Claims
- 1. An article comprising a substrate and a cured coating or layer of a curable phosphazene composition provided on a surface of the substrate, the curable phosphazene composition comprising from 10 to 99.5 parts by weight of a curable phosphazene compound which is a compound as represented by the general formula (I): ##STR9## wherein a and b are real numbers, in which a is greater than 0 and b is equal to or greater than 1, provided, however, that a+b=2;
- n is 3 to 18;
- X is a group having a reactive double bond; and
- Y is a non-curable group;
- and from 0.5 to 90 parts by weight of a silicone-modified curable compound having a (meth)acrylate group.
- 2. An article as claimed in claim 1, wherein the silicone-modified curable compound is a compound which contains a silicone group and a (meth)acrylate group in one molecule.
- 3. An article as claimed in claim 1, wherein the silicone-modified curable compound is a silcione-modified urethane (meth)acrylate, a (meth)acrylooxysilane compound or a (meth)acrylate-modified polysiloxane.
- 4. An article as claimed in claim 1, wherein the silicone-modified curable compound is a silicone-modified (meth)acrylate as represented by the following general formula: ##STR10## (where s and t are each from 0 to 4,000;
- u is 10 to 1,000;
- w is 2 to 100;
- B is group derived from a diisocyanate compound;
- A is a residue obtainable from a hydroxy group-containing (meth) acrylate;
- R.sup.8 is a linear or branched alkylene group or a single bond;
- R.sup.9 and R.sup.10 are identical to or different from each other and each is methyl or a phenyl group);
- or a (meth)acrylate-modified polysiloxane or a (meth)acryloxysilane compound, as represented by the following general formula: ##STR11## (wherein R.sup.8, R.sup.9, s, t,u and w have the same meanings above;
- R.sup.11 is hydrogen atom or methyl; and
- x is 0 to 4,000).
- 5. An article as claimed in claim 1, wherein the curable phosphazene compound is contained in an amount ranging from 30 to 98 parts by weight and the silicone-modified curable composition is contained in an amount ranging from 2 to 70 parts by weight.
Priority Claims (1)
Number |
Date |
Country |
Kind |
1-107984 |
Apr 1989 |
JPX |
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Parent Case Info
This is a division of U.S. patent application Ser. No. 07/512,285 filed Apr. 20, 1990, now U.S. Pat. No. 5,180,090.
US Referenced Citations (4)
Foreign Referenced Citations (5)
Number |
Date |
Country |
0307861 |
Mar 1989 |
EPX |
59-2449 |
Jan 1984 |
JPX |
61-47406 |
Mar 1986 |
JPX |
63-241075 |
Oct 1988 |
JPX |
2032187 |
Jan 1990 |
JPX |
Non-Patent Literature Citations (1)
Entry |
Chemical Abstracts, vol. 95, No. 2, Jul. 13, 1981, p. 33, Abstract No. 8174s. |
Divisions (1)
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Number |
Date |
Country |
Parent |
512285 |
Apr 1990 |
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