occurs, in particular, by way of an increase and better adjustability of the heat transport via the adhesive gap 11 between the X-ray converter element 6 and the module carrier 4.
In this embodiment the X-ray converter elements 6 can initially be glued to the module carrier 4 with adhesive 30. Preferably, a metallic covering 14 is present at the lower side of the substrate 10 in this embodiment too, at least at the positions of the threaded hole 19. After gluing and curing, grub screws 18 or also screws with metallic plunger springs are inserted in the holes 19 and then act as heat-conducting elements between the lower side of the substrate 10 and the module carrier 4. Metal-to-metal contact is produced in the process by pressing the securing device 18 against the metallic covering 14. In variants a further planar metal element can also be inserted as part of the metal-to-metal contact between the lower side of the X-ray converter element 6 and the upper side of the module carrier 4 and with its upper side is thus in heat-conducting contact with the X-ray converter element 6 and with its lower side with the module carrier 4. The securing device 18 then ensure by way of pressing that the contact is produced and effective heat transport into the module carrier is guaranteed.
The heat can consequently be removed even more efficiently since the metal element 12 can absorb it closer to the heat sources. The substrate 10 then has an annular construction. The metal element 12 can be embodied in a manner similar to that in the embodiment of
Independent of the grammatical term usage, individuals with male, female or other gender identities are included within the term.
The drawings are to be regarded as being schematic representations and elements illustrated in the drawings are not necessarily shown to scale. Rather, the various elements are represented such that their function and general purpose become apparent to a person skilled in the art. Any connection or coupling between functional blocks, devices, components, or other physical or functional units shown in the drawings or described herein may also be implemented by an indirect connection or coupling. A coupling between components may also be established over a wireless connection. Functional blocks may be implemented in hardware, firmware, software, or a combination thereof.
It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, components, regions, layers, and/or sections, these elements, components, regions, layers, and/or sections, should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of embodiments. As used herein, the term “and/or,” includes any and all combinations of one or more of the associated listed items. The phrase “at least one of” has the same meaning as “and/or”.
Spatially relative terms, such as “beneath,” “below,” “lower,” “under,” “above,” “upper,” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below,” “beneath,” or “under,” other elements or features would then be oriented “above” the other elements or features. Thus, the example terms “below” and “under” may encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. In addition, when an element is referred to as being “between” two elements, the element may be the only element between the two elements, or one or more other intervening elements may be present.
Spatial and functional relationships between elements (for example, between modules) are described using various terms, including “on,” “connected,” “engaged,” “interfaced,” and “coupled.” Unless explicitly described as being “direct,” when a relationship between first and second elements is described in the disclosure, that relationship encompasses a direct relationship where no other intervening elements are present between the first and second elements, and also an indirect relationship where one or more intervening elements are present (either spatially or functionally) between the first and second elements. In contrast, when an element is referred to as being “directly” connected, engaged, interfaced, or coupled to another element, there are no intervening elements present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g., “between,” versus “directly between,” “adjacent,” versus “directly adjacent,” etc.).
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the embodiments. As used herein, the singular forms “a,” “an,” and “the,” are intended to include the plural forms as well, unless the context clearly indicates otherwise. As used herein, the terms “and/or” and “at least one of” include any and all combinations of one or more of the associated listed items. It will be further understood that the terms “comprises,” “comprising,” “includes,” and/or “including,” when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items. Expressions such as “at least one of,” when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list. Also, the term “example” is intended to refer to an example or illustration.
It should also be noted that in some alternative implementations, the functions/acts noted may occur out of the order noted in the figures. For example, two figures shown in succession may in fact be executed substantially concurrently or may sometimes be executed in the reverse order, depending upon the functionality/acts involved.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which embodiments belong. It will be further understood that terms, e.g., those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
It is noted that some embodiments may be described with reference to acts and symbolic representations of operations (e.g., in the form of flow charts, flow diagrams, data flow diagrams, structure diagrams, block diagrams, etc.) that may be implemented in conjunction with units and/or devices discussed above. Although discussed in a particularly manner, a function or operation specified in a specific block may be performed differently from the flow specified in a flowchart, flow diagram, etc. For example, functions or operations illustrated as being performed serially in two consecutive blocks may actually be performed simultaneously, or in some cases be performed in reverse order. Although the flowcharts describe the operations as sequential processes, many of the operations may be performed in parallel, concurrently or simultaneously. In addition, the order of operations may be re-arranged. The processes may be terminated when their operations are completed, but may also have additional steps not included in the figure. The processes may correspond to methods, functions, procedures, subroutines, subprograms, etc.
Specific structural and functional details disclosed herein are merely representative for purposes of describing embodiments. The present invention may, however, be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
| Number | Date | Country | Kind |
|---|---|---|---|
| 23180925.2 | Jun 2023 | EP | regional |
