Chemical Abstracts, 193004r, p. 9, vol. 118 (1993) for Japanese Patent Publication No. 04,261,461, published Sep. 17, 1992. |
English Language Derwent Abstract for European Patent Application No. 0,179,355. |
Dr. John K. Bard; Silicon-Carbon Resins to Boost PWB Use; Jun. 1992 pp. 45-46; p. 48. |
Drs. John K. Bard & Richard L. Brady; A New Moisture Resistant Liquid Encapsulant; 1992; pp. 1018-1022. |
J. K. Bard, R. L. Brady & J. M. Schwark; Processing and Properties of Silicon-Carbon Liquid Encapsulants. |
Drs. John K. Bard & Richard L. Brady; A New Moisture-Resistant Liquid Encapsulant; May 1992; pp. 1-5. |
Drs. John K. Bard & Julia S. Burnier; I. New Low Dielectric Constant, Moisture Resistant Resin Technology For High Speed/High Frequency Circuit Board Applications. |
Drs. John K. Bard & Julia S. Burnier; II. New High Speed/High Frequency Circuit Board Applications. |
Polyclad Laminates, Inc.; PCL-511; Laminates and Prepregs for High Speed Digital Applications. |
Research Disclosure; Phosphorus Based Catalyst Retardants For Silicon-Carbon Resin Systems; Jun. 1991. |
Research Disclosure; Organosilicon Composition Containing Hydrocarbon Elastomer; Oct. 1991; pp. 799-800. |
Research Disclosure; Liquid Encapsulants, Flip Chip Encapsulants and Die Attach Adhesives; Mar. 1992; pp. 184-187. |
Research Disclosure; Platinum(II) Complexes As Catalysts For Silicon-Carbon Resin Systems; May 1992; pp. 355-357. |
Research Disclosure; Transfer Molding Compounds for Encapsulation; Sep. 1992 pp. 707-709. |