Claims
- 1. A molding composition for producing fiber-reinforced thermoset composites which comprises:
- (1) a curable resin portion containing:
- (a) from about 25 to about 60 weight percent of a poly(acrylate) characterized by the following empirical formula: ##STR7## wherein R is the hydroxy-free residue of an organic polyhydric alcohol which contained alcoholic hydroxyl groups bonded to different carbon atoms, R.sub.1 and R.sub.2 are independently hydrogen or methyl, and n is 1 to 3,
- (b) from about 5 to about 30 weight percent of acrylic or methacrylic acid or a functionalized derivative thereof having a molecular weight of less than 300 and the following empirical formula ##STR8## wherein R.sub.3 is independently hydrogen or methyl; X and Y are independently -O- or ##STR9## wherein R.sub.6 is hydrogen or lower alkyl; R.sub.4 is an aliphatic or aromatic radical containing from 2 to about 10 carbon atoms, optionally containing -O- or ##STR10## R.sub.5 is hydrogen or an aliphatic or aromatic radical containing from 1 to 10 carbon atoms; and b is an integer from 1 to 3, and
- (c) from about 25 to about 65 weight percent of styrene;
- (2) a curing initiator; and
- (3) one or more reinforcing fibers with a melting point or a glass transition temperature above about 130.degree. C.
- 2. A molding composition as defined in claim 1, wherein poly(acrylate) component (a) of the curable resin portion is one or more of the following: ethoxylated bisphenol A dimethacrylate, ethoxylated bisphenol A diacrylate, tetraethylene glycol dimethacrylate, diethylene glycol dimetharylate, tetraethylene glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane triacrylate, and trimethylolpropane trimethacrylate.
- 3. A molding composition as defined in claim 1 wherein component (b) of the curable resin portion is one or more of the following: 2-hydroxyethyl acrylate, 2-hydroxyethyl methacryalte, hydroxypropyl acrylate, hydroxypropyl methacrylate, hydroxylbutyl acrylate, hydroxybutyl methacrylate, 2- aminoethyl acrylate, 2-aminoethyl methacrylate, 2-methylaminoethyl acrylate, 2-methylaminoethyl methacrylate, 2-dimethylaminoethyl acrylate, 2-dimethylaminoethyl methacrylate, 2-hydroxyethyl acrylamide, 2-hydroxyethyl methacrylamide, 2-aminoethyl acrylamide, 2-aminoethyl methacrylamide, diethylene glycol monoacrylate, diethylene glycol monomethacrylate, 2-methyoxyethyl acrylate, 2-methoxyethyl methacrylate, pentaerythritol monoacrylate, pentaerythritol monomethacrylate, glycerol monoacrylate, glycerol monomethylacrylate, trimethylolpropane monoacrylate, trimethylolpropane monomethacrylate, glycidyl acrylate, glycidyl methacrylate, and hydroxymethyl acrylamide.
- 4. A molding composition as defined in claim 1 wherein: component (a) of the resin portion is ethoxylated bisphenol A diacrylate, ethoxylated bisphenol A dimethacrylate, diethylene glycol diacrylate, diethylene glycol dimethacrylate, trimethylolpropane triacrylate or mixtures thereof; and component (b) is acrylic acid, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-methoxyethyl acrylate, hydroxypropyl acrylate, 2-dimethylaminoethyl acrylate, or mixtures thereof.
- 5. A molding composition as defined in claim 1 or 4 wherein the reinforcing fiber is fiberglass, carbon fibers, aromatic polyamide fibers or mixtures thereof.
- 6. A molding composition as defined in claim 5 wherein the reinforcing fiber is present in the composition in an amount from about 10 to about 75 weight percent.
- 7. A molding composition as defined in claim 1 wherein the curing initiator is a perester and/or perketal, or a mixture of peresters and/or perketals.
- 8. A molding composition as defined in claim 1 wherein the curing initiator is an azo and/or peroxide containing compound.
- 9. A molding composition as defined in claim 1 wherein the curing initiator is an azo compound and a perester and/or perketal.
- 10. A molding composition as defined in claim 1 which contains an acidic cure accelerator.
- 11. A molding composition as defined in claims 1, 7, 8, or 9 which contains an accelerator comprising a cobalt-containing compound.
Parent Case Info
This application is a continuation of prior U.S. application Ser. No. 545,605 filing date Oct. 27, 1983, now abandoned which is a continuation of application 279,448 filing date July 1, 1981 now abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
3950298 |
McCown et al. |
Apr 1976 |
|
4170582 |
Mori et al. |
Oct 1979 |
|
Foreign Referenced Citations (1)
Number |
Date |
Country |
49-94784 |
Nov 1972 |
JPX |
Continuations (2)
|
Number |
Date |
Country |
Parent |
545605 |
Oct 1983 |
|
Parent |
279448 |
Jul 1981 |
|